• Korean Chemical Engineering Research
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• v.58 no.2
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• pp.286-292
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• 2020

This study presents an angular-based measurement on three-dimensional paper-based analytical devices (3D-PADs) for quantitative detection of albumin without using an image analyzer. We demonstrate a simple quantitative and straightforward approach based on the angle of the discolored area as detection criteria. 3D-PADs are rapidly fabricated by the wax-printing and laminating process. The 3D-PADs are treated with citrate buffer and tetrabromophenol blue to react with albumin in a sample solution. Dropping sample solution into sample pad in the 3D-PAD, fluid flows toward the assay zone laterally and vertically by capillary action. We find that the change of angle of the discolored area correctly reflects the concentration of albumin and is reliable determinant for the measurement of the albumin concentration. It is the first demonstration of angular-based detection as a simple, inexpensive, and equipment-free approach for point-of-care diagnosis.

• Journal of Welding and Joining
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• v.17 no.2
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• pp.61-65
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• 1999

Because of the need for packages which accommodate high pin count, high density and high speed device, PBGA(plastic ball grid array) package gets more spotlight. But the substrate material which is used for PBGA package is in nature susceptible to moisture penetration. The objective of the study is to find out the path of delamination in the stacked structure of substrate. To increase the adhesion between the cooper laminate and PSR(photo solder resist) which is the weakest part, experiments were performed by changing parameters of printing pre-treatment and post-treatment process. As a result of experiments, the factor effects on the adhesion between the cooper laminate and PSR is caused by all of the pre-treatment and post-treatment condition. A considerable change was observed depending on the amount of UV irradiation after thermal cure which is typical of printing post-treatment condition rather than pre-treatment condition.

• ETRI Journal
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• v.37 no.2
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• ETRI Journal
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• v.37 no.3
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• pp.523-532
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• 2015

Recently, we have witnessed the gradual miniaturization of electronic devices. In miniaturized devices, flip-chip bonding has become a necessity over other bonding methods. For the electrical connections in miniaturized devices, fine-pitch solder bumping has been widely studied. In this study, high-volume solder-on-pad (HV-SoP) technology was developed using a novel maskless printing method. For the new SoP process, we used a special material called a solder bump maker (SBM). Using an SBM, which consists of resin and solder powder, uniform bumps can easily be made without a mask. To optimize the height of solder bumps, various conditions such as the mask design, oxygen concentration, and processing method are controlled. In this study, a double printing method, which is a modification of a general single printing method, is suggested. The average, maximum, and minimum obtained heights of solder bumps are $28.3{\mu}m$, $31.7{\mu}m$, and $26.3{\mu}m$, respectively. It is expected that the HV-SoP process will reduce the costs for solder bumping and will be used for electrical interconnections in fine-pitch flip-chip bonding.

• Journal of the Korean Society of Clothing and Textiles
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• v.42 no.4
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• pp.612-625
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• 2018

This study designed 16 kinds of basic structure and 4 kinds of modified structure for impact protection pads with a spacer fabric shape. The pad is a structure in which hexagonal three-dimensional units, composed of a surface layer and a spacer layer, are interconnected. Designed pads were printed with flexible $NinjaFlex^{(R)}$ materials using a FDM 3D printer. The printed pads were evaluated for impact protection performance, compression properties and sensory properties. The evaluation of the impact protection performance indicated that basic structures better than CR foam material at 20cm height were DV1.5, DX1.5, DX1.0, DV1.0 and HV1.5. The evaluation of the compression properties for the five types, with good results in the impact protection performance, indicated that DV1.0, DX1.0, DV1.5, HV1.5 and DX1.5 showed good results, respectively. The sensory evaluation of DV1.0, DX1.0, and DV1.5, which with good results when considering both the impact protection performance and the compression performance, showed that DV1.0 were the best for surface, flexibility, compression and weight. Therefore, DV1.0 is shown to be the best structure for protection pads.

• KSBB Journal
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• v.28 no.4
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• pp.254-259
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• 2013

Herein we present a diagnostic paper chip that can quantitatively detect albumin without external electronic reader and dispensing apparatus. We fabricated a diagnostic paper chip device by printing wax barrier on the paper and wicking it with citrate buffer and tetrabromophenol blue to detect albumin in sample solution. The paper chip is so simple that we dropped a sample solution at sample pad and measure the ratio of two travel distances of the sample solvent and albumin under the name of retention factor. Our result confirmed that the retention factor was constant in the samples with same concentration of albumin and useful determinant for the measurement of albumin concentration. The paper chip is affordable and equipment-free, and close to ideal point-of-care test in accordance with the assured criteria, outlined by the World Health Organization. We assume that this diagnostic paper chip will expand the concept of colorimetric determination and provide a inexpensive diagnostic method to aging society and developing country.

• Fashion & Textile Research Journal
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• v.24 no.4
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• pp.451-459
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• 2022

This study aimed to develop a a custom-made dress form for draping using a live model's 3D body scan obtained from an entry-level 3D handheld scanners, 3D modeling software and 3D printing technology. A female subject was recruited whose body size fell under the normal (N) body shape criteria suggested by KS K 0051. First, the handheld scanner reduced the length of the legs in scanning, but most of the scanning operations between the neck and crotch levels were conducted accurately. Therefore, this study was designed to develop a torso dress form. The full body 3D scan was edited into a torso shape using ZBrush® software. Using Rhinoceros^® and Materialise's Magics software, a 3D body scan was modeled so that the user could fit two types of mannequin stands (one with a neck fixation from above and one with an insert from below) to the dress form. The body scan was divided into 9 pieces to fit the printable size of the Stratasys 3D printer Fortus 250mc, and the cross-sectional distance from the center to the periphery was downsized by 2 mm. After outputting the dress form scan file with a 3D printer, the dress form was manufactured by the first covering it with a 4 oz nonwoven pad and the second covering with a single jersey material.

• Fashion & Textile Research Journal
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• v.25 no.4
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• pp.497-507
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• 2023

This study measured the effect 3D printing products comprised of different materials and shapes on heat transfer in clothing to derive fundamental data on thermal comfort among clothing comfort. The variables were three types of material (EVA foam, TPU-10%, TPU-10%+EVA), two types of shape (without holes, with holes), and two types of covers(without cover, with cover). All samples (12 types) prepared by combining these variables were placed on the hot plate set at 36℃, and the surface temperature was measured at three points for 10 minutes. The surface temperature change was dependent on the material, shape, and cover of the sample. The sample printed with TPU exhibited higher temperature transfer compared to the EVA foam sample after 10 mins. In addition, the temperature transfer was better when there were holes, and rate decreased when the sample was covered with fabric. We confirmed that material selection of the pad and thermal conductivity of the cover are extremely important in solving thermal stress to the human body caused by functional clothing with protectors. Additionally, as the protector, it is recommended to design the outer shell with a passage, such as a hole, to allow the rapid transfer of heat to the external environment.

• Journal of the Korean Society of Clothing and Textiles
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• v.46 no.4
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• pp.657-671
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• 2022

This study aims to develop three dimensional (3D) yoga knee protectors that provide excellent wearing comfort. Three types of pads were modeled using 3D human data: two types of 3.0-cm-wide pads separated into top and bottom with thicknesses of 0.1 cm (TPU-1: A) and 0.2 cm (TPU-2: B); and one type with three 0.2-cm-thick separated panels (TPU-S: C). Based on these models, five knee protectors were developed using 3D patterning and 3D printing. Types A, B, and C were integrated with 0.6-cm neoprene pads. Type D was fabricated with a donut-shaped 0.6-cm neoprene pad inserted, while Type E consisted of two discrete 0.6-cm neoprene pads embedded in the protector's upper and lower sides. Wearing comfort was evaluated in terms of fit, pressure, and cushioning while in a standing and kneeling position and while in motion. The findings suggest that the fabricated knee protectors were evaluated as comfortable to the individuals with knee pain, rather than those without knee pain. The individuals with knee pain preferred the soft pads made of neoprene positioned around the knee (NEO-S: E), while those without knee pain favored the cushioned pads with a pattern structure maintained by thin 3D-printed pads (TPU-1: A).

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.