• 한국전자파학회지:전자파기술
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• 제25권3호
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• pp.24-33
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• 2014

• 대한간호학회지
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• 제48권1호
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• pp.50-58
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• 2018

Purpose: The purpose of this study was to examine the mediating effect of marital intimacy on the impact of uncertainty on the quality of life (QoL) of young breast cancer patients. Methods: This study used a pathway analysis with 154 young breast cancer cases in their early diagnosis stage at a medical center in Korea. Data were collected from November 2016 to February 2017 and analyzed using correlation analysis and pathway analysis. Results: Uncertainty, marital intimacy, and 4 sub-scales of QoL showed a significant correlation. Marital intimacy was directly affected by uncertainty (${\beta}=-.39$, p=.013) and 4 sub-scales of QoL were also affected by uncertainty. Among the 4 sub-scales of QoL, physical well-being (PWB) (${\beta}=.17$, p=.026), social well-being (SWB) (${\beta}=.49$, p=.010), and functional well-being (FWB) (${\beta}=.38$, p=.009) were affected by marital intimacy but emotional well-being (EWB) was not affected by it. The mediating effect of marital intimacy on the impact of uncertainty on QoL was confirmed. Marital intimacy showed a significant indirect effect on PWB (${\beta}=-.07$, p=.024), SWB (${\beta}=-.19$, p=.008), and FWB (${\beta}=-.15$, p=.005), and it means that marital intimacy has a partial mediating effect on the impact of uncertainty on PWB, SWB, and FWB. Conclusion: Effects of uncertainty on QoL was mediated by marital intimacy of young breast cancer patients in their early diagnosis stage. It suggests that marital intimacy needs to be considered in providing nursing intervention for young breast cancer patients.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.87-119
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• 2001

Fine Pitch Technology will be accelerated among next decade. Buildup Technology is Key Technology for High Density Interconnection. Novel Base Material is critical for High Speed, Area Array Flip Chip Application. Japanese PWB Technology Roadmap will be Published soon.

• 한국신뢰성학회지:신뢰성응용연구
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• 제5권2호
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• pp.241-259
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• 한국신뢰성학회:학술대회논문집
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• 한국신뢰성학회 2005년도 학술발표대회 논문집
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• pp.393-404
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• 2005

The environmental problem is a main subject of the 21C and an environment destruction phenomenon by various kinds of environmental materials is reaching serious level. Nations to be classified as the environmental developed country, are born again environmental rich country. And they earn a large income by trade Every kind environmental resource in an international commercial transaction. Especially, the study that a reliability assessment method to prevent to reliability problem to be happened when the solder lead(lead-free solder), non-cd component, non-bromide component(without the polybrominated biphenyls(PBB) and polybrominated diphenyl ethers(PBDE))and hexavalent chromium(Cr VI) clearance component and mercury-free applied to electronic equipment is progressed. As the result of the study for applying of a reliability assessment technique of lead-free solder that recognized the most of urgent problem at the company, combination accelerated life test could taken by adding and appling the part of a humidity acceleration part to Eyring Model which is proposed by R.E.Thomas. The reliability assessment methods study of PWB clean environmental materials is expected to respond to a reliability elevation and environmental material regulation policy spreading all over the world by beginning form Europe.

• 한국전자파학회논문지
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• 제25권9호
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• pp.919-929
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• 2014

최근 전자기기의 활용도가 높아짐에 따라 전자기파에 대한 안정성이 요구되었다. 소형화 전자기기 및 다양한 전자부품들은 맥스웰 방정식 (Maxwell Equation)으로 해석되었으나, 복잡도가 높은 대형 구조물에 대한 전자기파 안정성이 요구되는 현시점에 맥스웰 방정식은 여러 한계점을 가지고 있다. 본 논문에서는 복잡한 대형 구조물을 확률론과 위상학적 모델링을 연동하여 해석하고자 한다. 특히, 확률론을 바탕으로 한 해석 방법인 PWB(Power Balance) Method와 BLT(Baum-Liu-Tesch) 방정식을 연동하여 대형 구조물의 주파수 응답을 풀이할 경우, 해석시간이 상당히 줄어드는 장점이 있다. 본 논문에서는 복잡한 대형구조물의 예로 이중 공진구조 내부에 PCB가 존재하는 경우를 고려해 보았다.

• 교육심리연구
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• 제32권3호
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• pp.571-596
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• 2018

본 연구에서는 교차문화 청소년들이 겪는 어려움들을 문화적 소속감의 부재라는 이론적 틀 안에서 살펴보았다. 설문조사에 참여한 151명의 교차문화 청소년들의 데이터를 통해 이들의 문화적 소속감의 부재와 심리적 안녕감 간의 관계를 경험적으로 탐색하였고, 그 관계에서 정서인식 명확성의 조절효과를 검증하였다. 그 결과, 첫째, 문화적 소속감의 부재는 심리적 안녕감과 부적 상관이 있는 것으로 나타났다. 구체적으로, 심리적 안녕감의 6차원 중 긍정적 대인관계와 환경에 대한 통제력에서 통계적으로 유의한 부적관계가 있는 것으로 밝혀졌다. 이는 문화적 소속감의 부재가 심한 청소년일수록 정서인식 명확성 수준과 상관없이 만족스러운 관계를 적게 맺고 있고, 일상생활에서 통제감이 적을 가능성이 높다는 것을 의미한다. 둘째, 문화적 소속감의 부재가 심리적 안녕감에 영향을 미칠 때 정서인식 명확성이 조절효과를 보이는 것이 확인되었다. 구체적으로, 심리적 안녕감의 6차원 중 긍정적 대인관계와 개인적 성장 영역에서 정서인식 명확성의 수준이 문화적 소속감의 부재와 심리적 안녕감 간의 관계를 조절하는 것으로 나타났다. 문화적 소속감의 부재 정도가 낮은 개인들은 긍정적인 대인관계 수준이 정서인식 명확성 수준에 따라 달라졌다. 즉, 문화적 소속감의 부재를 경험하고 있는 개인들 중 정서인식 명확성 수준이 이 높은 이들은 타인과 보다 긍정적인 관계를 보고하였다. 흥미롭게도 문화적 소속감의 부재 정도가 높은 청소년들은 정서인식 명확성 수준과 상관없이 개인적 성장에 대한 큰 열망을 보고하였다. 즉, 이들은 겉으로는 진취적이게 보여도 내적으로 명확하지 않은 정서들을 경험하며 어려움을 겪고 있을 수 있다. 이 결과는 교차문화 청소년들의 심리적 안녕감을 향상시키기 위해서는 이들의 문화적 소속감의 문제와 정서인식 명확성의 문제를 동시에 다루어야 함을 시사한다. 특히 문화적 소속감의 부재로 힘들어하는 교차문화 청소년들을 위해 정서경험을 더욱 명확하게 인식할 수 있도록 돕는 교육적, 상담적 개입이 효과적일 것으로 보인다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 추계 기술심포지움
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• pp.111-114
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• 2001

Optical transmitter and receiver are the essential components for optical communication. For these components, butterfly type packages are used which are comprised of metal housing, multilayer ceramic inserts, lead and window. In this study, 2.5 Gbps DFB(Distributed -Feedback) LD(Laser Diode) package was fabricated and characterized. Metal housing showed good thermal conductivity (200W/mK) and well matched TCE(6.7ppm/K) with GaAs chip. Ceramic inserts also showed good VSWR(Voltage Standing Wave Ratio) characteristics(<2.0). By brazing technology, all the elements were combined and sealed. RF characteristics of the package mounted on the PWB was also tested.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.104.2-104
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• 2001

In the intelligent integrated systems, the delay time must be reduced using highly parallel processors, as well as high throughput performance. In this paper, we propose a new concept for building 3D highly parallel processors using multi-layer printed wiring boards with built-in soldering heater (BISH-PWB). The proposed BISH is realized with the long and narrow cupper wiring pattern on the internal layer in the terminal pattern area. Based on the linearity of the cupper resistance vs. temperature, we can measure the BISH, temperature and its calorific value from the heater voltage and current measurements. If we provide the BISH temperature control systems for each BISH, selective multi-point soldering can be realized with same ...