• 한국재료학회지
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• 제18권10호
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• pp.552-556
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• 2008

Modified thermal annealing was applied to the activation of the polycrystalline silicon films doped as p-type through implantation of $B_2H_6$. The statistical design of experiments was successfully employed to investigate the effect of rapid thermal annealing on activation of polycrystalline Si doped as p-type. In this design, the input variables are furnace temperature, power of halogen lamps, and alternating magnetic field. The degree of ion activation was evaluated as a function of processing variables, using Hall effect measurements and Raman spectroscopy. The main effects were estimated to be furnace temperature and RTA power in increasing conductivity, explained by recrystallization of doped ions and change of an amorphous Si into a crystalline Si lattice. The ion activation using rapid thermal annealing is proven to be a highly efficient process in low temperature polycrystalline Si technology.

• 한국광학회지
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• 제3권1호
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• pp.50-54
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• 1992

마스크를 사용하지 않고 레이저 $(CW Ar^+$ laser, $\lambda=514.5nm)$ 광속을 이용하여 불산 용액이 첨가된 황산구리 전해질 용액내의 실리콘(Si, 100) 단결정 표면에 구리를 침착시켰으며, 이들 사이에서 일어나는 화학 반응식을 도금에서와 같이 양극 반응과 음극 반응으로 구분 하여 제안하였다. 또한 침착 되는 구리점의 직경을 전해질 용액에 첨가되는 불산용액의 양, 레이저 광속의 조사 시간과 관속의 세기에 따라 측정 분석하였다. p형 실리콘 단결정의 경우, 연속형 $Ar^+$ 레이저를 조사하였을때 구리 침착이 일어나고 펄스형 레이저 광속(Nd:YAG 레이저에 KDP결정을 사용하여 얻은 2차 고조파, $\lambda=530nm, $\tau=25nsce$)을 조사하였을 경우에는 침착이 일어나지 않았다. 그와는 반대로 n형 실리콘 단결정의 경우, 연속형 $Ar^+$ 레이저를 조사하였을 때는 구리 침착이 일어나지 않았으나, 펄스형 레이저 광속을 조사시켰을 경우에는 구리 침착이 일어남을 관찰하였다.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2000년도 추계종합학술대회 논문집(2)
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• pp.225-228
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• 2000

In this paper, we demonstrated an analytical description method of forward voltage drop and reverse voltage of $P^{+}N$ junction diode with <111> oriented antimony doped silicon wafer 60keV boron implantation computer simulation results. In order to make electrical activation of implanted carriers, thermal annealing are carried out by RTP method for 1min at $1000^{\circ}C$ inert gas condition.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
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• pp.232-232
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• 2012

The doping of semiconducting elements is essential for the development of silicon quantum dot (QD) solar cells. Especially the doping elements should be activated by substitution at the crystalline sites in the crystalline silicon QDs. However, no analysis technique has been developed for the analysis of the activated dopants in silicon QDs in $SiO_2$ matrix. Secondary ion mass spectrometry (SIMS) is a powerful technique for the in-depth analysis of solid materials and the impurities analysis of boron and phosphorus in semiconductor materials. For the study of diffusion behaviour of B and P by SIMS, Si/$SiO_2$ multilayer films doped by B or P were fabricated and annealed at high temperatures for the activated doping of B and P. The distributions of doping elements were analyzed by SIMS. Boron found to be preferentially distributed in Si layer rather than the $SiO_2$ layer. Especially the B in the Si layers was separated to two components of an interfacial component and a central one. The central component was understood as the activated elements. On the other hand, phosphorus did not show any preferred diffusion.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2002년도 추계학술대회 논문집 전기물성,응용부문
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• pp.245-247
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• 2002

The paper represents the effects of the drive-in process parameters on the residual stress profile of the p+ silicon film. For the quantitative determination of the residual stress profiles, the test samples are doped via the fixed boron diffusion process and four types of the thermal oxidation processes and consecutively etched by the improved process. The residual stress measurement structures with the different thickness are simultaneously fabricated on the same silicon wafer. Since the residual stress profile is not uniform along the direction normal to the surface, the residual stress is assumed to be a polynomial function of the depth. All of the coefficients of the polynomial are determined from the deflections of cantilevers and the displacement of a rotating beam structure. As the drive-in temperature or the drive-in time increases, the boron concentration decreases and the magnitude of the average residual tensile stress decreases. Also, near the surface of the p+ film the residual tensile stress is transformed into the residual compressive stress and its magnitude increases.

• Advances in nano research
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• 제10권5호
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• pp.415-422
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• 2021

Silicene, a 2D allotrope of silicon, is predicted to be a potential material for future transistor that might be compatible with present silicon fabrication technology. Similar to graphene, silicene exhibits the honeycomb lattice structure. Consequently, silicene is a semimetallic material, preventing its application as a field-effect transistor. Therefore, this work proposes the uniform doping bandgap engineering technique to obtain the n-type silicene nanosheet. By applying nearest neighbour tight-binding approach and parabolic band assumption, the analytical modelling equations for band structure, density of states, electrons and holes concentrations, intrinsic electrons velocity, and ideal ballistic current transport characteristics are computed. All simulations are done by using MATLAB. The results show that a bandgap of 0.66 eV has been induced in uniformly doped silicene with phosphorus (PSi₃NW) in the zigzag direction. Moreover, the relationships between intrinsic velocity to different temperatures and carrier concentration are further studied in this paper. The results show that the ballistic carrier velocity of PSi₃NW is independent on temperature within the degenerate regime. In addition, an ideal room temperature subthreshold swing of 60 mV/dec is extracted from ballistic current-voltage transfer characteristics. In conclusion, the PSi₃NW is a potential nanomaterial for future electronics applications, particularly in the digital switching applications.

• 한국진공학회지
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• 제3권3호
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• pp.360-367
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• 1994

Si2H6PH3 혼합기체를 사용하여 증착된 in-situ P-doped 비정질 실리콘과 SiH4 기체를사용하여 증착한후에 As+ 이온주입에 의해 도핑시킨 다결정 실리콘 박막을 하부 전극으로 하는 캐패시터를 형성 하였다. 여기서 유전박막층은 자연산화막 화학증착된 실리콘질화막 및 질화막의 산화에 의해 형성된 O-N-O 구조를 갖는 것이었다. 두 종류의 하부전극에 따른 캐패시터의 전기적 특서을 조사하였다. 전기 적 특성으로는 정전용량, 누설전류, 절연파괴전압 및 TDDB 등이었다. 이 가운데 정전용량, 누설전류 및 절연파괴전압은 하부전극에 따라 큰 차이를 보이지않았다. 그러나 음의 전장하에서의 TDDB 특성은 in-situ P-doped 비정실 실리콘이 하부전극인 캐패시터가 As+ 이온 주입실리콘이 하부전극인 것에 비해 더우수하였다. 이와 같은 TDDB 특성의 차이는 하부전극 실리콘의 integrity 차이로 인한 자연산화막의 결함 정도의 차이에 기인하는 것 같다. 이를 뒷받침하는 것으로 투과전자현미경 단면사진으로 확인하였 다. Shallow junction을 유지하는데도 in-situ P-doped 비정실 실리콘은 만족할 만한 결과를 보이며 박 막자체의 면저항값도 낮출 수 있어 초고집적 회로의 캐패시터 전극으로서 이용될 수 있는 것으로 평가 되었다.

• 반도체디스플레이기술학회지
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• 제12권3호
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• pp.47-51
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• 2013

Current research trends of solar cells has focused on the high conversion efficiency and low-cost production technology. Passivation technology that can be easily adapted to mass production. Therefore, this study conducted experiments with aim of the following two methods for the fabrication of high-efficiency crystalline silicon solar cells. In the first task, an attempt is formation of local Al-BSF to a number of locally doped dots to increase the conversion efficiency of solar cells to reduce the loss of $V_{oc}$ overcome. The second major task, rear surface apply in $Al_2O_3/SiN_x$ stack layer, $Al_2O_3$ prominent negative fixed charge characteristics. As the result of task, Local Al-BSF and $Al_2O_3/SiN_x$ stack layer applied to the p-type single crystalline silicon solar cells, the average $V_{oc}$ of 644mV, $I_{sc}$ of 918mV and conversion efficiency of 18.70% were obtained.

• Advances in nano research
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• 제9권2호
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• pp.105-112
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• 2020

Silicene is a two-dimensional (2D) derivative of silicon (Si) arranged in honeycomb lattice. It is predicted to be compatible with the present fabrication technology. However, its gapless properties (neglecting the spin-orbiting effect) hinders its application as digital switching devices. Thus, a suitable band gap engineering technique is required. In the present work, the band structure and density of states of uniformly doped silicene are obtained using the nearest neighbour tight-binding (NNTB) model. The results show that uniform substitutional doping using aluminium (Al) has successfully induced band gap in silicene. The band structures of the presented model are in good agreement with published results in terms of the valence band and conduction band. The band gap values extracted from the presented models are 0.39 eV and 0.78 eV for uniformly doped silicene with Al at the doping concentration of 12.5% and 25% respectively. The results show that the engineered band gap values are within the range for electronic switching applications. The conclusions of this study envisage that the uniformly doped silicene with Al can be further explored and applied in the future nanoelectronic devices.

• Applied Science and Convergence Technology
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• 제26권3호
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• pp.50-51
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• 2017

Strongly correlated electron systems which induce strong electron-electron interaction at ultra-low temperatures have always been an intriguing topic in mesoscopic condensed matter physics. Below 130 mK, a peculiar gap can be found in Al/$SiO_2$/Si:P structured tunnelling devices. The gap survives at the base temperature of more than 1800 gauss (30 mK), contrary to the superconductivity of the top Al electrode, which is completely suppressed above 100 gauss. This outcome implies that the observed gap is induced by Coulomb interaction in the heavily doped Si.