• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.348-348
• /
• 2008

In recent, the concept of system-on-package (SOP) for highly integrated multifunctional systems has been paid attention to for the miniaturization and high frequency of electronic devices. In order to realize SOP, co-integration of passive devices, such as capacitors, resistors and inductors, and active devices should be achieved. If ceramic thick films can be grown at room temperature, we expect to be able to overcome many problems in conventional fabrication processes. So, we focused on the aerosol deposition method (ADM) as room temperature fabrication technology. ADM is a novel ceramic coating method based on the Room Temperature Impact Consolidation (RTIC) phenomena. This method has a wide range potential for fabrication of co-integration of passive and active devices. In this paper, I will present the future potential of ADM introducing various ceramic dielectric thick films for the integration of electronic ceramics.

• 태양에너지
• /
• 제7권2호
• /
• pp.106-110
• /
• 1987

In the past few years, the subject of passive heating has been the major area of our concern due to the specific climate conditions prevailing in our region. More recently, however, other important issues such as retrofitting, passive cooling, optimized integration of conservation and passive solar, and daylighting have emerged as the areas of frequent discussions. KIER, the sole R&D organization in solar energy technologies, has accomplished significant results in passive building designs and actual demonstrations of experimental passive buildings. As a result of such endeavor by KIER, the passive solar buildings have been very well received by the Korean public. The current number of passive solar buildings in Korea is well over 1,600 (as of Dec. 1986). In this paper, broad aspects of the present status of passive solar technology utilization in Korea are presented.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
• /
• pp.127-154
• /
• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
• /
• pp.861-863
• /
• 2003

In this work, the preparations and characteristics of capacitors and inductors for RF IC as a integrated devices are investigated. These kinds of capacitors and inductors can be applicable to the passive components utilized in voltage controlled oscillator(VCO), low noise amplifier(LAN), mixer and synthesizer for mobile telecommunication of radio frequency band(900 MHz to 2.2GHz), and in a library of monolithic microwave integrated circuit(MMIC). The results show that these inductors and capacitors array for RF IC may be applicable to the RF IC passive components for mobile telecommunication.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
• /
• pp.186-188
• /
• 2008

The wireless communication revolution has spawned a revival of interest in the design and optimization of radio transceivers. Radio transmit modules continue to shrink in die size and cost, requiring novel approaches for integration of the numerous passive elements of the radio front-end. A 3 dB Wilkinson power divider based on GaAs substrates, for DCS 1710-1880 MHz band was designed and fabricated showing excellent performance.

• Journal of Power Electronics
• /
• 제18권2호
• /
• pp.364-374
• /
• 2018

A novel passive lossless soft-switching single inductor dual buck full-bridge inverter (PLSSIDBFBI) is presented in this paper. To accomplish this, a passive lossless snubber circuit is added to a dual buck full-bridge inverter. Therefore, the advantages of the dual buck full-bridge inverter are included in the proposed inverter, and the inverter has just one filter inductor, which can decrease the system volume and improve the integration. In addition, the passive lossless snubber circuit achieves soft-switching by its own resonance, and all of the energy stored in the passive lossless snubber circuit can be transferred to load. A comparison between eight topologies is performed in this paper, and the analysis shows that the proposed soft-switching inverter topology has high reliability and efficiency. Finally, experimental results obtained with a 1 kW prototype verify the theoretical analysis and demonstrate the prominent characteristics of a reduced switching loss and improved efficiency.

• 대한전기학회:학술대회논문집
• /
• 대한전기학회 1998년도 추계학술대회 논문집 학회본부 B
• /
• pp.445-447
• /
• 1998

This paper shows simulation results for stability and performance of two INS/GPS integration systems. First, the code tracking error of GPS receiver is analyzed by spectrum analysis and simulated for the tight and loose INS/GPS integrations. Next, stability of the integrated systems are simulated using root locus method. As loop filter in the GPS receiver, passive filter and active filter are used and compared.

• KIEE International Transactions on Electrophysics and Applications
• /
• 제5C권4호
• /
• pp.176-179
• /
• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.139-142
• /
• 2001

As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

• 한국전기전자재료학회논문지
• /
• 제15권4호
• /
• pp.344-348
• /
• 2002

As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.