• Journal of the Korean Society of Manufacturing Process Engineers
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• v.21 no.3
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• pp.49-55
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• 2022

The design of a battery package and a BMS module for applications using seawater rechargeable batteries, which are known as next-generation energy storage devices, is proposed herein. Seawater rechargeable batteries, which are currently in the initial stage of research, comprise primarily components such as anode and cathode materials. Their application is challenging owing to their low charge capacity and limited charge/discharge voltage and current. Therefore, we design a method for packaging multiple cells and a BMS module for the safe charging and discharging of seawater rechargeable batteries. In addition, a prototype seawater rechargeable battery package and BMS module are manufactured, and their performances are verified by evaluating the prevention of overcharge, overdischarge, overcurrent, and short circuit during charging and discharging.

• Proceedings of the Korea Information Processing Society Conference
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• 2009.11a
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• pp.141-142
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• 2009

The PEFP (Proton Engineering Frontier Project) is constructing a 100MeV proton Linac (Linear Accelerator). The 20 MeV 20 mA proton beam has been serviced for an application in the fields of material, biological, information technology and medical sciences. For a stable and efficient acceleration of a proton beam, the control requirements must be optimized by studying various control methods. We propose that the integrated control system for the Linac machine components must be based on a distribution control method to improve a centralized control system. Based on EPICS (Experimental Physics and Industrial Control System) real-time software, the VME (Versa Module European package format) IOC (Input Output Controller) was developed under cross development environment with a RISC (Reduced Instruction Set Computer) PowerPC system. In this paper, we describe the design and implementation of distributed control system using the VME-based EPICS middleware for various components of the large proton accelerator.

• Applied Chemistry for Engineering
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• v.21 no.3
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• pp.258-264
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• 2010

Most of fluid systems, such as P&ID in ships, power plants, and chemical plants, consist of various components. The components such as bends, tees, sudden-expansions, sudden-contractions, and orifices contribute to overall pressure loss of the system. The local pressure losses across such components are determined using a pressure loss coefficient, k-factor, in lumped parameter models. In many engineering problems Idelchik's k-factor models have been used to estimate them. The present work compares the k-factor based on CFD calculation against Idelchik's model in order to confirm whether a commercial CFD package can be used for pressure loss coefficient estimation of complex geometries. The results show that RSM is the best appropriate for evaluating pressure loss coefficient. Commercial CFD package can be used as a tool evaluating k-factor even though the accuracy is influenced by a turbulence model.

• Water Engineering Research
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• v.1 no.2
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• pp.137-146
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• 2000

A windows-based software package, named DREDGE, is developed for estimating sediment resuspension and contaminant release during dredging operations. DREDGE allows user to enter the necessary dredge information, site characteristics, operational data, and contaminant characteristics, then calculates an array of concentration using the given values. The program mainly consists of the near-field models, which are obtained empirically, for estimating sediment resuspension and the far-field models, which are obtained analytically, for suspended sediment transport. A linear equilibrium partitioning approach is applied to estimate particulate and dissolved contaminant concentrations. This software package which requires only a minimal amount of data consists of three components; user input, tabular output, and graphical output. Combining the near-field and far-field models into a user-friendly windows-based computer program can greatly save dredge operator's, planners', and regulators' efforts for estimating sediment transports and contaminant distribution.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.315-316
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• 2009

본 논문에서는 1W 급 이상의 고출력 LED 용 패키지로서 세라믹 LTCC 적층 패키지의 방열 특성을 평가하고 열해석 결과와의 차이에 대해 고찰하였다. 특히, 세라믹 패키지의 방열 특성을 향상시키기 위해 Thermal Via와 Heat slug를 LED Chip 하단부에 위치시켰을 때 방열 특성을 평가하기 위해 Transient Thermal Test를 이용하여 각각의 경우에 대한 열저항을 평가하여 방열 특성의 항상 정도를 확인하였으며, 열해석 시뮬레이션을 통해 얻은 결과와 비교하였다. 평가 결과 Heat slug를 배치한 패키지가 열저항이 $8^{\circ}C/W$로서 가장 우수한 특성을 보여주었으며, 열해석 결과와의 차이에 대해서는 광출력으로 방출된 전력을 계산하여 보정함으로써 $1^{\circ}C$ 이하의 편차를 보여주는 결과를 얻을 수 있었다.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.25 no.7
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• pp.1-8
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• 2011

The high efficiency tubular LED lamp has been developed. But, it occurs optical losses in consists of LED package, module, diffuser etc.. By Measuring the tubular LED lamp's luminous flux, we compared and analyzed about the effect of optical losses for each component and actually using measured luminous intensity distribution data, illuminance distribution was simulated by Relux. Optical losses are 24[%] from LED package to luminaire and the tubular LED lamp can be replaced with fluorescent lamp. In this paper, we could provide data for optimum lighting design by analyzing the optical characteristics for developing and propagating the tubular LED lamp.

• Journal of Welding and Joining
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• v.16 no.5
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• pp.100-107
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• 1998

This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

• Particle and aerosol research
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• v.11 no.2
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• pp.57-61
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• 2015

Atmospheric nano-particles along the altitude is one of the main factors causing severe weather phenomena. It is a challenge to find the precise particle size distribution. One useful instrument includes a scanning mobility particle sizer (SMPS). This measures the size distribution of submicron aerosols. The SMPS consists of a condensation particle counter (CPC), differential mobility analyzer (DMA), high voltage power supplier (HVPS), and neutralizer. Due to the many components, it is difficult to install a commercial SMPS into a tethered balloon package system (Eun, 2011). In this study, we customized a SMPS for the tethered balloon package system called Hy-SMPS. It is portable, compact in structure, and evaluated by TSI SMPS using mono and poly-dispersed particles.

• Journal of the Korean Society for Precision Engineering
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• v.18 no.2
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• pp.140-145
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• 2001

The tape carrier package(TCD) is one of the most important components in a liquid crystal display(LCD) module. It has a role to transmit electrical signals from a printed circular board(PCB) to a display panel. If TCP is damaged under mechanical shock, the signals can not be transmitted to the panel and as a result, some dead lines are generated on the panel. This kind of phenomenon is commonly called as 'line defects'. In this paper, new structural design concepts of TCP are proposed to guarantee its reliability by using Taguchi's approach and dynamic FE-analysis. The line defects problem of TCP module is solved by replacing the original TCP with the newly designed one.

• IEMEK Journal of Embedded Systems and Applications
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• v.6 no.4
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• pp.223-229
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• 2011

A novel ecosystem surrounding developing, publishing and using of smartphone applications is driving a new paradigm in software industry. Thousands of applications are newly published on appstores everyday. However more than 97% of them happen to be downloaded less than 1,000 times and resultingly disappeared out of user's interesting. It means that so many efforts and time of developers are vanished. In this paper, we proposed a new architecture to increase code reusability of Android applications so that the time and efforts to develop new applications can be shortened. The proposed architecture, an extended Intent mechanism, supports sharing of Android components among the applications registered in different servers as well as in the same Android device. We designed a new Intent mechanism by extending the PackageManager service and by adopting a new class for ServerPackageManager service.