• 한국의류학회지
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• 제28권7호
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• pp.916-926
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• 2004

The purpose of this study was to examine the workers＇ attitudes toward textile industry. Also the attitude was investigated how to be correlated to job stress symptoms and job performance. The data were obtained from questionnaire completed by 529 workers employed in textile or clothing companies. The SPSS package was used for data analysis which included t-test, ANOVA, mean, correlation, and factor analysis. The results showed that workers＇ attitudes toward textile industry were neither positive nor negative. The attitudes revealed to be divided into two components-cognition, affect/behavioral intention. Cognitive attitude was observed to be more positive than affective/behavioral intention attitude. The attitude differed according to personal characteristics such as sex, educational status, position, period of one＇s service, types of industry and job specifications. The attitude were correlated with job stress symptoms and job performance. The more positive the workers＇ attitudes were, the lesser job stress symptoms and the higher job performance were. As the two components of the attitudes are in the same way, the attitude toward textile industry exhibited to have higher correlation with job stress symptoms and job performance.

• 자원리싸이클링
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• 제32권6호
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• pp.3-9
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• 2023

LED 조명 모듈의 재활용을 위해 LED 패키지-PCB로 분리하고 선별하기 위한 분리장치를 제작하였고, 제작된 장비를 이용하여 부품분리실험을 진행하였다. 또한 분리된 LED 모듈과 패키지로부터 접착성분을 수거하여 분석을 진행하였다. 분리장비 제작을 위해 LED 패키지-PCB 분리 기초실험을 진행하였으며 분리에 필요한 최적조건으로 250 ℃이상의 온도조건, 20분 이상의 체류시간이 필요하다 판단하였다. 이러한 결과를 바탕으로 제작된 분리장비를 이용한 LED 패키지-PCB 분리실험은 온도 변화(150, 200, 250 ℃), 체류시간(5, 10, 20분)의 조건변화에 따른 분리율을 확인하였으며 최적 분리 조건을 도출하였다. 또한 시료의 기판의 종류(알루미늄, 유리섬유) 및 접착물질의 두께(0.25~0.30, 0.30~0.35 mm)별 분리 효율을 확인하였다. 최적조건으로 반응 온도 250 ℃, 체류시간 20분에서 기판의 종류엔 상관없이 접착물질의 두께 0.25~0.30mm에서 97.5% 분리를 확인하였다. 분리된 LED 패키지와 PCB로부터 잔류 접착물질을 수거하여 분석한 결과 Sn이 95% 이상 존재하는 것을 확인하였으며 5% 미만의 Cu, Ag가 확인되었다.

• 한국재료학회지
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• 제17권3호
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• pp.152-159
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• 2007

When the electronics are tested with thermal shock for Pb-free solder joint reliability, there are temperature conditions with use environment but number of cycles for test don't clearly exist. To obtain the long term reliability data, electronic companies have spent the cost and times. Therefore this studies show the test method and number of thermal shock cycles for evaluating the solder joint reliability of electronic components and also research bonding strength variation with formation and growth of intermetallic compounds (IMC). SMD (surface mount device) 3216 chip resistor and 44 pin QFP (quad flat package) was utilized for experiments and each components were soldered with Sn-40Pb and Sn-3.0 Ag-0.5 Cu solder on the FR-4 PCB(printed circuit board) using by reflow soldering process. To reliability evaluation, thermal shock test was conducted between $-40^{\circ}C\;and\;+125^{\circ}C$ for 2,000 cycles, 10 minute dwell time, respectively. Also we analyzed the IMCs of solder joint using by SEM and EDX. To compare with bonding strength, resistor and QFP were tested shear strength and $45^{\circ}$ lead pull strength, respectively. From these results, optimized number of cycles was proposed with variation of bonding strength under thermal shock.

• International Journal of Precision Engineering and Manufacturing
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• 제7권1호
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• pp.3-8
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• 2006

This paper deals with an automated computer-aided process planning and die design system by which designer can determine operation sequences even if they have a little experience in process planning and die design for axisymmetric products. An attempt is made to link programs incorporating a number of expert design rules with the process variables obtained by commercial FEM softwares, DEFORM and ANSYS, to form a useful package. The system can provide a flexible process based on either the reduction in the number of forming sequences by combining the possible two processes in sequence, or the reduction of deviation of the distribution on the level of the required forming loads by controlling the forming ratios. Especially in die design module optimal design technique and horizontal split of die insert were investigated for determining appropriate dimensions of components of multi-former die set. Results obtained, using the modules, enable the design and manufacture of a die set for a multi-former to be more efficiently performed.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 하계학술대회 논문집 B
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• pp.808-810
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• 2002

Higher current-rating and improved thermal performance are being sought for existing medium-voltage vacuum circuit breakers(VCB) in order to meet market needs which require to be compact and downsized. In this paper, thermal performance of medium voltage vacuum circuit breaker was investigated through experiments and numerical analysis. We changed several major parameters of current-rating and heat sink affecting on thermal behaviors in the breaker and observed the results. To predict the temperature distribution in complex three-dimensional (3-D) VCB components and gas, the commercial package was used to simulate conjugate heat transfer. Although some assumptions and simplifications were introduced to simulate the model, results from the computational model were in good agreement with actual temperature rise measurements obtained from experiments.

• 한국생산제조학회지
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• 제21권2호
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• pp.297-304
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• 2012

Recently RFID (Radio Frequency Identification) technology advances in wireless communication technologies are bringing new challenges. But RFID tag packaging technology has been lagging compared to the demand, so this technology is being required to improve reliability. In this paper, reliability comparison among 11 types of most commonly used epoxy molding in electrical/electronic components packaging has been made through analysis of confidentiality using a humidity sensor. Consequently, the variation of moisture penetration time causes has been verified by the changes in molding thickness for 3 types of epoxy, and from the result, the best experimental results were observed in terms of confidentiality. Moreover we have been confirmed the relationship between confidentiality, the molding thickness, and thermal property of epoxy through thermal analysis.

• 한국정밀공학회지
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• 제19권11호
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• pp.46-53
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• 2002

In order to overcome the conventional robot's physical limitation to frequent changes in operational requirements, it is quite appealing to modularize its system components and allow them to be combined into various configurations to best suit the needs to a particular application. Several researchers have presented the concept of modular robot. In this paper, the kinematics and dynamics of modular robot are studied, which concretes the concept of modular robot. This study includes the selection of individual module, the definition of their parameters and the development of module based manipulate. analysis software package (MBMAP).

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2004년도 추계학술대회 논문집
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• pp.1307-1311
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• 2004

This paper deals with an automated computer-aided process planning and die design system by which designer can determine operation sequences even if they have a little experience in process planning and die design for axisymmetric products. An attempt is made to link programs incorporating a number of expert design rules with the process variables obtained by commercial FEM softwares, DEFORM and ANSYS, to form a useful package. They can provide a flexible process based on either the reduction in the number of forming sequences by combining the possible two processes in sequence, or the reduction of deviation of the distribution on the level of the required forming loads by controlling the forming ratios. Especially in die design module an optimal design technique and horizontal split die were investigated for determining appropriate dimensions of components of multi-former die set. It is constructed that the proposed method can be beneficial for improving the tool life of die set at practice.

• Structural Engineering and Mechanics
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• 제39권3호
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• pp.399-410
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• 2011

Base isolation, having quite simple contents, aims to protect the buildings from earthquake-induced damages by installing structural components having low horizontal stiffness between substructure and superstructure. In this study, an appropriate base isolation system for 2-D reinforced concrete frame is investigated. For different structural heights, the structural systems of 2, 3 and 4 bays are modeled by applying base isolation systems and results are compared with conventional structural systems. 1999 Marmara earthquake data is used for applying the model by time history method in SAP2000 package. Results of various parameters such as base shear force, structure drift ratio, structure period and superstructure acceleration are discussed for all models.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.543-546
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• 2001

So far, the design methods of quartz crystal resonator have been developed. Recently, as the electronic package and semiconductor modules become smaller, the need to minimize the sizes of crystal components grows larger. but Minimizing crystal plate sizes has limitations because its temperature-frequency characteristics is worse and unwanted resonances occur. so appropriate design of electrode size and crystal plates is necessary. In this palter, Two-dimensional governing equations for electroded piezoelectric crystal plates with general symmetry have been solved from deduced equations from three-dimensional equations of linear piezoelectricity in most cases. In practice, electroded piezoelectric crystal plates have three-dimensional geometry, so simplified 2-dimensional equations and 2-D modeling are insufficient for explaining its resonance modes and characteristics. So, three-dimensional FEM(finite element method) analysis is done and its effectiveness is verified from analyzing practical crystal resonator model.