• 제목/요약/키워드: Parylene-C

검색결과 33건 처리시간 0.022초

유기반도체용 고성능 박막 봉지재의 제조 및 평가 (Fabrication and Characterization of High-Performance Thin-Film Encapsulation for Organic Electronics)

  • 김남수
    • 대한기계학회논문집B
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    • 제36권10호
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    • pp.1049-1054
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    • 2012
  • 유기전자재료의 발전으로 박막화, 유연화, 경량화가 가능하면서, 저가의 생산비용으로 제조 될 수 있는 유기반도체의 개발 및 상용화에 대한 연구가 활발히 이루어지고 있다. 하지만, 유기반도체를 구성하는 유기재료 및 전극재료가 미량의 수분과 반응으로 성능이 저하되는 문제로 상용화의 큰 걸림돌이 되고 있다. 따라서 유기재료 및 전극을 동작환경의 수분으로부터 보호할 수 있는 고성능 투습 방지막 개발에 대한 연구가 많이 진행되고 있다. 본 연구에서는 $SiO_x$/parylene 및 $SiN_x$/parylene 구조를 이용한 다중 구조의 고성능 박막 봉지막을 개발하고, 개발된 박막을 Ca-corrosion test를 이용하여 수분투과율을 측정하였다. 또한 박막 봉지재를 유기태양전지에 적용하여 유기태양전지의 수명과 투습특성과의 관계를 확인하였다.

근골격계 통증질환의 진단과 치료를 위한 주사바늘형 복합온도 프로브의 개발 (Needle Type of Hybrid Temperature Probe for Both Diagnosis and Treatment of Musculoskeletal Pain Syndrome)

  • 남성기;김형일;변창호;이선규
    • 한국정밀공학회지
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    • 제31권4호
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    • pp.359-364
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    • 2014
  • This paper describes the development of needle type probe that measures temperature and injects medicine for both diagnosis and treatment of musculoskeletal pain syndrome (MPS). The size of trigger points is from several micrometers to millimeter. Therefore, it is required to develop a medical device that is capable of not only finding the trigger points by temperature measurement, but also injecting medicine at the exact location for treatment. To challenge these difficulties, thermocouple was fabricated on the surface of a needle using metal deposition process. Special type of stainless-constantan thermocouple was achieved from the stainless body of a needle itself and deposited constantan metal film. In particular, parylene coating enables to limit the temperature sensitive area to the end of the needle tip. Fabricated needle type probe produces $3.25mV/^{\circ}C$ of thermoelectric sensitivity and compared its performance with commercial T-type thermocouple in animal muscle sample.

A Polycrystalline CdZnTe Film and Its X-ray Response Characteristics for Digital Radiography

  • Kim, Jae-Hyung;Park, Chang-Hee;Kang, Sang-Sik;Nam, Sang-Hee
    • Transactions on Electrical and Electronic Materials
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    • 제4권5호
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    • pp.15-18
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    • 2003
  • The Cd$\_$1-x/Zn$\_$x/Te film was produced by thermal evaporation for the flat-panel X-ray detector. The crystal structure and the surface morphology of poly crystalline Cd$\_$1-x/Zn$\_$x/Te film were examined using XRD and SEM, respectively. The leakage current and X-ray sensitivity of the fabricated films were measured to analyze the X-ray response characteristic of Zn in a polycrystalline CdZnTe thin film. The leakage current and the output charge density of Cd$\_$0.7/Zn$\_$0.3/Te thin film were measured to 0.3 1nA/$\textrm{cm}^2$ and 260 pC/$\textrm{cm}^2$ at an applied voltage of 2.5 V/$\mu\textrm{m}$, respectively. Experimental results showed that the increase of Zn doping rates in Cd$\_$1-x/Zn$\_$x/Te detectors reduced the leakage current and improved the X-ray sensitivity significantly. The leakage current was drastically diminished by the formation of thin parylene layer in the Cd$\_$0.7/Zn$\_$0.3/Te detector.

고속시스템을 위한 새로운 단일칩 패키지 구조 (A Novel Chip Scale Package Structure for High-Speed systems)

  • 권기영;김진호;김성중;권오경
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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    • pp.119-123
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    • 2001
  • In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

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Polymer MEMS 공정을 이용한 의료용 미세 부품 성형 기술 개발 (Development of micro check valve with polymer MEMS process for medical cerebrospinal fluid (CSF) shunt system)

  • 장준근;박찬영;정석;김중경;박훈재;나경환;조남선;한동철
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2000년도 춘계학술대회 논문집
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    • pp.1051-1054
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    • 2000
  • We developed the micro CSF (celebrospinal fluid) shunt valve with surface and bulk micromachining technology in polymer MEMS. This micro CSF shunt valve was formed with four micro check valves to have a membrane connected to the anchor with the four bridges. The up-down movement of the membrane made the CSF on & off and the valve characteristic such as open pressure was controlled by the thickness and shape of the bridge and the membrane. The membrane, anchor and bridge layer were made of the $O_2$ RIE (reactive ion etching) patterned Parylene thin film to be about 5~10 microns in thickness on the silicon wafer. The dimension of the rectangular nozzle is 0.2*0.2 $\textrm{mm}^2$ and the membrane 0.45 mm in diameter. The bridge width is designed variously from 0.04 mm to 0.12 mm to control the valve characteristics. To protect the membrane and bridge in the CSF flow, we developed the packaging system for the CSF micro shunt valve with the deep RIE of the silicon wafer. Using this package, we can control the gap size between the membrane and the nozzle, and protect the bridge not to be broken in the flow. The total dimension of the assembled system is 2.5*2.5 $\textrm{mm}^2$ in square, 0.8 mm in height. We could precisely control the burst pressure and low rate of the valve varing the design parameters, and develop the whole CSF shunt system using this polymer MEMS fabricated CSF shunt valve.

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미세접촉프린팅 공정을 이용한 유연성 유기박막소자(OTFT)설계 및 제작 (Design and Fabrication of Flexible OTFTs by using Nanocantact Printing Process)

  • 조정대;김광영;이응숙;최병오
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2005년도 추계학술대회 논문집
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    • pp.506-508
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    • 2005
  • In general, organic TFTs are comprised of four components: gate electrode, gate dielectric, organic active semiconductor layer, and source and drain contacts. The TFT current, in turn, is typically determined by channel length and width, carrier field effect mobility, gate dielectric thickness and permittivity, contact resistance, and biasing conditions. More recently, a number of techniques and processes have been introduced to the fabrication of OTFT circuits and displays that aim specifically at reduced fabrication cost. These include microcontact printing for the patterning of metals and dielectrics, the use of photochemically patterned insulating and conducting films, and inkjet printing for the selective deposition of contacts and interconnect pattern. In the fabrication of organic TFTs, microcontact printing has been used to pattern gate electrodes, gate dielectrics, and source and drain contacts with sufficient yield to allow the fabrication of transistors. We were fabricated a pentacene OTFTs on flexible PEN film. Au/Cr was used for the gate electrode, parylene-c was deposited as the gate dielectric, and Au/Cr was chosen for the source and drain contacts; were all deposited by ion-beam sputtering and patterned by microcontact printing and lift-off process. Prior to the deposition of the organic active layer, the gate dielectric surface was treated with octadecyltrichlorosilane(OTS) from the vapor phase. To complete the device, pentacene was deposited by thermal evaporation and patterned using a parylene-c layer. The device was shown that the carrier field effect mobility, the threshold voltage, the subthreshold slope, and the on/off current ratio were improved.

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뇌척수액 션트를 위한 마이크로 전자력 펌프의 제작 (Fabrication of an Electromagnetic Micropump for Cerebrospinal Fluid Shunt)

  • Kim, Myung-Sik;Lee, Sang-Wook;Yang, Sang-Sik
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제51권12호
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    • pp.591-596
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    • 2002
  • This paper Presents the fabrication and test of a micropump that can be applied to an implantable cerebrospinal fluid shunt system for hydrocephalus patients The proposed micropump consists of a pair of corrugated parylene diaphragm chambers and a set of nozzle and diffuser. The electromagnetic force drives the diaphragms and pumps the fluid. The static or dynamic characteristics of the fabricated devices have been obtained experimentally. The site of the micropump is $14 \times 12 \times 8mm^3$. The flow rate increase by about $3 mell/h$ was observed in the operational pressure range the micropump.

차세대 반도체 소자용 저유전물질 개발과 현황

  • 최치규
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 1999년도 제17회 학술발표회 논문개요집
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    • pp.155-155
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    • 1999
  • 반도체 소자의 초고집적화와 고속화에 따라 최소 선폭이 급격히 줄어듬에 따라 현재 사용되고 있는 다층금속배선의 층간절연막 0.18$\mu\textrm{m}$ 급 이상의 소자에 적용할 경우 기생정전용량이 증가하여 신호의 지연 및 금속배선간에 상호간섭현상으로 반도체 소자의 동작에 심각한 문제가 대두되고 있다. 이러한 물제를 해결하기 위하여 nonoporous silica, fluorinated amorphous carbon, polyimides, poly(arylene)ether, parylene, AF4, poly(tetrafluoroethylene), divinyl siloxane bisbenzocyclobutene, Silk, 그리고 유무기 hybrid nanofoam 등이 저유전물질로 각광을 받고 있으며, 여기에 대한 연구가 우리나라를 비롯하여 미국, 일본 등에서 많은 연구가 이루어지고 있다. 따라서 본 연구에서는 2003년에 개발될 0.13$\mu\textrm{m}$급 이상의 차세대 반도체 소자에 적용될 수 있는 저유전물질 개발현황과 이들 물질 중 4GDRAM 급이상의 소자에 적용가능성이 가장 높은 유무기 hybrid nanofoam, a-C:F와 C:F-SiO2 박막에 대한 특성에 대하여 소개하고자 한다.

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Flexible Plastic ITO Substrates for OLED using Vapor-Polymerized Parylene C

  • Lee, Kyu-Chul;Choi, Soo-Hyun;Cho, Sung-M;Choi, Kang-Yong;Lee, Jung-Kyu
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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    • pp.973-974
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    • 2004
  • We report the fabrication of flexible plastic ITO substrates and the measurement of oxidant permeation through the substrates. The plastic ITO substrates are composed of multiple organic and inorganic thin films. The organic thin films are deposited by vapor polymerization and the inorganic films are deposited by ion beam sputtering. In order to estimate the oxidant permeation rate, the pure Ca film is formed on the substrates and the amount of CaO produced by the oxidation of Ca is measured.

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Hybrid Passivation for Organic-Thin Film Transistor on Plastic

  • Han, Seung-Hoon;Kim, Yong-Hee;Kim, Sung-Hoon;Kim, Chang-Hyun;Jeon, Tae-Woo;Lee, Sun-Hee;Choi, Min-Hee;Choo, Dong-Jun;Jang, Jin
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
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    • pp.979-982
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    • 2008
  • We studied hybrid passivation using parylene-C, metal, photoacyl and indium zinc oxide for pentacene OTFT to assure stability in subthreshold region. After the passivation, the changes in S and $V_{on}$ of OTFT were negligible and $I_{off}$ maintained its initial value of ${\sim}10^{-12}$ A. Therefore, the hybrid passivation is suitable for practical applications based on OTFT.

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