• 한국산학기술학회논문지
• /
• 제19권2호
• /
• pp.639-643
• /
• 2018

전자 시스템이 소형화, 이동성의 요구에 따라 전력 변환의 필요성이 계속 증가하고 있다. 또한 전력 변환에는 전력 효율과 함께 전력 변환시스템의 소형화를 위해 적용하는 스위칭에 의한 잡음으로부터 시스템 안정성이 보장되어야 한다. 따라서 전력 변환시 스위칭 잡음을 감소시킬 수 있는 대책이 필수적이다. 본 논문에서는 DC/DC Buck Converter회로를 구성하였고, reference plane을 갖는 4층 PCB 회로 구조에서 부품의 배치를 변경할 경우 발생하는 스위칭 잡음특성을 비교 분석하였다. 또한, Reference Plane을 제거한 양면 PCB회로 구조에서 부품 배치를 달리하였을 경우 스위칭 잡음 특성을 각각 시뮬레이션으로 비교 분석하였다. 그 결과 4층 PCB회로 구조에서는 Current return path에 따라 Radiated Emission 특성이 12dB, Conducted Emission 특성이 7~8dB 감소됨을 확인하였다. 또한 양면 PCB회로 구조에서는 Conducted Emission이 20~25dB 감소됨을 확인하였다. 이로써 전력 변환 회로를 설계할 경우 Current return path의 구성에 따라 잡음 특성을 향상시킬 수 있음을 확인하였다.

• 한국신뢰성학회지:신뢰성응용연구
• /
• 제16권3호
• /
• pp.202-207
• /
• 2016

Purpose: The purpose of this study is main factors (environmental conditions, pattern spacing, pattern material) that effect the ion-migration of PCB. Methods: Recently, the electronic components are becoming more high density of electronic device, so that electronic circuits have smaller pitches between the patten and more vulnerable to insulation failure. so the reliability of electric insulation of device has become an ever important issue as device contact pitches of pattern. Usually, ion-migration occurs in high temperature and high humidity environment as voltage is applied to the circuit. Under high temperature and high humidity, voltage applied electronic components respond to applied voltages by metals's electrochemical ionization and a conducting filament forms between the anode and cathode across a nonmetallic medium. This leads to short-circuit failure of the electronic component. Results: we studied ion-migration that occurs in accordance with the main factors (environmental conditions, pitches, pattern material). The PCB pattern material was made by two different types of material (free solder, OSP) for this research and pitches of pattern is 0.15mm, 0.3mm, 0.5mm. PCB was experimented in the environmental conditions (high temperature $120^{\circ}C$, high temperature and high humidity $85^{\circ}C$, 85%RH) and was analyzed for ion-migration through the experiment results. Conclusion: We confirmed that environmental condition, pitches of pattern, pattern material had effect on ion-migration of PCB.

• 산업경영시스템학회지
• /
• 제29권1호
• /
• pp.63-71
• /
• 2006

In this paper, we consider a planning problem arising from printed circuit board manufacturing industries. Given a set of several types of PCBs, component feeders and surface mounting machines in series in a PCB assembly line, the problem is to define the feeder allocation and job sequence with the objective of minimizing the total operation time of the line. We formulate the problem as a mathematical model. And, the problem is proven to be NP-hard, so a genetic algorithm is developed. Finally, we give test results to evaluate the performance of the genetic algorithm.

• 반도체디스플레이기술학회지
• /
• 제17권1호
• /
• pp.62-65
• /
• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• 상하수도학회지
• /
• 제26권6호
• /
• pp.757-766
• /
• 2012

In this study, we have examined concentration distribution and patterns of PCBs in waters, sediments and soils in an agricultural area of South Korea to investigate the relationship between PCBs sources and concentration levels. The concentration of PCBs in water samples were ranged from lower values below detection limit to 8.25 ug/L and the concentration of PCBs in sediment samples were ranged from lower values below detection limit to 76.67 ug/Kg. The concentration of PCBs in soil samples were ranged from lower values below detection limit to 23.51 ug/Kg. These contamination levels were far below the guideline values suggested for environmental quality assessment. The homologue patterns in samples varied from sample to sample, but isomer patterns were very similar with each other. PCB-138 and PCB-153 were predominant congeners in the soil and sediment, which were similar to the results obtained from previous studies. With these results, the assessment of potential sources of PCBs contamination in the sediments of the Nakdong river basin was performed. The principal components were extracted by Principal Component Analysis(PCA). As the result of PCA, it could be expected that PCBs in samples of this study were more affected by PCB products than combustion processes and mostly affected by already-known sources. The PCBs in the soil and sediment samples were related with commercial PCB products.

• 제어로봇시스템학회논문지
• /
• 제5권3호
• /
• pp.353-362
• /
• 1999

This paper presents a shape reconstruction method for automatic inspection of the solder joints on PCBs using X-ray. Shape reconstruction from X-ray radiographic image has been very important since X-ray equipment was used for improving the reliability of inspection result. For this purpose there have been lots of previous works using tomography, which reconstructs the correct shape, laminography or tomosynthesis, which are very fast algorithm. Latter two methods show outstanding performance in cross-sectional image reconstruction of lead type component, but they are also known to show some fatal limitations to some kinds of components such as BGA, because of shadow effect. Although conventional tomography does not have any shadow effect, the shape of PCB prohibits it from being applied to shape reconstruction of solder joints on PCB. This paper shows that tomography using Iterative Reconstruction Technique(IRT) can be applied to this difficult problem without any limitations. This makes conventional radiographic instrument used for shape reconstruction without shadow effect. This means that the new method makes cost down and shadow-free shape reconstruction. To verify the effectiveness of IRT, we develop three dimensional model of BGA solder ball, make projection model to obtain X-ray projection data. and perform a simulation study of shape reconstruction. To compare the performance of IRT with that of conventional laminography or tomosynthesis, reconstruction data are reorganized and error analysis between the original model are also performed.

• 대한전자공학회:학술대회논문집
• /
• 대한전자공학회 2001년도 The 6th International Symposium of East Asian Resources Recycling Technology
• /
• pp.193-197
• /
• 2001

This study was carried out to recover gold, silver and other valuable metals from the printed circuit boards (PCB) of waste computers. PCB samples were crushed to under 1mm by a shredder and initially separated into 30% conducting and 70% non-conducting materials by an electrostatic separator. The conducting materials, which contained the valuable metals, were then used as the feed material for magnetic separation where it was found that 42% was magnetic and 58% non- magnetic. The non-magnetic materials contained 0.227mg/g Au and 0.697mg/g Ag. Further leaching of the non-magnetic component using 2.0M sulfuric acid and 0.2M hydrogen peroxide at 85$^{\circ}C$ extracted more than 95% copper, iron, zinc, nickel and aluminium. Au and Ag were not extracted in this solution, however, more than 95% of Au and 100% of Ag were selectively leached with a mixed solvent (0.2M ammonium thiosulfate, 0.02M copper sulfate, 0.4M ammonium hydroxide). Finally, the residues were reacted with a NaCl solution to leach out Pb while sulfuric acid was used to leach out Sn. Recoveries reached 95% and 98% in solution, respectively.

• 대한전자공학회논문지SD
• /
• 제48권12호
• /
• pp.97-102
• /
• 2011

본 논문에서는 LVDT 구조를 이용한 신호 매핑 기반의 새로운 변위측정 알고리즘을 제안한다. 제안하는 방식은 상대 값을 이용한 신호 매핑방식을 사용하기 때문에 PCB상에 구현되는 코일 패턴이나, 트랜스 소자의 변수들에 독립적으로 동작할 수 있다. 이는 절대 값을 사용하면서 발생하는 다수의 튜닝작업이 필요 없고 단지 상대 값을 추출하기 위해 최종단계에서의 범위를 측정하는 캘리브레이션 공정만 필요하다. TI DSP 칩셋인 TMS320F2812에 코일 패턴이 다른 다수의 보드를 통하여 본 논문에서 제안하는 기법을 구현해 본 결과, PCB 코일 패턴이 조악하더라도 높은 정밀도와 신뢰성을 갖는 출력 신호를 얻음으로써 제안하는 기법의 우수성을 검증하였다.

• 한국정보통신학회:학술대회논문집
• /
• 한국정보통신학회 2012년도 춘계학술대회
• /
• pp.259-262
• /
• 2012

최근 개발되는 무기체계는 부체계 장비를 여러개 연결하여 임무를 수행하는 장비가 대부분이다. 무기체계를 양산하기위한 시험은 부품시험, 회로카드조립체 시험, 구성품시험, 체계통합시험을 통해 납품시험을 한다. 본 연구는 다양한기능을 가진 회로카드조립체(PCB)의 기능 시험장비를 통해 생산성을 향상시키는 방법을 연구하였다. 생산성향상이란 사람이 시험하는 부분을 최대한 줄이고, 다양한 회로카드조립체를 시험하기위한 점검장비의 수를 줄여, 궁극적으로 생산시간을 줄여 단가를 줄이는 효과이다. 지금까지 회로카드조립체의 시험장비는 여러명의 개발자가 주장비를 개발하여 시험방법 또한 여러가지 방법으로 시험을 하였다. 본 연구는 어떻게하면 시험 간 고려사항인 점검장비의 숫자를 줄이고, 입출력하는 모든 기능을 자동적으로 시험이 가능한가를 연구하였다.

• 자원리싸이클링
• /
• 제21권3호
• /
• pp.56-64
• /
• 2012

일반적으로 인쇄회로기판(Printed Circuit Board, PCB)은 다양한 종류의 플라스틱에 세라믹과 금속 성분이 복합적으로 함유되어 있는 것으로 알려져 있다. 따라서 환경적인 보호뿐만 아니라 자원의 재활용의 관점에서 PCB 스크랩으로부터 금속 성분을 분리해내는 것은 중요하다. 본 연구에서는 PCB의 재활용 기술에 대한 특허와 논문을 분석하였다. 분석 범위는 1980년~2011년까지의 미국, 유럽연합, 일본, 한국 등 다양한 나라의 등록/공개된 특허와 SCI 논문으로 제한하였다. 특허와 논문은 키워드를 사용하여 수집하였고, 기술의 정의에 의해 필터링 하였다. 특허와 논문의 동향은 연도, 국가, 기업, 기술에 따라 분석하여 나타내었다.