• Proceedings of the KIEE Conference
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• 2008.10a
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• pp.131-132
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• 2008

We describe a fabrication method of submicron glass trenches which have embedded metal lines for the future application of nano-scale RF MEMS devices. The glass wafer was etched using two different conditions to identify the relationship between the slope of glass trenches and the slope of photroresist. A self-aligned metal photomask and negative photroresist (PR) slope were used to insert metal lines inside the glass trenches. The PR slope patterned by backside photolithography was affected by the profile of preformed glass trenches. Gold was well fabricated in the $0.7{\mu}m$ wide trench thanks to the negative PR slope. Nano-scale glass trenches with embedded metal lines can be used as a bottom electrode in submicron beam resonators operating with a high resonant frequency.

• Korean Journal of Optics and Photonics
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• v.14 no.3
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• pp.272-278
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• 2003

We studied patterned ITO layers of PDP thin films on glass substrates using spectroscopic ellipsometry. The optical property of ITO is expressed with the optical model based on two Lorentz oscillators. The effect of patterned ITO is calculated by taking the weighted average of reflectance in proportion to ITO coverage. The relative coverage of ITO is determined by using the model analysis of spectroellipsometric data. The difference of ITO coverage obtained by the best-fit model analysis of ellipsometric spectra to the expected one is critically examined and suggestions are made to minimize the observed discrepancy.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.10
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• pp.1598-1602
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• 2004

In this paper, we report a microthermostat using PDMS (poly-dimethylsiloxane) and glass. This PDMS/glass chip is able to maintain constant temperature that is necessary for restriction enzyme reaction. Since PDMS is the low-cost and the mass-producible material and has very good biochemical compatibility, PDMS chip has more benefit than general Si chip. Heater was made of Au wiring patterned on Pyrex glass. A reaction chamber has a capacity of about 3 ${mu}ell$. We performed a restriction enzyme reaction by using the fabricated microthermostat and conventional method. Then, with the electrophoresis, we made a comparison between the result from the micro reactor and the one from conventional method.

• Journal of Magnetics
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• v.10 no.2
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• pp.58-62
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• 2005

Periodic magnetic nanodot arrays were successfully produced on glass substrates by interference laser lithography and electron beam lithography methods. Magnetic force microscopy (MFM) observation was carried out on fabricated nanodot arrays. MFM tip induced magnetization effects were clearly observed in ferromagnetic elliptical nanodots varying in material and aspect ratio. Fe-Cr dots with a high aspect ratio show reversible switching of the single domain magnetization state. At the same time, Co nanomagnets with a low aspect ratio exhibit tip induced transitions between the single domain and the vortex state of magnetization. The simple nanolithography is potentially an efficient method for fabrication of patterned magnetic arrays.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.6
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• pp.288-292
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• 2009

Hydrophobic/hydrophilic patterned substrates were fabricated on a glass substrate by a liquid phase deposition (LPD) method. Hydrophobic surface was obtained by modifying ZnO thin films with a rough surface using a fluoroalkyltrimethoxysilane (FAS) and hydrophilic surface was prepared by decomposing FAS on an exposed to UV light. The hexagonal ZnO rods were perpendicularly grown by LPD method on glass substrates with a ZnO seed layer. The diameter and thickness of hexagonal ZnO rods were increased as a function of increases of immersion time. The surface morphology, thickness, crystal structure, transmittance and contact angle of prepared ZnO thin films were measured by field emission scanning electron microscopy (FE-SEM), X-ray diffraction (XRD), UV-visible spectrophotometer (UV-vis) and contact angle measurement. Hydrophilic ZnO thin films with a contact angle of $20^{\circ}{\sim}30^{\circ}$ were changed to a hydrophobic surface with a contact angle of $145^{\circ}{\sim}161^{\circ}$ by a FAS surface treatment. Prepared hydrophobic surface was pattered by an irradiation of UV light using shadow mask with $300\;{\mu}m$ or 3 mm dot size. Finally, the hydrophobic surface exposed to UV light was changed to a hydrophilic surface.

• Journal of the Microelectronics and Packaging Society
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• v.16 no.1
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• pp.27-31
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• 2009

In this paper, the polymer adhesive bonding technology using wafer-level technology was investigated and warpage results were analyzed. Si and glass wafer was bonded after adhesive polymer layer and dam pattern for uniform state was patterned on glass wafer. In this study, warpage result decreased as the low of bonding temperature of Si wafer, bonding pressure and height of adhesive bonding layer. The availability of adhesive polymer bonding was confirmed by TC, HTC, Humidity soak test after dicing. The result is that defect has not found without reference to warpage.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.41 no.6
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• pp.423-427
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• 2017

In this paper, an anchor design that improves bonding strength uniformity in the silicon-on-glass (SOG) process is presented. The SOG process is widely used in conjunction with electrode-patterned glass substrates as a standard fabrication process for forming high-aspect-ratio movable silicon microstructures in various types of sensors, including inertial and resonant sensors. In the proposed anchor design, a trench separates the silicon-bonded area and the electrode contact area to prevent irregular bonding caused by the protrusion of the electrode layer beyond the glass surface. This technique can be conveniently adopted to almost all devices fabricated by the SOG process without the necessity of additional processes.

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.487-490
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• 2004

In order to simulate OLED evaporation process, modeling of directional distribution of the vaporized organic materials, film thickness distribution profile and pattern-mask shadow effect are required In accordance with many literatures; all of them except shadow effect modeling are studied and developed. In this paper, modeling algorithm of evaporation shadow is presented for process simulation of full-color OLED evaporating system. In OLED evaporating process the offset position of the point cell-source against the substrate rotation axis and the usage of the patterned mask are the principal causes for evaporation shadow. For geometric simulation of shadow using z-map, the film thickness profile, which is condensed on a glass substrate, is converted to the z-map data. In practical evaporation process, the glass substrate is rotated. This physical fact is solved and modeled mathematically for z-map simulation. After simulating the evaporation process, the z-map data can present the shadow-effected film thickness profile. Z-map is an efficient method in that the cross-sectional presentations of the film thickness profile and thickness distribution evaluation are easily and rapidly achieved.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.300.2-300.2
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• 2013

Periodically shaped pillar-arrays and hole-arrays were fabricated on a Si wafer. Geometric features are similar in a periodic length of 4 ${\mu}m$ and a depth of 2 ${\mu}m$. For the hole-array patterns, positive PR processes were performed. UV exposed PR patterns were removed during a developing process to leave shapes of inversely replicated from a glass photomask. Meanwhile, negative PR processes were taken for the pillar-array patterns. UV exposed PR patterns were remained on a Si substrate having a same feature of patterns of a glass photomask. For an electrical aspect, a pillar structure has a short carrier-collection length resulting in the improved open-circuit voltage of 609 mV from 587 mV of a planar device. An improved performance may be achieved to reduce recombination loss along the patterning surface.

• Journal of the Semiconductor & Display Technology
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• v.16 no.4
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• pp.16-19
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• 2017

For the economical and environmental-friendly fabrication of polisher, Mo mask layer were sputtered on glass substrate instead of Cr mask material. Mo mask layers were sputtered by pulsed-DC sputtering and Photoresist patterns were formed on Mo mask layer for different develop times and optimized. After Mo mask layer were patterned and exposed glass was wet etched by HF solution for different etching times, the remaining Mo mask was stripped by using Al etchant. Develop time of 30 sec and HF wet etching time of 3 min were selected as optimized process condition and applied to the fabrication of polisher.