• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.9 no.5
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• pp.648-658
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• 1998

In this paper, the effect of the gap in the ground plane on the electromagnetic interference (EMI) is analyzed quantitatively. Because of a lot of advantages compared to other numerical techniques, the FDTD (finite difference time domain) is applied to the EMI effect modeling. The analyzed model is the simplified PCB (printed circuit board) which has a microstrip and ground plane. The inductance induced by the gap is modeled and calculated by gridding the whole PCB based on the FDTD algorithm. When external cables are attached to the PCB, the common-mode current is induced along the attached cable and the resulting electric field strength is calculated and presented along with the FCC and CISPR EMI limits. The results show that the radiated field strength highly depends on the size of the ground plane gap. The numerical simulation results can be used as a reference in the practical PCB design with the ground plane gap.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.6
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• pp.91-98
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• 2004

This paper proposes a PCB plane model for generic SPICE circuit simulators. The proposed model reflects two frequency-dependent losses, namely skin and dielectric losses. After power/ground plane pair is divided into arrays of unit-cells, each unit-cell is modeled using a transmission line and two loss models. The loss model is composed of a resistor for DC loss, series HL ladder circuit for skin loss and series RC ladder circuit for dielectric loss. To verify the validity of the proposed model, it is compared with SPICE ac analysis using frequency-dependent resistors. Also, we show that the estimation results using the proposed model have a good correlation with that of VNA measurement for the typical PCB stack-up structure of general desktop PCs. With the proposed model, not only ac analysis but also transient analysis can be easily done for circuits including various non-linear/linear devices since the model consists of passive elements onl.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.188-193
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• 2010

In this paper, SI(Signal Integrity) characteristic of the 4-layer PCB(Printed Circuit Boards) with a through-hole via was analyzed by impedance mismatching between the through-hole via and the transmission line, and deterioration of clock pulse response characteristic due to the P/G plane resonances which are generated between the power and the ground plane. The minimized impedance mismatching between the through-hole via and the transmission line for the improving of SI characteristic is confirmed by the TDR(Time Domain Reflector) simulation and lumped element modeling of the through-hole via. And the cancellation method of P/G plane resonances for improvement of the SI characteristic is represented by simulation result.

• Proceedings of the KIEE Conference
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• 2005.11a
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• pp.44-47
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• 2005

This paper presents the efficient plan for the EMI improvement from of TFT-LCD Module. It investigates the frequency characteristics of Power/Ground Plane of TFT-LCD drive circuit PCB concretely. After the frequency characteristics is reviewed, EMI improvement is tried to insert to RC termination between Power/Ground Plane and to shift resonance frequency. It is confirmed by a simulation result and RC Termination which is inserted the point where the resonance characteristics change is necessary. It applied in 19 "SXGA TFT-LCD drive circuits and the EMI improvement verification is described.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.42 no.12
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• pp.159-164
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• 2005

Recently, it has demanded high-speed digital circuits as information increase. Therefore, electromagnetic characteristics of compact microwave circuit occurred importantly. And, the effect of the imperfect ground plane on the signal integrity and influence of coupling between two parallel lines for high-speed digital transmission line on the printed circuit board is investigated by FDTD simulations in 3-D electromagnetic analysis method. The results of FDTD simulation are compared with the ADS simulation in commercial software, analyzed lumped element of modeling and electromagnetic wave's radiation of slot as frequency. As a consequence, when the slot in the ground plane is under microstrip line, it has much effect on propagation of wave.

• Journal of electromagnetic engineering and science
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• v.2 no.2
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• pp.68-74
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• 2002

In this paper, a pre-layout design approach for high-speed microprocessor is proposed. For multilayer PCB stark up configuration as well as selection and placement of decoupling capacitors, an effective solution for reducing SSN and EMI is obtained by modeling and simulation of complete power distribution system. The system model includes VRM, decoupling capacitors, multiple power and ground planes for core voltage, vias, as well as microprocessor. Finally, the simulation results are verified by measurements data.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.320-330
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• 2012

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.21 no.2
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• pp.170-178
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• 2010

In this paper, we propose the modeling of the power/ground plane which includes complex dielectric permittivity and loss tangent for the power/ground coupled noise. In order to estimate the effects of the dielectric substrate for the coupled noise, we used full-wave simulators, HFSS(High Frequency Structure Simulation) and MWS(MicroWave Studio). The simulated results for the commercial substrates are compared with the measured values. TLM(Transmission Line Method) was used for the calculation of power plane impedance using Debye model which depicts the dielectric loss of PCB. Finally, impedance from proposed circuit model showed very good coincidence to the measured data.