• KIEE International Transactions on Electrophysics and Applications
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• 제5C권4호
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• 마이크로전자및패키징학회지
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• 제9권2호
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• pp.55-60
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• 2002

전자제품의 경박단소화는 관련 부품들의 개별적인 소형화, 경량화 또는 여러 가지 부품들을 집적시켜 모듈화 시키는 것을 요구한다. 최근에는 실장밀도를 향상시키기 위하여 저항, 축전기, 인덕터 등의 수동소자들을 다층인쇄회로기판에 내장시키고자 하는 연구들이 널리 수행되고 있다. 본 고에서는 먼저 여러 가지 수동소자들의 기능을 살펴본 후, 수동소자들을 기판에 내장시키고자 하는 연구의 필요성과 이 기술을 상업화하기 위하여 앞으로 해결해야 할 문제들에 관하여 살펴보고자 한다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.861-863
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• 2003

In this work, the preparations and characteristics of capacitors and inductors for RF IC as a integrated devices are investigated. These kinds of capacitors and inductors can be applicable to the passive components utilized in voltage controlled oscillator(VCO), low noise amplifier(LAN), mixer and synthesizer for mobile telecommunication of radio frequency band(900 MHz to 2.2GHz), and in a library of monolithic microwave integrated circuit(MMIC). The results show that these inductors and capacitors array for RF IC may be applicable to the RF IC passive components for mobile telecommunication.

• Nuclear Engineering and Technology
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• 제51권3호
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• pp.676-682
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• 2019

After the Fukushima Daiichi accident, there has been an increasing preference for passive safety features in the nuclear power industry. Some passive safety systems require limited active components to trigger subsequent passive operation. Under very serious accident conditions, passive safety features could be rendered inoperable or damaged. This study evaluates (i) the performance and effectiveness of the passive safety features of iPOWER (innovative Power Reactor), and (ii) whether a severe accident condition could be reached if the passive safety systems are damaged, namely the case of heat exchanger tube rupture. Analysis results show that the reactor coolant system remains in the hot shutdown condition without operator actions or electricity for over 72 h when the passive auxiliary feedwater systems (PAFSs) are operable without damage. However, heat exchanger tube rupture in the PAFS leads to core damage after about 18 h. Such results demonstrate that, to enhance the safety of iPOWER, maintaining the integrity of the PAFS is critical, and therefore additional protections for PAFS are necessary. To improve the reliability of iPOWER, additional battery sets are necessary for the passive safety systems using limited active components for accident mitigation under such extreme circumstances.

• Journal of Advanced Marine Engineering and Technology
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• 제32권2호
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• pp.330-335
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• 2008

In this study, highly miniaturized short-wavelength transmission line employing periodically perforated ground metal (PPGM) structures were developed for application to miniaturized on-chip passive component on Si RFIC. The transmission line employing PPGM structure showed shorter wavelength and lower characteristic impedance than conventional coplanar-type transmission line. The wavelength of the transmission line employing PPGM structure was 57% of the conventional coplanar-type transmission line on Si Radio Frequency Integrated Circuit (RFIC) substrate. Basic characteristics of the transmission line employing PPGM structure were also investigated in order to evaluate its suitability for application to a development of miniaturized passive on-chip components. According to the results, it was found that the PPGM structure is a promising candidate for application to a development of miniaturized on-chip passive components on Si RFIC.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 1999년도 1st Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.127-154
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• 1999

Interconnect - Wire bonding-> Flip chip interconnect ; At research step, Au stud bump bonding seems to be more proper .Package -Plastic package-> $Z_{0}$ controlled land grid package -Flip Chip will be used for RF ICs and CSP for digital ICs -RF MCM comprised of bare active devices and integrated passive components -Electrical design skills are much more required in RF packaging .Passive Component -discrete-> integrated -Both of size and numbers of passive components must be reduced

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2002년도 하계학술대회 논문집
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• pp.135-138
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• 2002

VCO(Voltage Controlled Oscillator) is one of the main components governing the size, performance and power consumption of telecommunication devices. As the devices become much smaller, VCO need to have much smaller size with better characteristics. Buried type passive components of L,C,R were developed previously and the structure of these components are good for minimizing the size of VCO. Our own library of passive components is used in simulation and fabrication of VCO circuit, and surface mounted components like varactor diode are analysed using the measurement circuit designed by ourselves. Two-Dimensional simulation of VCO circuit and local three-Dimensional structure simulation are performed and their relation is obtained. In structure of multi-layered VCO, some components governing the characteristics of VCO are selected and placed on the top of oscillator for the good tuning process. In resonator part, the stripline structure and low loss glass/ceramic material are used to get higher Q value. In our research, a VCO oscillates in the 2.3∼2.36 GHz band is developed.

• KIEAE Journal
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• 제13권2호
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• pp.39-46
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• 2013

Recently, the field of construction is putting a variety of effort into reducing CO2, since global warming is being accelerated due to climate changes and the increase of greenhouse gas. For reduction of CO2 in the field of construction, it is required to make plans to cut down heating energy of buildings and especially, it is urgently needed to cut down energy of residential buildings in rural area where occupies the majority of consumption of petroleum-based energy sources. Therefore, this research compared and analyzed the actual energy consumption, by evaluating energy performance of a detached house applying passive house design components for reduction of energy. As the result, energy consumption showed remarkable differences, according to the operation of a heat recovery ventilation unit which is one of passive house design components, and building energy consumption displayed remarkable differences, too, depending on the difference of airtightness performance during building energy simulation conducted in process of design. Based on these results, the importance of airtightness performance of passive house was verified. The result of the actual measurement of energy consumption demonstrated that LNG was most economical amongst several heat resources yielded, on the basis of LPG source energy consumption measured within a certain period of time, and it was followed by kerosene. LPG was analyzed to have a low economic efficiency, when used for heating.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 하계종합학술대회 논문집
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• pp.199-202
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• 1999

In this paper, a possibility of building various types of RF passive components using the silicon micromachining technique has been examined with special emphasis on the wireless and mobile communication applications. Silicon micromachining technique is compatible with conventional silicon IC process and could provide a possibility of integrating base-band signal processing units and RF passive and active circuit components all in one silicon wafer rendering implementation of system-on-chip paradigm for future mobile and wireless communication systems.

• 한국운동역학회지
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• 제23권3호
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• pp.225-233
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• 2013

The purpose of this study was to estimate the potential injury via analyzing ground reaction force components that were resulted from a prolonged-run-induced fatigue. For the present study, passive and active components of the vertical ground reaction force were determined from time and frequency domain. Shear components of GRF also were calculated from time and frequency domain. Twenty subjects with rear foot contact aged 20 to 30, no experience in injuries of the extremities, were requested to run on the instrumented tread-mill for 160 minutes at their preference running speed. GRF signals for 10 strides were collected at 5, 35, 65, 95, 125, and 155 minute during running. In conclusions, there were no significant difference in the magnitude of passive force, impact load rate, frequency of the passive and active components in vertical GRF between running times except the magnitude of active force (p<.05). The magnitude of active force was significantly decreased after 125 minute run. The magnitude of maximum peak and maximum frequency of the mediolateral GRF at heel strike and toe-off have not been changed with increasing running time. The time up to the maximum peak of the anteroposterior at heel-strike moment tend to decrease (p<.05), but the maximum peak and frequency of that at heel and toe-off moment didn't depend significantly on running time.