• Fashion & Textile Research Journal
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• v.25 no.3
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• pp.333-345
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• 2023

The rising demand for fashion do-it-yourself (DIY) products that cater to individual preferences and which allow for creative expression has highlighted the need for systematic organization within the clothing society. This study addresses this gap by identifying and discussing clothing DIY packages and proposes a systematic package model comprising essential raw materials, commercial patterns, and production instructions. Four key elements have been emphasized to differentiate and enhance the product. Firstly, highly practical commercial patterns have been developed to facilitate easy transformations - from blouses to dresses. Furthermore, the versatility of these patterns has been optimized so as to allow their utilization as outerwear, increasing their efficiency. Secondly, to accommodate diverse body shapes, the package offers six different sizes, providing users with a range of options tailored to their specific measurements. Thirdly, detailed production instructions are provided, supplemented by a Q&A bulletin board. The instructions are available in a printed format, featuring actual photographs on A4 paper, while video production instructions are accessible via a QR code, ensuring comprehensive guidance. Lastly, the basic package comprises clothing patterns, production instructions, fabrics, and labels, providing a complete toolkit for clothing DIY enthusiasts. This study aims to contribute to the development of the hobby sewing field and to establish a practical resource for the clothing DIY package industry.

• Journal of Digital Convergence
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• v.19 no.1
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• pp.373-378
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• 2021

This study is a study on user experience design of Meal Kit product information. The purpose of this study is to derive the product information necessary for the purchaser and the necessity for the convenience of use, and to propose an improvement plan. When purchasing Meal Kit products, two types of domestic Meal Kit brands, Peacock and Fresheasy, were compared and analyzed for information on nutrition intake, package design, and environmental issues. As a research method, a questionnaire survey was conducted by deriving 7 factors for purchasing Meal Kit products through literature research and prior research. Proceeded. As a result of the study, the factors that satisfy buyers were in the order of cooking process, food, taste/nutrition, package, convenience, price, and information, and overpacking was also revealed as a problem. Through this, it was possible to derive improvements and develop plans for the Meal Kit product. It is expected that this study will help improve the dietary life of One person households and develop Meal Kit products in the future.

• International Journal of Advanced Culture Technology
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• v.11 no.3
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• pp.163-171
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• 2023

A blind box is a kind of sales method in that you can only get the product information by opening the package. In 2019, blind box products began to grow rapidly in the Chinese market, and gradually formed a special "blind box economy". The particularity of blind box products is that driven by consumers' curiosity, consumers' purchasing behavior can be directly induced by the visual and tactile perception of commodity packaging. Therefore, it is necessary to explore the psychological needs of consumers and master the blind box packaging design elements under the influence of consumer psychology. This paper takes figurine blind box packaging elements as the research scope and Chinese blind box consumers as the research object. Through market research and literature study, We are designed to conduct a questionnaire survey and SPSS empirical study to find out the differences in the preferences of different consumer temperament types for blind box packaging, taking the characteristics of blind box products and consumer psychology as the relevant theoretical background. The research results show that among the blind box consumers, choleric type consumers predominate, the color of the blind box packaging presents red, orange, and yellow preference, and the material presents metal, and plastic preference. The shape of the blind box shows a preference for special shape.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.3
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• pp.1414-1423
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• 2014

This paper aims to analyze destination composition patterns included in package products and to identify the characteristics of the tourism destinations through social network analysis using data collected from tour packages distributed by major Korean travel agencies, targeting Singapore as a key destination. Such tour package data were transcribed into data matrix using Pajek, UCINET, and Cytoscape for analysis. The density and centralization scores derived from the analysis indicated clearly that each destination was almost connected to each other. The centrality scores indicated that the destinations with higher degree of centrality also has higher betweenness centrality within the network. Based on centrality scores, POI(point of interests) of tourism destinations showed concentration in southern area of the target region. Finally, through component analysis, subgroups of tourism destination networks are isolated. Practical implications were also presented for industry practitioners.

• Journal of the Korea Society of Computer and Information
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• v.13 no.6
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• pp.279-286
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• 2008

The IT industry plays the engine role in Korean economy which reaches up to 17% of Korean GDP. However the current global economic depression which stems mainly from the US has caused insufficient demand in IT industry. The decreased demand leads to a drug in the market, to fierce price competitions and increasing fear on the world IT market depression. Considering the facts, there are strong demands for the diversification of the products of exports and the countries Korea exports to. These need differentiated strategies which can be summarized in various IT package-type overseas expansion model including the consideration in strategic items, countries, connecting large and small-medium size companies or businesses and related industries. The importance of IT industry in Korean economy will grow constantly and the IT package-type overseas expansion models will preside the movements.

• Korean Journal of Food Science and Technology
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• v.35 no.5
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• pp.1003-1006
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• 2003

The quality of dried ginseng products (white ginseng, red ginseng, and taeguk ginseng) was investigated according to the National Standards. All the dried ginseng products met the general quality standard established: moisture content of 14.0% or less, ash content of 5.0% or less, and water-saturated n-butanol extracts of 2.0% or more. Ginsenoside $Rb_1$, Rf, and $Rg_1$, the effective components of Korean ginseng were detected by HPLC analysis. However, uniformity of individual products within a package was not kept for almost all of the products except for red ginseng products.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.1-5
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• 2006

Increasement of total cost during distribution chain requires packaging standardization to reduce extra handling and delays at transshipment point. In Korea, high valued agricultural products to export are most often shipped by air freight. Fresh flowers, in particular, the need to set package standard for air palletization are strongly recommended. This study tried to find an optimum standard dimensions for export packages. After extensive research on combinations of various flower dimensions, package dimensions and pallet sizes, we found that 96 inches pallet was most adequate for international air freight. Based on the results, new 40 standard package dimensions were introduced and stacking efficiencies were calculated.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.12 no.1
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• pp.45-53
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• 2006

Thermal insulation is used in a variety of applications to protect temperature sensitive products from thermal damage. Several factors affect the performance of insulation packages. Among these factors, the thermal resistance of the insulating wall is the most important factor to determine the performance of the insulating package. In many cases, insulating wall consists of multi-layered structure and the heat transfer through this structure is a very complex process. In this study, an one-dimensional mathematical model, which includes all of the heat transfer principles covering conduction, convection and radiation in multi-layered structure, were developed. Based on this model, several heat transfer phenomena occurred in the air space between the layer of the insulating wall were investigated. From the simulation results, it was observed that the heat transfer through the air space between the layer were dominated by conduction and radiation and the low emissivity of the surface of each solid layer of the wall can dramatically increase the thermal resistance of the wall. For practical use, an equation was derived for the calculation of the thermal resistance of a multi-layered wall.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.165-172
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• 2003

Wafer-level packaging technology has become established with increase of demands for miniaturizing and realizing lightweight electronic devices evolution. This packaging technology enables the smallest footprint of packaged chip. Various structures and processes has been proposed and manufactured currently, and products taking advantages of wafer-level package come onto the market. The package enables mounting semiconductor chip on print circuit board as is a case with conventional die-level CSP's with BGA solder bumps. Bumping technology is also advancing in both lead-free solder alternative and wafer-level processing such as stencil printing using solder paste. It is known lead-free solder bump formation by stencil printing process tend to form voids in the re-flowed bump. From the result of FEM analysis, it has been found that the strain in solder joints with voids are not always larger than those of without voids. In this paper, characteristics of wafer-level package and effect of void in solder bump on its reliability will be discussed.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.27 no.3
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• pp.203-210
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• 2021

With the development of package printing technology, the package has expanded from the basic function of protecting products to the marketing function through package design. Color, the visual element that composes the package design, is delivered to the consumer most quickly and effectively. As color marketing of these package designs expands, accurate color reproduction that the product wants to express is becoming more important. The color of an object is transmitted by absorption and scattering of light. Spectral reflectance refers to the intensity of light reflected by an object at different wavelengths by the spectral effect. As a result, the color of the object is expressed in various colors. Packaged printing inks have their own absorption and scattering coefficients, and the Kubelka-Munk model for color reproduction and prediction defines the relationship between these correlation coefficients through reflectance. In the Kubelka-Munk model for color reproduction and prediction, the relationship between the absorption and scattering coefficients (K/S) of printed material is predicted as the sum of the K/S values according to the mixing ratio of all color ink used. In this study, the reflectance of the measured print is reversely calculated at the mixing ratio of print ink using the Kubelka-Munk model. Through this, the relationship value of the ink-specific absorption/scattering coefficient constituting the final printed material is predicted. Delta E is derived through the predicted reflectance, and the similarity between the measured value and the predicted value is confirmed.