Various Dielectric Thick Films for Co-Integration of Passive and Active Devices by Aerosol Deposition Method (Aerosol Deposition Method에 의한 수동소자와 능동소자의 동시 직접화를 위한 다양한 유전체 후막)
-
- Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
- /
- 2008.06a
- /
- pp.348-348
- /
- 2008