• 한국건설관리학회논문집
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• 제1권4호
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• pp.82-90
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• 2000

낙후된 국내 건설관리기술을 선진화$\cdot$합리화하기 위한 방안 중의 하나로 공정-공사비 통합관리가 많은 주목을 받고 있다. 정부에서도 공정과 공사비의 통합관리의 필요성을 인식하고 이의 도입을 적극검토하고 있다 실제로 해외공사를 통해서 양성된 국내 공정관리 전문가들의 노력으로 최근 일부 공공기관의 건설사업에서는 공정-공사비 통합관리를 부분적으로 활용하고 있는 상황이다. 그러나 그 기법 및 전산모델이 이론에 국한된 것이거나 국내의 특수한 여건을 수용하지 못하는 것이 대부분이기 때문에 활용에 많은 어려움이 있으며 국내 건설환경에 완전하게 정착되지 못하고 있다. 본 연구의 목적은 통합관리의 정착을 지연시키는 국내의 특수한 여건 및 문제점을 파악하고 이를 토대로 국내 건설현장에서 적용할 수 있도록 공정-공사비 통합모델의 개선방안을 제시하는 것이다.

• 유통과학연구
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• 제11권8호
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• pp.15-23
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• 2013

Purpose - This is a case study aimed at finding a solution for improving the pallet loading efficiency in the process of delivering products through a transshipment using the T-11 and T-12 pallet systems. The study proposes a solution by demonstrating the case of a certain manufacturer A, who aims to reduce the logistics cost by using packaging sizes that are commonly applicable and can improve the compatibility between the T-11 pallet system, designated as the standard pallet in Korea, and the T-12 pallet system, which is commonly used in other foreign countries. The use of common sizes increases compatibility among the two systems and reduces both logistics and environmental costs. Thus, this case study calculates the quantitative benefits of applying common packaging sizes to improve the compatibility between the T-11 and T-12 pallet systems. These systems are considered to be the most important and widely used transportation systems in the global logistics industry. Research design, data, and methodology - This study examined manufacturer A's representative product and delivery system and assessed how manufacturer A was affected by the use of incompatible packaging sizes in the T-11 (1100 mm×1100 mm) and T-12 (1200mm×1000 mm) pallet systems, which were specified in the KS T 1002 standard. In addition, this study analyzed the impact of these packaging sizes on A's logistics cost. The TOPS program (Total Packaging System) was used to simulate pallet loading efficiency,and the main parameter studied was volume, as calculated from length, width, and height. Results - When the sizes of secondary packaging were not compatible across the T-11 and T-12 pallet systems, a reduction in loading efficiency was observed, leading to an increase in logistics cost during transshipment. Such low loading efficiencies led to a further loss of efficiency in transportation, storage and unloading. This may have a possible environmental impact with high social expenses, such as increased CO₂ emissions. Hence, this study proposed that the KS T 1002 standard be amended to include 21 packaging sizes, including 7 sizes of the 600 mm×500 mm category, which are compatible with both the T-11 and T-12 pallet systems. Conclusions - This study found that the 69 standard sizes under the T-11 pallet system and the 40 standard sizes under the T-12 system in the KS T 1002 standard can be simplified and reduced to 21 mutually compatible packaging sizes, enabling logistics standardization and reducing national-level logistics costs. If the government pays attention to this study and considers the standardization of common sizes for the T-11 and T-12 pallet systems and amends the KS T 1002 standard, this study will deliver practical value to the global logistics industry, apart from being of academic significance.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.9-17
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• 2017

In these days, MEMS (micro-electro-mechanical system) devices become the crucial sensor components in mobile devices, automobiles and several electronic consumer products. For MEMS devices, the packaging determines the performance, reliability, long-term stability and the total cost of the MEMS devices. Therefore, the packaging technology becomes a key issue for successful commercialization of MEMS devices. As the IoT and wearable devices are emerged as a future technology, the importance of the MEMS sensor keeps increasing. However, MEMS devices should meet several requirements such as ultra-miniaturization, low-power, low-cost as well as high performances and reliability. To meet those requirements, several innovative technologies are under development such as integration of MEMS and IC chip, TSV(through-silicon-via) technology and CMOS compatible MEMS fabrication. It is clear that MEMS packaging will be key technology in future MEMS. In this paper, we reviewed the recent development trends of the MEMS packaging. In particular, we discussed and reviewed the recent technology trends of the MEMS bonding technology, such as low temperature bonding, eutectic bonding and thermo-compression bonding.

• 마이크로전자및패키징학회지
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• 제21권2호
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• pp.23-29
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• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• 마이크로전자및패키징학회지
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• 제26권4호
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• pp.7-13
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• 2019

Power module is getting attention from electronic industries such as solar cell, battery and electric vehicles. Transient liquid phase (TLP) boding, sintering with Ag and Cu powders and wire bonding are applied to power module packaging. Sintering is a popular process but it has some disadvantages such as high cost, complex procedures and long bonding time. Meanwhile, TLP bonding has lower bonding temperature, cost effectiveness and less porosity. However, it also needs to improve ductility of the intermetallic compounds (IMCs) at the joint. Wire boding is also an important interconnection process between semiconductor chip and metal lead for direct bonded copper (DBC). In this study, TLP bonding using Sn-based solders and wire bonding process for power electronics packaging are described.

• 골판지포장물류
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• 제3권13호
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• pp.70-71
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• 1996

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.59-78
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• 2004

• 골판지포장물류
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• 제5권22호
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• pp.128-131
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• 1998

• 월간포장계
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• 통권103호
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• pp.172-179
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• 2001

• 골판지포장물류
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• 제4권19호
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• pp.133-136
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• 1997