References
- IEEE Trans. on Components, Packaging, and Manufacturing Tech. v.20 no.1 Computation of Switching Noise in Printed Circuit Boards Jong-Gwan Yook;Linda P. B. Katehi
- IEEE Transactions on Microwave Theory and Techniques v.42 no.9 Efficient modeling of power planes in computer packages using the finite difference time domain method R. Mittra;S. Chebolu;W. D. Becker https://doi.org/10.1109/22.310589
- Proc. 1996 Wroclaw EMC Symp. Modeling of power planes for electical simulations E. Leroux;P. Bajor
- IEEE Microwave and Guided wave Letters v.1 no.6 Modeling Via Hole Grounds in Microstrip Marc E. Goldfarb;Robert A. Pucel https://doi.org/10.1109/75.91090
- IEEE 3rd Topical Meeting on Electrical performance of Electronic Packaging Decoupling capacitor calculations for CMOS circuits L. D. Smith
- Intel Pentium 4 Processor / Intel 850 Chipset Platform Design Guide Intel Corporation
- IEEE Trans. on Advanced Packaging v.22 no.3 Power Distribution System Design Methodology and Capacitor Selection for Modern CMOS Technology L. D. Smith;R. Anderson https://doi.org/10.1109/6040.784476
- Proceedings DesignCon99, High-Performance System Design Conference Probes and setup for measuring power-plane impedances with vector network analyzer I. Novak