• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.109-114
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• 2002

The adhesion of electroless plated Ni layer on Al/Si substrates has been investigated. The zincating treatment was conducted with a conventional method and a modified method. In a modified method, ultrasonic agitation was applied during zincating. Adhesion strength was evaluated by a pull-off test. The ultrasonic agitation during zincating increased the nucleation density of Zn particles and refined Zn particle size. the adhesion strength of electroless Ni layer deposited on the modified zincated surface was higher than that on the conventionally zincated surface. the improvement of adhesion was attributed to the fine and dense Zn particles.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.151-156
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• 2001

Using the photoimageable thick film conductors, $25\mu\textrm{m}$ line widths and $25\mu\textrm{m}$ spaces can be obtained. Test patterns are made by green tape lamination, paste printing, exposing to UV light, developing in an aqueous process and cofiring. Postfiring method using alumina substrate can be also applied to fine line formation. Series gap resonator formed by photopatterning process showed the improved signal transmission characteristics compared to that obtained by conventional screen printing.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.89-110
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• 2005

A new 3D integration technology using wafer-to-wafer and chip-to-wafer stacking method was described. It was demonstrated that 3D microprocessor, 3D shared memory, 3D image processing chip and 3D artificial retina chip fabricated using 3D integration technology were successfully operated. The possibility of applying 3D image processing chip and 3D artificial retina chip to Robot's eye was investigated. The possibility of implanting 3D artificial retina chip into human eye was investigated.

• 월간포장계
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• 통권217호
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• pp.80-88
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• 2011

바이오 플라스틱, 에코패키징, 인체 무해성 관련하여 국내외적으로 다양한 규격 및 시험방법이 있다. 생분해 플라스틱 규격기준은 국제규격인 ISO 14855를 기준으로 국가별로 자국내 규격기준이 제정되어 있고, 이에 따른 인증마크를 시행하고 있다. 최근에 산업화가 급속하게 추진되고 있는 바이오매스 플라스틱 관련한 규격 기준은 미국, 일본을 중심으로 시행이 되고 있다. 그 외에도 GR마크, 녹색 인증, 단체 규격 인증, 회사 등이 자체적으로 만든 규격 기준 등이 다양하게 시행되고 있다.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.861-864
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• 1997

Singulation is a process that cutting for separating a chip individually after finishing packaging process(micro BGA etc.). For shortening the process of singulation, we proposed the singulation using multi-blade. This paper introduced a method of multi-blade singulation and investigated a result of application and problems. The efficiency of singulation process was improved five times better than the single-blade by the singulation using Multi-blade.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.259-263
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• 2002

We design and characterize a millimeter-wave ceramic package in a frequency range from DC to 300Hz using the FEM(Finite Element Method) calculation. From these calculation results, the designed feed-through structure achieved 0.32 dB, 16.8 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.137-142
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• 2002

This paper deals with the stress singularity induced at the interface corner between the elastic substrate and the viscoelastic thin film as the polymeric film absorbs moisture from the ambient environment. The boundary element method is employed to investigate the behavior of Interface stresses. The order of the singularity is obtained numerically for a given viscoelastic model. It is shown that the stress singularity factor is relaxed with time, while the order of the singularity increases with time for the viscoelastic model considered.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.147-151
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• 2002

We fabricated and characterized a millimeter-wave ceramic package in a frequency range from 6 to 40㎓ using the LTCC(Low Temperature Cofired Ceramic) Technology and TRL(Thru-Reflect-Line) calibration method. From these measurement results, the fabricated feed-through structure achieved 0.5 dB, 14 dB of the insertion loss and the return loss at 30 GHz respectively. This ceramic package will be useful for MMIC(Monolithic Microwave Integrated Circuit) modules.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.173-176
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• 2002

본 논문에서는 파워 아일랜드(power island)에서 발생되는 잡음 전달을 개선하는 방법에 대해서 연구하였다. 일반적으로 파워 아일랜드는 각 파워 버스(power bus)의 구조적 공진에 의해 잡음 전달이 증가하는 단점이 있다. 따라서 본 논문에서는 두 가지의 잡음 전달 개선 방법을 제시하였다. 첫 번째로 잡음원의 위치를 변화시킴으로서 구조적 공진을 억제하였다. 두 번째로 공진이 발생할 경우 잡음 전달을 감소시키기 위해서 EGI(Elevated Ground Island)를 제안하였다. 해석결과, 잡음원의 위치에 따라 파워 버스의 공진을 최소로 감소시켰으며, EGI를 이용하여 잡음 전달을 효과적으로 감소할 수 있었다.