• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2006.04a
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• pp.137-137
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• 2006

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.66.1-66.1
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• 2010

Microcrystalline silicon at low temperatures has been developed using plasma enhanced chemical vapor deposition (PECVD). It has been found that energetically positive ion and atomic hydrogen collision on to growing surface have important effects on increasing growth rate, and atomic hydrogen density is necessary for the increasing growth rate correspondingly, while keeping ion bombardment is less level. Since the plasma potential is determined by working pressure, the ion energy can be reduced by increasing the deposition pressure of 700-1200 Pa. Also, correlation of the growth rate and crystallinity with deposition parameters such as working pressure, hydrogen flow rate and input power were investigated. Consequently an efficiency of 7.9% was obtained at a high growth rate of 0.92 nm/s at a high RF power 300W using a plasma-enhanced chemical vapor deposition method (27.12MHz).

• Tribology and Lubricants
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• v.22 no.3
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• pp.127-130
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• 2006

DLC (Diamond Like Carbon) films show very desirable surface interactions with high hardness, low friction coefficient, and good wear-resistance properties. The friction behavior of hydrogenated DLC film is dependent on tribological environment, especially surrounding temperature. In this work, the tribological behaviors of DLC (Diamond-like carbon) films, prepared by the radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) method, were studied in elevated temperatures. The ball-on-disk tests with DLC films on steel specimens were conducted at a sliding speed of 60 rpm, a load of 10N, and surrounding various temperatures of $25^{\circ}C,\;40^{\circ}C,\;55^{\circ}C\;and\;75^{\circ}C$. The results show considerable dependency of DLC tribological parameters on temperature. The friction coefficient decreased as the surrounding temperature increased. After tests the wear tracks of hydrogenated DLC film were analyzed by optical microscope, scanning electron spectroscopy (SEM) and Raman spectroscopy. The surface roughness and 3-D images of wear track were also obtained by an atomic force microscope (AFM).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.11a
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• pp.22-27
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• 1992

Phosphorus doped hydrogenated microcrystalline silicon (${\mu}c$-Si:H) thin films were deposited by PECVD (Plasma Enhanced Chemical Vapour Deposition) method using 10.2% $SiH_4$ gas (diluted in Ar) and 308ppm $PH_3$ gas (diluted in Ar). The structural, optical and electrical properties of the films were investigated as a function of substrate temperature(15 to $400^{\circ}C$) and RF power(10 to 120W). The thin film deposited by varing substrate temperature had columnar structure and microcrystalline phase. The volume fraction of microcrystalline phase in the films deposited at RF power of 80W, increased with increasing substrate temperature up to $200^{\circ}C$, and then decreased with further increasing substrate temperature. Volume fraction of microcrystalline phase increased monotonously with increasing RF power at substrate temperature of $250^{\circ}C$. With increasing volume fraction of microcrystalline, electrical resistivity of films decreased to 0.274 ${\Omega}cm$.

• Electrical & Electronic Materials
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• v.8 no.2
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• pp.171-175
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• 1995

Optimum condition of remote plasma enhanced chemical vapor deposition using orthogonal array method was chosen. Characteristics of oxide films deposited by RPECVD with SiH$_{4}$ and N$_{2}$O gases were investigated. Etching rate of the optimized SiO$_{2}$ films in P-etchant was about 6[A/s] that was almost the same as that the high temperature thermal oxide. The films showed high dielectric breakdown field of more than 7[MV/cm] and a resistivity of 8*10$^{13}$ [.ohmcm] around at 7[MV/cm]. The interface trap density of SiO$_{2}$/Si interface around the midgap derived from the high frequency C-V curve was about 5*10$^{10}$ [/cm$^{2}$eV]. It was observed that the dielectric constant of the optimized SiO$_{2}$ film was 4.29.

• Proceedings of the KIEE Conference
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• 2003.07c
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• pp.1595-1597
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• 2003

This paper presents the deposition of ${\mu}c$-Si:H thin-film and fabrication of a solar cell by VHF-PECVD method. The ${\mu}c$-Si:H thin films and pin-type solar cells are fabricated using multi-chamber cluster tool system. A 7.4% conversion efficiency was achieved from ${\mu}c$-Si:H thin film solar cells with total thickness less than $5{\mu}m$. The physical characteristic was measured by Raman spectroscopy, Solar cell characteristic was measured under AM1.5 illumination.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.169.2-169.2
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• 2013

본 연구에서는 gas를 이용한 PECVD 공법중 이온화 에너지가 높고 대면적 코팅이 용이한 Hybrid 코팅 장비에서 Linear Ion-Gun 이용하여 탄화수소 계열의 gas인 $C_2H_2$ 와 Si을 함유한 TMS (tetramethylsilane, $Si(CH_3)_4)$ gas를 이용하여 저마찰, 고경도 특성을 갖는 Si-DLC 코팅에 대한 연구를 수행하였다. Si-DLC 코팅에 앞서 전처리 공정으로 Linear Ion-Gun에 Ar gas를 주입하고 고전압의 DC 전원을 인가하여 제품 표면의 건식세정 및 표면 활성화를 진행 후, $C_2H_2$ 와 TMS gas를 Linear Ion-Gun에 주입하여 Si-DLC 코팅 공정을 진행하였다. Si-DLC 코팅시 $C_2H_2$ gas 주입량을 고정하고 TMS 가스 유량을 5~20sccm으로 조절하여 Si 함유량에 따른 Si-DLC 코팅막의 특성을 분석하였다. 이렇게 코팅된 Si-DLC의 박막 특성 분석으로 마찰계수 측정을 위해 ball-on-disk 타입의 tribometer를 사용하였으며, 박막 경도 측정은 Nano-indenter를 이용하여 분석을 진행하였다. 그 결과 Si을 포함하지 않는 DLC의 경우 마찰계수가 ~0.2를 가지는 반면, Si-DLC의 경우 Si 함유량이 약 1.5at%일 때, 마찰계수 ~0.04 저마찰의 우수한 특성을 지니며, 박막의 경도는 22[Gpa]로 고경도의 Si-DLC 코팅을 확인할 수 있었다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.7
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• pp.618-623
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• 2006

Hydrogenated Diamond-like carbon (DLC) films were prepared by the radio frequency plasma enhanced chemical vapor deposition (RF PECVD) method on silicon substrates using methane $(CH_4)$ and hydrogen $(H_2)$ gas. The wear track on the DLC films was examined after the ball-on disk (BOD) measurement with a Raman mapping method. The BOD measurement of the DLC films was performed for 1 to 3 hours with a 1-hour step time. The sliding traces on the hydrogenated DLC film after the BOD measurement were also observed using an optical microscope. The surface roughness and cross-sectional images of the wear track were obtained using an atomic force microscope (AFM). The novel Raman mapping method effectively shows the graphitization of DLC films of $300{\mu}m\times300{\mu}m$ area according to the sliding time by G-peak positions (intensities) and $I_D/I_G$ ratios.

• Korean Journal of Materials Research
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• v.9 no.8
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• pp.825-830
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• 1999

Characteristics of SiOF films deposited by a FTES/$O_2$-plasma enhanced chemical vapor deposition method have been investigated using Fourier transform infrared spectroscopy, X-ray photoelectro spectroscopy, and ellipsometry. Electrical properties such as dielectric constant, dielectric breakdown and leakage current density are investigated using C-V and I-V measurements with MIS(Au/SiOF/p-Si) capacitor structure. Stepcoverage of the films have been also characterized using scanning electron microscopy and ellipsometry. A high quality SiOF film was formed on that the flow rates of FTES and $O_2$were 300sccm, respectively. The dielectric constant of the deposited SiOF film was about 3.1. This value is lower than that of the oxide films obtained using other method. The dielectric breakdown field and leakage current are more than 10MV/cm and about $8[\times}10^{9}A/\textrm{cm}^2$, respectively. The deposited SiOF film with thickness as $2500{\AA}$ on the $0.3{\mu}{\textrm}{m}$ metal pattern shows a high step-coverage without a void.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.5
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• pp.666-672
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• 2014

We have investigated the gate insulator effects on the electrical performance of p-type tin monoxide (SnO) thin-film transistors (TFTs). Various SnO TFTs are fabricated with different gate insulators of a thermal $SiO_2$, a plasma-enhanced chemical vapor deposition (PECVD) $SiO_x$, a $150^{\circ}C$-deposited PEVCD $SiO_x$, and a $300^{\circ}C$-deposited PECVD $SiO_x$. Among the devices, the one with the $150^{\circ}C$-deposited PEVCD $SiO_x$ exhibits the best electrical performance including a high field-effect mobility ($=4.86cm^2/Vs$), a small subthreshold swing (=0.7 V/decade), and a turn-on voltage around 0 (V). Based on the X-ray diffraction data and the localized-trap-states model, the reduced carrier concentration and the increased carrier mobility due to the small grain size of the SnO thin-film are considered as possible mechanisms, resulting in its high electrical performance.