• 마이크로전자및패키징학회지
• /
• 제12권2호
• /
• pp.149-154
• /
• 2005

궁극적으로 게이트를 저저항 복합 실리사이드로 대체하는 가능성을 확인하기 위해 70 nm 두께의 폴리실리콘 위에 각 20nm의 Ni, Co를 열증착기로 적층순서를 달리하여 poly/Ni/Co, poly/Co/Ni구조를 만들었다. 쾌속열처리기를 이용하여 실리사이드화 열처리를 40초간 $700{\~}1100^{\circ}C$ 범위에서 실시하였다. 복합 실리사이드의 온도별 전기저항변화, 두께변화, 표면조도변화를 각각 사점전기저항측정기와 광발산주사전자현미경, 주사탐침현미경으로 확인하였다. 적층순서와 관계없이 폴리실리콘으로부터 제조된 복합실리사이드는 $800^{\circ}C$ 이상부터 급격한 고저항을 보이고, 두께도 급격히 얇아졌다. 두께의 감소는 기존의 단결정에서는 없던 현상으로 폴리실리콘의 두께가 한정된 경우 금속성분의 inversion 현상이 커서 폴리실리콘이 오히려 실리사이드 상부에 위치하여 제거되기 때문이라고 생각되었고 $1000^{\circ}C$ 이상에서는 실리사이드가 형성되지 못하였다. 이러한 결과는 나노급 두께의 게이트를 저저항 실리사이드로 만 들기 위해서는 inversion과 두께감소를 고려하여야 함을 의미하였다.

• 한국전기전자재료학회논문지
• /
• 제22권5호
• /
• pp.386-389
• /
• 2009

The electrical characteristics and annealing effects of tunneling dielectrics stacked with $SiO_2$ and $Si_{3}N_{4}$ were investigated. I-V characteristics of band gap engineered tunneling gate stacks consisted of $Si_{3}N_{4}/SiO_2/Si_{3}N_{4}$ (NON), $SiO_2/Si_{3}N_{4}/SiO_2$ (ONO) dielectrics were evaluated and compared with $SiO_2$ single layer using the MOS (metal-oxide-semiconductor) capacitor structure. The leakage currents of engineered tunneling barriers (ONO, NON stacks) are lower than that of the conventional $SiO_2$ single layer at low electrical field. Meanwhile, the engineered tunneling barriers have larger tunneling current at high electrical field. Furthermore, the increased tunneling current through engineered tunneling barriers related to high speed operation can be achieved by annealing processes.

• 전기학회논문지
• /
• 제65권12호
• /
• pp.2014-2018
• /
• 2016

Transparent, conductive electrode films, showing the particular characteristics of good conductivity and high transparency, are of considerable research interest because of their potential for use in opto-electronic applications, such as smart window, photovoltaic cells and flat panel displays. Multilayer transparent electrodes, having a much lower electrical resistance than widely-used transparent conducting oxide electrodes, were prepared by using RF/DC magnetron sputtering system. The multilayer structure consisted of three layers, [NiInZnO(NIZO)/Ag/NIZO]. The optical and electrical properties of the multilayered NIZO/Ag/NIZO structure were investigated in relation to the thickness of each layer. The optical and electrical characteristics of multilayer structures have been investigated as a function of the Ag and NIZO film thickness. High-quality transparent conductive films have been obtained, with sheet resistance of $9.8{\Omega}/sq$ for Ag film thickness of 8 nm. Also the multilayer films of inserted Ag 8 nm thickness showed a high optical transmittance above 93% in the visible range. The electrical and optical properties of the new multilayer films were mainly dependent on the thickness of Ag insertion layer.

• 한국전기전자재료학회논문지
• /
• 제24권4호
• /
• pp.303-308
• /
• 2011

The Gallium-doped ZnO(GZO) film deposited at a temperature of $200^{\circ}C$ and a pressure of 10 mtorr has an optical transmittance of 89.0% and a resistivity of $2.0\;m{\Omega}{\cdot}cm$ because of its high crystallinity. Effect of $Al_2O_3$ oxide buffer layers on the optical and electrical properties of sputtered ZnO films were intensively investigated for developing the electrodes of opto-electronic devices which demanded high optical transmittance and low resistivity. The use of $Al_2O_3$ buffer layer could increase optical transmittance of GZO film to 90.7% at a wavelength of 550 nm by controlling optical spectrum. Resistivity of deposited GZO films were much dependent on the deposition condition of $O_2/(Ar+O_2)$ flow rate ratio during the buffer layer deposition. It is considered that the $Al_2O_3$ buffer layer could increase the carrier concentration of the GZO films by doping effect of diffused Al atoms through the rough interface.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 춘계학술발표대회
• /
• pp.28.2-28.2
• /
• 2009

군사적, 산업적 용도로 널리 활용되고 있는 적외선 검출기는 InSb, HgCdTe(MCT)와 같은 물질들을 감지 소자로 사용하고 있다. 현재 가장 많이 사용되는 MCT는 적외선의 전 영역을 감지할 수 있는 장점이 있지만, 대면적 제작이 어려운 단점이 있다. 이에 비해 InSb는 안정적인 재료의 특성, 높은 전하이동도($1.2\times10^6\;cm^2/Vs$) 그리고 대면적 소자 제작의 가능성 등이 높게 평가되어 차세대 적외선 검출소자로 각광 받고 있다. InSb 적외선 수광 소자는 1970년대부터 미국을 중심으로 이온주입, MOCVD 또는 MBE와 같은 다양한 공정을 이용하여 제작되어 왔으며, 앞으로도 군수용 제품을 비롯하여 산업전반에서 더욱 각광을 받을 것으로 예상된다. 하지만 InSb는 77 K에서 0.225 eV의 상대적으로 작은 밴드갭을 갖고 있기 때문에 누설전류로 인한 성능저하가 고질적인 문제로 대두되었고, 이를 해결하기 위한 고품질 절연막 연구가 InSb 적외선 수광 소자 연구의 주요 이슈 중 하나가 되어왔다. PECVD, photo-CVD, anodic oxidation 등의 공정을 이용하여 $SiO_2$, $Si_3N_4$, 양극산화막(anodic oxide) 등 다양한 물질들에 대한 연구가 진행되었고[1,2], 산화막과 반도체 계면에서의 열확산을 억제하여 계면트랩밀도를 최소화하기 위한 연구도 활발히 이루어졌다[3]. 하지만 InSb 소자의 성능개선을 위한 최적화된 산화막에 대한 연구는 여전히 불충분한 실정이다. 본 연구에서는 n형 (100) InSb 기판 (n = 0.2 ~ $0.85\times10^{15}cm^{-3}$ @ 77 K)을 이용하여 양극산화막, $SiO_2$, $Si_3N_4$ 등을 증착하고 절연막으로서 이들의 특성을 비교 분석하였다. 양극산화막은 상온에서 1 N KOH 용액을 이용하여 양극산화법으로 증착하였으며, $SiO_2$, $Si_3N_4$는 PECVD로 $150^{\circ}C$에서 $300^{\circ}C$까지 온도를 변화시켜가며 증착하였다. SEM분석과 XPS분석으로 두께의 균일도와 절연막의 조성, 계면확산 정도를 확인하였으며, I-V와 C-V 커브측정을 통해 각 절연막의 전기적 특성을 평가하였다. 이 분석들을 통해 각각의 공정 조건에 따른 절연막의 상태를 전기적 특성과 관련지어 설명할 수 있었다.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2009년도 춘계학술발표대회
• /
• pp.28.1-28.1
• /
• 2009

The superior properties of ZnO such as high exciton binding energy, high thermal and chemical stability, low growth temperature and possibility of wet etching process in ZnO have great interest for applications ranging from optoelectronics to chemical sensor. Particularly, vertically well-aligned ZnO nanorods on large areas with good optical and structural properties are of special interest for the fabrication of electronic and optical nanodevices. Currently, low-dimensional ZnO is synthesized by metal-organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), thermal evaporation, and sol.gel growth. Recently, our group has been reported about achievement the growth of Ga-doped ZnO nanorods using ZnO seed layer on p-type Si substrate by RF magnetron sputtering system at high rf power and high growth temperature. However, the crystallinity of nanorods deteriorates due to lattice mismatch between nanorods and Si substrate. Also, in the growth of oxide using sputtering, the oxygen flow ratio relative to argon gas flow is an important growth parameter and significantly affects the structural properties. In this study, Phosphorus (P) doped ZnO nanorods were grown on c-sapphire substrates without seed layer by radio frequency magnetron sputtering with various argon/oxygen gas ratios. The layer change films into nanorods with decreasing oxygen partial pressure. The diameter and length of vertically well-aligned on the c-sapphire substrate are in the range of 51-103 nm and about 725 nm, respectively. The photoluminescence spectra of the nanorods are dominated by intense near band-edge emission with weak deep-level emission.

• 반도체디스플레이기술학회지
• /
• 제7권2호
• /
• pp.49-53
• /
• 2008

The yellow base polymer light emitting diodes(PLEDs) with double emission and hole blocking layers were prepared to improve the light efficiency. ITO(indium tin oxide) and PEDOT : PSS[poly(3,4-ethylenedioxythiophene) : poly(styrene sulfolnate)] were used as cathode and hole transport materials. The PFO[poly(9,9-dioctylfluorene)] and MEH-PPV[poly(2-methoxy-5(2-ethylhe xoxy)-1,4-phenylenevinyle)] were used as the light emitting host and guest materials, respectively. TPBI[Tpbi1,3,5-tris(N-phenylbenzimidazol-2-yl)benzene] was used as hole blocking layer. To investigate the optimization of device structure, we prepared four kinds of PLED devices with different structures such as single emission layer(PFO : MEH-PPV), two double emission layer(PFO/PFO : MEH-PPV, PFO : MEH-PPV/PFO) and double emission layer with hole blocking layer(PFO/PFO : MEH-PPV/TPBI). The electrical and optical properties of prepared devices were compared. The prepared PLED showed yellow emission color with CIE color coordinates of x = 0.48, y = 0.48 at the applied voltage of 14V. The maximum luminance and current density were found to be about 3920 cd/$m^2$ and 130 mA/$cm^2$ at 14V, respectively for the PLED device with the structure of ITO/PEDOT : PSS/PFO/PFO : MEH-PPV/TPBI/LiF/Al.

• 한국수소및신에너지학회논문집
• /
• 제31권2호
• /
• pp.169-176
• /
• 2020

There is a growing interest in hydrogen energy utilization since an alternative energy development has been demanded due to the depletion of fossil fuels. Hydrogen is produced by the reforming reaction of natural gas and biogas, and the electrolysis of water. An solid oxide electrolyte cell (SOEC) is reversible system that generates hydrogen by electrolyzing the superheated steam or producing the electricity from a fuel cell by hydrogen. If the water can be converted into steam by waste heat from other processes it is more efficient for high-temperature electrolysis to convert steam directly. The reasons are based upon the more favorable thermodynamic and electrochemical kinetic conditions for the reaction. In the present study, steam at over 180℃ and 3.4 bars generated from a boiler were converted into superheated steam at over 700℃ and 3 bars using a cylindrical steam superheater as well as the waste heat of the exhaust gas at 900℃ from a solid refuse fuel combustor. Superheated steam at over 700℃ was then supplied to a high-temperature SOEC to increase the hydrogen production efficiency of water electrolysis. Computational fluid dynamics (CFD) analysis was conducted on the effects of the number of 90° elbow connector for piping, insulation types and insulation layers of pipe on the exit temperature using a commercial Fluent simulator. For two pre-heater injection method of steam inlet and ceramic wool insulation of 100 mm thickness, the highest inlet temperature of SOEC was 744℃ at 5.9 bar.

• 한국전기전자재료학회논문지
• /
• 제11권12호
• /
• pp.1122-1127
• /
• 1998

Group II-AF_2$films such as $CaF_2$, $SrF_2$, and $BaF_2$ have been commonly used many practical applications such as silicon on insulatro(SOI), three-dimensional integrated circuits, buffer layers, and gate dielectrics in filed effect transistor. This paper presents electrical and structural properties of fluoride films as a gate dielectric layer. Conventional gate dielectric materials of TFTs like oxide group exhibited problems on high interface trap charge density($D_it$), and interface state incorporation with O-H bond created by mobile hydrogen and oxygen atoms. To overcome such problems in conventional gate insulators, we have investigated $CaF_2$ films on Si substrates. Fluoride films were deposited using a high vacuum evaporation method on the Si and glass substrate. $CaF_2$ films were preferentially grown in (200) plane direction at room temperature. We were able to achieve a minimum lattice mismatch of 0.74% between Si and $CaF_2$ films. Average roughness of $CaF_2$ films was decreased from 54.1 ${\AA}$ to 8.40 ${\AA}$ as temperature increased form RT and $300^{\circ}C$. Well fabricated MIM device showed breakdown electric field of 1.27 MV/cm and low leakage current of $10^{-10}$ A/$cm^2$. Interface trap charge density between $CaF_2$ film and Si substrate was as low as $1.8{\times}10^{11}cm^{-2}eV^{-1}$.

• 한국주조공학회지
• /
• 제29권3호
• /
• pp.120-127
• /
• 2009

The characterestics of high Si-high Mo ductile cast iron, high Si-high Mo C.V. cast iron and Ni-resist cast iron were compared and evaluated. The nodule count of the last one was lower and the nodularity was higher than those for the first one, respectively. The first two had ferritic matrices with small amounts of molybdenum carbides. The first one had the highest tensile strength and the last one the lowest elongation. This had the highest high temperature strength and that of the second one was greatly increased from the room temperature strength. The volumes of the first two were decreased during cooling and that of the last one changed little. The thermal expansion coefficient of the last one was the highest and the first one the lowest. During high temperature oxidation, even though the volume of the first one was increased, the weight was decreased and the volume and weight of the second one were increased. The change of the increased weight of the last one was more than that of thickness.