• Restorative Dentistry and Endodontics
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• 제26권5호
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• pp.409-417
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• 2001

상아질접착제의 광조사가 상아질접착에 미치는 영향을 알아보기 위하여 in vitro에서 접착실험을 하였다. 120개의 발거된 소의 전치 협면 상아질을 노출시키고 산 부식 한 다음 self-priming형 상아질접착제 Prime&Bond$^{\circledR}$NT (Dentsply DeTrey, GmbH, Konstanz, Germany)를 도포 하였으며 600 mW/$\textrm{cm}^2$의 일반광도 또는 1930 mW/$\textrm{cm}^2$의 초고광도 광조사를 각각 20초 및 3초간 시행한 군과 시행하지 않은 군으로 나누어 복합레진 첨가후 광조사하였다. 접착제에 대한 광조사를 시행하지 않은 경우에는 복합레진 첨가 후 초고광도로 3초, 6초 및 12초간 광조사하였다. 접착양상 평가를 위해 만능시험기로 전단접착강도를 측정하고 파단면을 입체 현미경으로 관찰한 바를 일원 및 이원 변량분석법과 카이제곱검사법으로 통계 분석하여 다음과 같은 결과를 얻었다. 1. 상아질접착제를 광조사한 군이 광조사하지 않은 군에 비해 유의하게 높은 전단접 착강도를 나타내었다 (p<0.05). 2. 일반 광도 및 초고광도 광조사에 따른 전단접착강도에는 유의한 차이가 나타나지 않았다 (p>0.05). 3. 상아질접착제를 광조사하지 않고 복합레진 첨가 후 초고광도로 광조사한 군간에 조사시간에 따른 전단접착강도에는 유의 한 차이가 나타나지 않았다 (p>0.05). 4. 파단면 관찰 결과, 모든 군에서 접착계면에서의 파절을 포함하는 혼합파단양상이 가장 많이 나타났으며 군간에는 유의한 차이가 없었다 (p>0.05).

• ETRI Journal
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• 제35권6호
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• pp.1152-1155
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• 2013

A cost-effective and simple solder on pad (SoP) process is proposed for a fine-pitch microbump interconnection. A novel solder bump maker (SBM) material is applied to form a 60-${\mu}m$ pitch SoP. SBM, which is composed of ternary Sn3.0Ag0.5Cu (SAC305) solder powder and a polymer resin, is a paste material used to perform a fine-pitch SoP through a screen printing method. By optimizing the volumetric ratio of the resin, deoxidizing agent, and SAC305 solder powder, the oxide layers on the solder powder and Cu pads are successfully removed during the bumping process without additional treatment or equipment. Test vehicles with a daisy chain pattern are fabricated to develop the fine-pitch SoP process and evaluate the fine-pitch interconnection. The fabricated Si chip has 6,724 bumps with a 45-${\mu}m$ diameter and 60-${\mu}m$ pitch. The chip is flip chip bonded with a Si substrate using an underfill material with fluxing features. Using the fluxing underfill material is advantageous since it eliminates the flux cleaning process and capillary flow process of the underfill. The optimized bonding process is validated through an electrical characterization of the daisy chain pattern. This work is the first report on a successful operation of a fine-pitch SoP and microbump interconnection using a screen printing process.

• 대한소아치과학회지
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• 제34권3호
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• pp.398-407
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• 2007

본 연구는 소아 환자의 유동성 복합 레진 수복 시 접착제의 사용 및 중합 여부 그리고 접착제 종류에 따른 수복물 변연의 미세누출과 전단결합강도를 비교함으로써 치료 시간의 단축 가능성을 타진해보고자 시행하였다. 미세누출을 평가하기 위해 우식이 없거나 법랑질에 제한된 우식이 있는 상, 하악 소구치 84개, 전단결합강도 평가를 위해 협설면에 우식이나 결손부가 없는 대구치 70개를 각각 준비하여 사용하였다. 접착 시스템의 종류에 따라 총 7군을 설정하여 I군과 II군은 Single $Bond^{TM}$, III군과 IV군은 AQ Bond $Plus^{TM}$, Ⅴ군과 Ⅵ군은 Prompt L-$Pop^{TM}$ 그리고 접착 시스템을 사용하지 않고 레진을 충전하는 VII군을 대조군으로 설정하였다. 미세누출과 전단결합강도를 측정하여 다음과 같은 결과를 얻었다. 1. 미세누출 평가 결과 Single $Bond^{TM}$를 사용한 I군과 II군이 다른 군에 비하여 낮은 염료 침투를 나타냈다. I군과 II군 사이의 염료 침투 양상은 유사하게 나타났다. 2. 전단결합측정결과 I군과 II군이 다른 군에 비하여 높은 수치를 나타냈으며 통계적 유의차를 보였다(p<0.05). I군과 II군 사이에는 유의차가 없었다(p>0.05). 3. I군과 II군, III군과 IV군, V군과 VI군 사이에는 통계적 유의차가 없었다(p>0.05). 4. VII군은 I, II군과 V, VI군에 비하여 통계적 유의차가 있게 낮은 전단 결합 강도를 보였으며(p<0.05) III, IV군과는 보다 낮은 수치를 보였으나 통계학적 유의차는 없었다(p>0.05).

• 대한치과교정학회지
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• 제40권5호
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• pp.342-348
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• 2010

본 연구는 미백, 탈감작제 도포 후, 셀프 에칭 프라이머를 이용하여 브라켓 접착 시 법랑질에 대한 전단결합강도를 비교하기 위해 시행되었다. 48개의 소구치를 무작위로 12개씩 4개의 그룹으로 분류하였다. Group 1: 15% hydrogen-peroxide office bleaching agent (Illumine Office-IO), Group 2: IO + BisBlock Oxalate Dentin-Desensitizer, Group 3: Bis-Block Oxalate Dentin-Desensitizer, Group 4: 아무것도 하지 않음(대조군). 브라켓 접착 24시간 후 전단결합강도를 측정하였으며, 만능시험기의 속도를 5 mm/min로 하여 브라켓이 탈락할 때까지 시행하였다. Modified adhesive remnant index를 이용하여 탈락 양상을 분석하였다. 미백만 시행, 미백과 탈감작제 도포, 탈감작제만 도포한 경우 모두 브라켓의 전단결합강도를 현저히 감소시켰으며 ($p$ = 0.001), 이 세 실험군 간에는 통계적으로 유의성 있는 차이를 관찰할 수 없었다 (Group 1-Group 2, $p$ = 0.564; Group 1-Group 3, $p$ = 0.371; Group 2-Group 3, $p$ = 0.133). 세 실험군에서 브라켓의 탈락은 주로 법랑질-접착제 계면에서 발생하여 브라켓 베이스에 접착제의 100%가 남아있었다. 따라서 미백과 탈감작제 도포는 교정치료 후에 시행하는 것이 바람직하다.

• 한국분말야금학회:학술대회논문집
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• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
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• pp.672.2-672.2
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• 2006

• 한국염색가공학회:학술대회논문집
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• 한국염색가공학회 2010년도 제3회 국제학회
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• pp.207-208
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• 2010

• 대한치과보철학회지
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• 제34권4호
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• pp.833-849
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• 1996

The material of choice for functional and esthetic reconstruction of maxillofacial defects is silicone. Silicone has appropriate physical properties for maxillofacial prosthesis but it has weak edge strength. Therefore, a proper combination of silicone and polyurethane sheet is recommended to improve this weakness. Various primers are also used to enhance the adhesive strength between silicone and polyurethane sheet. The purpose of this study was to determine the adhesive strength of silicone and polyurethane sheet. Silicone elastomer mixture was made by admixing MDX4-4210 elastomer (40%) and Silastic Medical Adhesive Type A(60%). This silicone elastomer mixture was attached to polyurethane sheet, using one of three different primers(1205, S-2260, or A-304), treated for 1, 2, 4, 6, and 8 hours. These were then polymerized in room temperature, dry-heat oven or microwave oven. Six specimens per each group, a total of 270 specimens were prepared for final test. The differences of T-peel bonding strengths were then determined by a test. The differences of T-peel bonding strengths were then determined by a test method that was recommended by American Society for Testing and Materials C794-80. The results were statistically analyzed using the ANOVA and Mutiple Range Tests(Tukey' HSD). The reults were as follow. 1. Type of primer, primer reaction time, and methods of polymerization showed significant correlation on the T-peel bonding strengths in adhesiveness between silicone and polyurethane sheet. 2. A-304 primer showed statistically higher in T-peel bonding strength than otehr type of primers except for the polymerization in microwave oven with reaction times of 2, 6 hours(p<0.05). 3. No significant differences in T-peel bonding strength were observed among the polymerization methods. 4. The effect of reaction time by the primer type and polymerization method showed statistically significant differences in bonding strength among different reaction times. And in most cases, reaction time of 1 or 2 hours showed higher T-peel bonding strength.

• ETRI Journal
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• 제37권2호
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• pp.387-394
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• 2015

A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.

• 대한치과기공학회지
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• 제33권4호
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• pp.339-347
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• 2011

Purpose: This study was investigated the bonding strength of two kinds of Ni-Cr alloy with respect to the condition of surface treatment. Methods: The surface treatment was performed on the two kinds of Ni-Cr alloy (B alloy and R alloy) specimens, which were sandblasted with $50{\mu}m$, $110{\mu}m$, and $250{\mu}m$ aluminium oxide and were treated with opaque application (paste and wash opaque). The roughness on the surfaces of the specimens was observed. The metal-ceramic interfaces were analyzed with EPMA in order to ionic diffusion, and the shear test was performed. Results: The BA250 specimen, which has higher surface roughness, showed the highest bonding strength in B specimens. In R specimens, the bonding strength of RA110 specimen was the highest. Conclusion: B specimen formed a mechanical bond between metal-ceramic interfaces; however, in the case of R specimen, a chemical bond was formed between that interfaces. There was no significant statistical difference between the bonding strengths of two types of specimens (p>0.05).

• Journal of Magnetics
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• 제10권2호
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• pp.41-43
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• 2005

We have investigated an optical waveguide isolator with a multimode interference section by wafer direct bonding, operating at a wavelength $1.55\;{\mu}m$. In order to fabricate the device for monolithic integration, the wafer direct bonding between a magnetic garnet material as a cladding layer and a semiconductor guiding layer has been achieved. We found that wafer direct bonding between InP and GGG $(Gd_3Ga_5O_{12})$ is effective for the integration of a waveguide optical isolator. The isolation ratio was obtained to be 2.9 dB in the device.