• Title/Summary/Keyword: Packaging software

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Purchasing Patterns and Influential Factors for Bakery Products and Effects of Brand Image on Consumers' Purchasing Power - Focused on Customers in Seoul - (베이커리 제품의 구매 성향 및 영향 요인과 브랜드 이미지가 소비자 구매력에 미치는 영향 - 서울 지역을 중심으로 -)

  • Na, Sung-Joo;Hwang, Seong-Yun;Kang, Kun-Og
    • Journal of the East Asian Society of Dietary Life
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    • v.21 no.3
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    • pp.429-437
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    • 2011
  • This study evaluated on the purchasing patterns for bakery products and the effects of brand image on consumers' purchasing power while living in the Seoul area. The questionnaires developed for this study were distributed to 400 males and females aged 20 and older. A total of 385 questionnaires were used for analysis (96.0%) and the statistical analysis, descriptive analysis, and $x^2$-test were completed using SPSS (version 14.0) software. When purchasing bakery products, 'taste' (59.7%) was most important followed by 'shape and size' (13.2%), 'ingredients' (11.7%), 'price' (7.5%), 'expiration date' (5.2%). 'origin of ingredients' (2.1%), and 'packaging' (0.5%). Subject showed significant differences in their purchase of bakery products based on characteristics including 'age' (p<0.05), 'occupation' (p<0.01), 'type of family' (p<0.01), and 'income' (p<0.1) The most influential factor in purchasing bakery products was 'material' (score=3.73), followed by 'name value' (score=3.56). Brand image of bakery had an effect on bakery products as 'present' (score=3.83), 'sanitation' (score=3.58). And, the most high respondent in basis of deciding brand image consumer's was 'clean and nice interior'(53.1%), followed by 'high quality ingredients and packaging'(23.7%).

An Analysis of Screen Printing using Solder Paste (솔더 페이스트를 이용한 스크린 프린팅 공정 해석)

  • Seo, Won-Sang;Min, Byung-Wook;Kim, Jong-Ho;Lee, Nak-Kyu;Kim, Jong-Bong
    • Journal of the Microelectronics and Packaging Society
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    • v.17 no.1
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    • pp.47-53
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    • 2010
  • In this study, analyses on the stencil printing using solder paste were carried out. The key design parameters in the stencil printing process are printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of physical properties of solder paste such as viscosity, surface tension, and contact angle on the stencil printing process were investigated. The analyses were performed for simple geometry and boundary conditions. In the analysis, solder paste was pushed into a stencil hole by pressure instead of printer pad. Considering the geometry and computational efficiency, axisymmetric analyses were adopted. A commercial software (COMSOL), which is well known in the area of micro-fluids analysis, was used. From the results, it was shown that viscosity of solder paste had an effect on the filling speed, while surface tension and contact angle had an effect on the filling shape.

Simulation of Horizontal Thin-film Thermoelectric Cooler for the Mobile Electronics Thermal Management (모바일 전자기기의 열점 제어를 위한 수평형 박막 열전 냉각 소자의 모사 해석)

  • Park, Sangkug;Park, Hong-Bum;Joo, Young-Chang;Joo, Youngcheol
    • Journal of the Microelectronics and Packaging Society
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    • v.24 no.2
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    • pp.17-21
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    • 2017
  • Horizontal thin-film thermoelectric cooler has been simulated using a commercial software (ANSYS Workbench Thermal-electric). The thermoelectric cooler consists of thin-film n-type $Bi_2Te_3$, p-type $Sb_2Te_3$ thermoelectric elements, and Au electrode, respectively. The hot spot was placed under the center of device which represents Joule heating. Numerical analysis was conducted by geometric variable, and a maximum temperature difference of $13^{\circ}C$ was obtained. As from the simulation parameters, we presented an optimized design for high efficiency cooling.

Measured Return Loss and Predicted Interference Level of PCB Integrated Filtering Antenna at Millimeter-Wave

  • Lee Jae-Wook;Kim Bong-Soo;Song Myung-Sun
    • Journal of electromagnetic engineering and science
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    • v.5 no.3
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    • pp.140-145
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    • 2005
  • In this paper, an experimental investigation for return loss and a software-based prediction for interference level of single-packaged filtering antenna composed of dielectric waveguide filter and PCB(Printed Circuit Board) slot antenna in transceiver module have been carried out with several different feeding structures in millimeter-wave regime. The implementation and embedding method of the existing air-filled waveguide filters working at millimeter-wave frequency on general PCB substrate have been described. In a view of the implementation of each components, the dielectric waveguide embedded in PCB and LTCC(Low Temparature Co-fired Ceramic) substrates has employed the via fences as a replacement with side walls and common ground plane to prevent energy leakage. The characteristics of several prototypes of filtering antenna embedded in PCB substrate are considered by comparing the wideband and transmission characteristics as a function of bent angle of transmission line connecting two components. In addition, as an essential to the packaging of transceiver module working at millimeter-wave, miniaturization technology maintaining the performances of independent components and the important problems caused by integrating and connecting the different components in different layers are described in this paper.

Wafer Level Package Design Optimization Using FEM (공정시간 및 온도에 따른 웨이퍼레벨 패키지 접합 최적설계에 관한 연구)

  • Ko, Hyun-Jun;Lim, Seung-Yong;Kim, Hee-Tea;Kim, Jong-Hyeong;Kim, Ok-Rae
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.23 no.3
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    • pp.230-236
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    • 2014
  • Wafer level package technology is added to the surface of wafer circuit packages to create a semiconductor technology that can minimize the size of the package. However, in conventional packaging, warpage and fracture are major concerns for semiconductor manufacturing. We optimized the wafer dam design using a finite element method according to the dam height and heat distribution thermal properties. The dam design influences the uniform deposition of the image sensor and prevents the filling material from overflowing. In this study, finite element analysis was employed to determine the key factors that may affect the reliability performance of the dam package. Three-dimensional finite element models were constructed using the simulation software ANSYS to perform the dam thermo-mechanical simulation and analysis.

Concept Car Development using Personal Digital Design Process based on Engineering Technology (공학 기술 기반 개인 디지털 디자인 프로세스를 적용한 컨셉카 개발)

  • Maeng, Joo-Won;Cho, Chong-Du
    • Transactions of the Korean Society of Automotive Engineers
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    • v.18 no.5
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    • pp.9-19
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    • 2010
  • Every car manufacturer desires to reduce the new car development time spent in improving the safety, NVH, lightweight, reliability and environment friendly features of the car. Other considerations such as planning, exterior and interior styling, packaging, color, and material selection increase the complexity of the car design process. This paper proposes a personal DDP (Digital Design Process) to utilize the engineering analysis and design/styling software for car design. DDP can be efficiently used by a team of car research center or a studio with small number of engineers, helping ordinary engineers becoming ambidextrous in design as well as engineering applications. The concept model starts from idea sketch, rendering, and 3D surface model with CAS (Computer Aided Styling) to the final safety estimation by using proposed DDP based on engineering technology (CAD, CAE). The concept model proposed a hydrogen fuel cell sports coupe which could be available within next 10 years. The proposed DDP can not only reduce the new car development time but also be adapted into designing of varied products such as aircraft, yacht, electrical equipment and sports gear.

Ball Grid Array Solder Void Inspection Using Mask R-CNN

  • Kim, Seung Cheol;Jeon, Ho Jeong;Hong, Sang Jeen
    • Journal of the Semiconductor & Display Technology
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    • v.20 no.2
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    • pp.126-130
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    • 2021
  • The ball grid array is one of the packaging methods that used in high density printed circuit board. Solder void defects caused by voids in the solder ball during the BGA process do not directly affect the reliability of the product, but it may accelerate the aging of the device on the PCB layer or interface surface depending on its size or location. Void inspection is important because it is related in yields with products. The most important process in the optical inspection of solder void is the segmentation process of solder and void. However, there are several segmentation algorithms for the vision inspection, it is impossible to inspect all of images ideally. When X-Ray images with poor contrast and high level of noise become difficult to perform image processing for vision inspection in terms of software programming. This paper suggests the solution to deal with the suggested problem by means of using Mask R-CNN instead of digital image processing algorithm. Mask R-CNN model can be trained with images pre-processed to increase contrast or alleviate noises. With this process, it provides more efficient system about complex object segmentation than conventional system.

Drug distribution management system based on IoT

  • Liu, Zeliang;Zhang, Chunmei;Peng, Hui;Xu, Qin;Gao, Yubao
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.16 no.2
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    • pp.424-444
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    • 2022
  • In hospitals and pharmacies, the distribution of medicines is an important part. Any mistakes, misses, fake medicines and expired medicines can cause medical accidents. With the widespread application of the Internet of Things technology (IoT), traditional drug distribution methods need to be upgraded. This article proposes a drug distribution management scheme based on the Internet of Things technology. In the production of drugs, a flexible RFID tag was printed on the packaging box, which stored a series of information such as drug name, dosage, raw materials, efficacy, production date, expiration date, and manufacturer. The use of a drug distribution management system combined with RFID readers can identify drug information and effectively prevent the occurrence of erroneous, missed, counterfeit, and expired drugs. It can also improve management efficiency, reduce management costs, and control management risks. Through the circuit design and software system development, the test results show that this solution is effective and feasible, the proposed method can achieve the expected results.

Conception and Modeling of a Novel Small Cubic Antenna Design for WSN

  • Gahgouh Salem;Ragad Hedi;Gharsallah Ali
    • International Journal of Computer Science & Network Security
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    • v.24 no.2
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    • pp.53-58
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    • 2024
  • This paper presents a novel miniaturized 3-D cubic antenna for use in wireless sensor network (WSN) application. The geometry of this antenna is designed as a cube including a meander dipole antenna. A truly omnidirectional pattern is produced by this antenna in both E-plane and H-plane, which allows for non-intermittent communication that is orientation independent. The operating frequency lies in the ISM band (centered in 2.45 GHz). The dimensions of this ultra-compact cubic antenna are 1.25*1.12*1cm3 which features a length dimension λ/11. The coefficient which presents the overall antenna structure is Ka=0.44. The cubic shape of the antenna is allowing for smart packaging, as sensor equipment may be easily integrated into the cube hallow interior. The major constraint of WSN is the energy consumption. The power consumption of radio communication unit is relatively high. So it is necessary to design an antenna which improves the energy efficiency. The parameters considered in this work are the resonant frequency, return loss, efficiency, bandwidth, radiation pattern, gain and the electromagnetic field of the proposed antenna. The specificity of this geometry is that its size is relatively small with an excellent gain and efficiency compared to previously structures (reported in the literature). All results of the simulations were performed by CST Microwave Studio simulation software and validated with HFSS. We used Advanced Design System (ADS) to validate the equivalent scheme of our conception. Input here the part of summary.

RRP Loading Patterns and Standard Dimensions for Block Pattern in Membership Wholesale Clubs (Membership Wholesale Club에서의 RRP 적재패턴 및 블록패턴 표준규격에 관한 연구)

  • Jung, Sung-Tae;Han, Kyu-Chul
    • Journal of Distribution Science
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    • v.13 no.7
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    • pp.41-51
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    • 2015
  • Purpose - This study analyzes loading efficiency by loading pattern for package standardization and reduction of logistics costs, along with the creation of revenue for the revenue review panel (RRP) of Membership Wholesale Clubs (MWC). The study aims to identify standard dimensions that can help improve the compatibility of the pallets related to display patterns preferred by the MWC and thereby explore ways to enhance logistics efficiency between manufacturers and retailers through standardization. Research design, data, and methodology - The study investigates and analyzes the current status based on actual case examples, i.e., manufacturer A and Korea's MWC (A company, B company, and C company), and thus devises improvement measures. To achieve this, the case of manufacturer A delivering to MWC was examined, and the actual pallet display patterns for each MWC were investigated by visiting each distribution site. In this study, TOPS (Total Optimization Packaging Software, USA) was used as the tool for pallet loading efficiency simulations the maximum allowable dimension was set to 0.0mm to prevent the pallet from falling outside the parameters, and the loading efficiency was analyzed with the pallet area. In other words, the study focused on dimensions (length x width x height) according to the research purpose and thereby deduced results. Results - The analysis of pallet loading patterns showed that the most preferred loading patterns for loading efficiency according to product specification, such as pinwheel, brick, and block patterns, were used in the case of the general distribution products, but the products were configured with block patterns in most cases when delivered to MWCs. The loading efficiency by loading pattern was analyzed with respect to 104 nationally listed standard dimensions. Meanwhile, No.51 (330 × 220mm) of KS T 1002 (1,100 × 1,100mm) was found to be the dimension that could bring about an improved loading efficiency, over 90.0% simultaneously in both the T-11 and T-12 pallet systems in a loading pattern configuration with the block pattern only, and the loading efficiency simulation results also confirmed this as the standard dimension that can be commonly applied to both the T-11 pallet (90.0%) and the T-12 pallet (90.7%) systems. Conclusions - The loading efficiency simulation results by loading pattern were analyzed: For the T-11 pallet system, 17 standard dimension sizes displayed the loading efficiency of 90.0% or more as block patterns, and the loading capacity was an average of 99.0%. For the T-12 pallet system, 35 standard dimension sizes displayed the loading efficiency of more than 90% as block patterns (the average loading efficiency of 98.6%). Accordingly, this study proposes that the standard dimensions of 17 sizes with the average loading efficiency of 99.0% should be applied in the use of the T-11 pallet system, and those of 35 sizes with the average loading efficiency of 98.6% should be reviewed and applied in the use of the T-12 pallet system.