• Annual Conference of KIPS
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• 2017.04a
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• pp.625-628
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• 2017

최근 산업의 급격한 발전으로 부품의 정밀한 가공에 대한 요구치가 높아지고 있다. 또한 생산 공장에서 기계를 효율적으로 운용하기 위해 가공된 제품을 정밀하게 분석 할 필요가 있다. 이를 위해서는 육안으로 판단할 수 없는 미세한 차이를 구분 할 수 있어야한다. 이전 연구에서는 2차원적으로만 분석이 가능했으며, 분석 가능한 시스템은 PCB 회로편심, 폭, 원의 지름 등 이였다. 하지만 정밀한 제품을 생산하기 위해 2차원만으로 제품을 분석하기에는 무리가 있다. 따라서 본 논문에서는 3차원을 통해 제품의 입체형상을 제공하고 실제 단면의 모습을 구체화하여 기존의 2차원적 방식에서 제품의 정밀도를 더 명확하게 판단 할 수 있도록 3차원 입체형상을 더한 확장된 분석 시스템을 제안한다.

• Proceedings of the KAIS Fall Conference
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• 2011.12b
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• pp.701-703
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• 2011

본 논문에서는 태양광병용형 식물공장과 USN 기술이 융합된 스마트 팜 모니터링 시스템을 설계 및 구현하고자 한다. 먼저 식물공장의 규모 및 내부 환경 정보 수집에 적합한 무선 통신 모듈과 온도, 습도, 조도, PPFD, 일사량 센서를 선택한 뒤, 각 센서를 통합하기 위한 PCB 모듈을 설계 및 제작한다. 제작된 통합센서는 송신부와 수신부가 포함되어 있으며 일정 간격마다 USN 게이트웨이의 요청에 의해 식물공장 내부의 환경 정보를 측정하여 서버로 전송하고, 전송된 데이터는 서버관리자에 의해 데이터베이스에 저장 및 각 환경 정보와 연관된 디바이스 제어 시 입력 요소로 사용된다. 향후 본 시스템을 확장 및 적용할 경우 태양광병용형 식물공장의 생산 효율이 증대되고, 에너지 소비 효율을 향상시킬수 있을 것으로 기대된다.

• Proceedings of the KIPE Conference
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• 2004.07b
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• pp.713-717
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• 2004

This is a thesis that a quarter-brick size of 100W class open-frame type on board power module comprising telecommunication application is reported. The input voltage is established between 36 and 75 in range in order for power module to be utilized for the telecommunication application, and output were set at 3.3V and 30A. A number of parts used for transformer, inductor, and hit sink are composed of PCB in order for DC-DC converter to be lowered below 8 mm. A constant current control circuit was annexed to the system as well as basic protection prototypes such as over-voltage, over-current, and over-temperature were well considered to enhance more credibility, and were tested. As a result, high circuit performance and credibility turned out to be significant.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• Proceedings of the IEEK Conference
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• 2008.06a
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• pp.367-368
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• 2008

CAS(conditional Access System) is required for contents access such that only paid subscribers can watch channels in broadcast systems. In this paper, we design the CI(Common-Interface) module and implement a Multicrypt one of DVB scenario for interoperability. we use PADS2005 CAD tool for design and integrate the developed CAS into a STB(Set-Top-Box) on PCB board.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.989-992
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• 1997

The objective of this study is to develop stencil cutting process and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width on the cut edge quality were investigated. In order to analyze the cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. A a results, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial gerber file for PCB stencil manufacturing.

• Journal of the Korean Institute of Telematics and Electronics
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• v.24 no.6
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• pp.1068-1073
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• 1987

Traditional circuit partitioning algorithm using the cluster development method, which is suitable for such applications as single chip floor planning or multiple layer PCB system placement, where the clusters are formed so that inter-cluster nets are localized within the I/O connector pins, may not be appropriate for the functiona block placement in truly 3-D electronic modules. 3-D hybrid IC is one such example where the inter-layer routing as well as the intra-layer routing can be maximally incorporated to reduce the overall circuit size, cooling requirements and to improve the speed performance. In this paper, we propose a new algorithm called MBE(Minimum Box Embedding) for the layer assignment of each functional block in 3-D hybrid IC design. The sequence of MBE is as follows` i) force-directed relaxation in 3-D space, ii) exhaustive search for the optimal orientation of the slicing plane and iii) layer assignment. The algorithm is first explaines for a 2-D reduced problem, and then extended for 3-D applications. An example result for a circuit consisting of 80 blocks has been shown.

• 한국지구물리탐사학회:학술대회논문집
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• 2003.11a
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• pp.518-521
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• 2003

LCA (Life Cycle Assessment), that unifies the scale of various environmental impacts, and simulated annealing are applied to optimizing electrolysis of wastewater from PCB (Printed Circuit Board) production. The changes of environmental impact can be quantified with LCA and the total changes of environmental impacts can be expressed as a function of power consumed, Cu recycled, $Cl_2$, NOx and SOx discharged through restriction of feasible reactions. In a single-variate condition, the environmental optimum can be easily obtained through plotting and comparing each environmental impact value. In 8V potentiostatic electrolysis, the lowest environmental impact can be achieved after 90min. To optimize a multi-variate conditional system, simulated annealing can be applied and this can give the quick and near optimum in complex systems, where many input and output materials are involved, through experimentally measured values without a theoretical modeling.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1061-1066
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• 2014

Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2004.05a
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• pp.1047-1051
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• 2004

Charge amplifier systems benefit from the very wide dynamic range of PE accelerometers by offering flexibility in adjusting the electrical output characteristics such as sensitivity and range. They are well suited for operation at high temperatures. Modern charge systems feature improved low noise operation, simplified digital controls, and dual mode operation for operation with charge or IEPE voltage mode sensors. high impedance circuitry is not well suited for operation in adverse field or factory environments. The resolution of a PE accelerometer may not be specified or known since noise is a system consideration determined by cable length and amplifier gain. IEPE accelerometrs operate from a constant current power source, provide a high-voltage, low-impedance, fixed mV/g output. They operate through long, ordinary, coaxial cable in adverse environments without degradation of signal quality. They have limited high temperature range. IEPE sensors are simple to operate. Both resolution and operating range are defined specifications. Cost perchannel is lower compared to PE systems since low-noise cable and charge amplifiers are not required.