Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)

The Korean Microelectronics and Packaging Society (한국마이크로전자및패키징학회)
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Butterfly type 광패키지의 제작 및 특성 평가

  • 조현민 (전자부품연구원 고주파재료연구센터) ;
  • 유찬세 (전자부품연구원 고주파재료연구센터) ;
  • 강남기 (전자부품연구원 고주파재료연구센터) ;
  • 이승익 ((주)래피더스) ;
  • 한기우 ((주)래피더스) ;
  • 유명기 ((주)래피더스)
  • Published : 2001.11.01
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Abstract

Optical transmitter and receiver are the essential components for optical communication. For these components, butterfly type packages are used which are comprised of metal housing, multilayer ceramic inserts, lead and window. In this study, 2.5 Gbps DFB(Distributed -Feedback) LD(Laser Diode) package was fabricated and characterized. Metal housing showed good thermal conductivity (200W/mK) and well matched TCE(6.7ppm/K) with GaAs chip. Ceramic inserts also showed good VSWR(Voltage Standing Wave Ratio) characteristics(<2.0). By brazing technology, all the elements were combined and sealed. RF characteristics of the package mounted on the PWB was also tested.

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