• Transactions of Materials Processing
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• v.16 no.1 s.91
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• pp.54-60
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• 2007

Optimum injection molding condition for a box mold was searched by the Response Surface Analysis(RSA) with the aid of process monitoring system(PMS). Process variables on the control panel of the injection molding machine such as barrel temperatures, screw speed profile, holding pressures, etc. cannot guarantee the uniformity of the material variables directly related with the state of the product in the mold cavity. In order to make sure the state of the resin in the cavity, pressures and temperatures in the cavity, runner and nozzle were monitored in the experiment with the PMS. To accomplish the consistency of the molding process, dependent variables such as the switchover point and holding time were searched with the PMS. With a proper objective function about deflection of the box-type product, the optimum injection molding condition was obtained.

• Journal of Advanced Marine Engineering and Technology
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• v.24 no.1
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• pp.59-66
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• 2000

To investigate the optimum brazing condition, variation of bonded structure and mechanical properties of novel brazed pure Al with bonding condition (brazing temperature, time and Si/flux ratio) was studied. A basic study of the bonding mechanism was also examined. The optimum brazing condition was obtained at $590^{\circ}$ for 2 minutes and the bonded structure showed that it is composed of almost entirely eutectic Al-Si with near eutectic composition. At higher brazing temperature $630^{\circ}$, hypoeutectic Al-Si structure was observed in the bonded area and resulted in erosion of base metal. The thickness of eutectic layer formed in optimum brazing temperature increased linearly with the square root of time, showing a general diffusion controlled process. The ultimate tensile strength of bonded joint brazed at an optimum brazing condition was about 60% of base metal and its fracture surface showed a brittle mode.

• Textile Coloration and Finishing
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• v.6 no.4
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• pp.62-71
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• 1994

The weighting increase varies with the condition of tannin-weight process and effects dyeability and physical properties of silk. The purpose of this study is to investigate the optimum condition of tannin-weighting process of silk and the effect of tannin-weighting process on dyeability and properties of silk. The methods of this study are first to examine the change according to the variables such as, weight increase of silk, temperature(30, 50, 70, 80, 9$0^{\circ}C$), time(30, 60, 120, 180, 240, 300min), tannin concentration(3, 5, 10, 20, 30g/l) in order to present the optimum condition, sencond to examine the change of the properties such as surface morphology, strength, elongation, mechanical values, dyeing condition, Basic and Acid dye absorption on silk which are tannin-weight processed in the optimum condition.

• Journal of Korean Society of Water and Wastewater
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• v.14 no.4
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• pp.311-317
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• 2000

The operation of flocculation process and the evaluation thereof have been mainly based on G, t and $G{\times}t$ values which are available from design guidelines and texts. However, their suggested ranges are too wide to find the optimum condition specific to a particular water treatment plant and none of the existing method can be used to evaluate and suggest the optimum operational condition. Recently, a commercially available particle counter is found to be useful in determining the flocculation process based on the particle dynamics. The optimum condition is defined as one that best suits the purpose of flocculation; the number of small particles should decrease, while that of large particles should increase. The experiments were performed at two conventional water treatment plants in Korea, one with horizontal mechanical flocculators, and another with vertical type mechanical flocculators. In this paper, experiences to evaluate the flocculation process and to suggest the optimum operation condition will be presented. Although particle counting method is found to be beneficial compared to any other existing methods, the optimum condition is very much site-specific and should be evaluated at each water treatment plant for different conditions.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.26-32
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• 2012

Polishing is one of the important methods in manufacturing of Si wafers and in thinning of completed device wafers. This study will report the characteristic of wafer according to processing time, machining speed and pressure which have major influence on the abrasion of Si wafer polishing. It is possible to evaluation of wafer abrasion by load cell and infrared temperature sensor. The characteristic of wafer surface according to processing condition is selected to use a result data that measure a pressure, machining speed, and the processing time. This result is appeared by the characteristic of wafer surface in machining condition. Through that, the study cans evaluation a wafer characteristic in variable machining condition. It is important to obtain optimal condition. Thus the optimum condition selection of ultra precision Si wafer polishing using load cell and infrared temperature sensor. To evaluate each machining factor, use a data through each sensor. That evaluation of abrasion according to variety condition is selected to use a result data that measure a pressure, machining speed, and the processing time. And optimum condition is selected by this result.

• Transactions of the Korean Society of Automotive Engineers
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• v.18 no.4
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• pp.68-73
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• 2010

Welding conditions in process of spot welding must become optimum and need to guarantee stability and reliability of vehicle body considering dynamic load history. Because welding parameters in process of spot welding are various, it is difficult that the quality of spot weldment was included in the optimum levels. In this paper, we found the optimum welding conditions satisfying KS spot welding qualities using genetic algorithm and spot welding experiments of high tensile strength steel and galvanized steel. Those experiments were dissimilar weld and 2-lap spot welding. Genetic algorithm created random welding condition after that, selected optimum individuals by probability concept.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.4
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• pp.142-148
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• 2008

This study aims to find the optimal cutting conditions, which are obtained by grinding condition, and the grinding characteristics and condition of constant velocity joint were investigated with respect to wheel velocity, depth of cut, feed speed. Grinding machine has been widely used in manufacturing optical reflects of metal. Such as steel are easy to be machined because of their proper material. As a result I obtained the data of grinding conditions makes good surface roughness and the optimal condition of grinding and get the mesh condition. The purpose of this study is to find the optimum grinding wheel characteristics for cutting constant velocity joint.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.7 no.4
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• pp.37-43
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• 2008

Working condition is one of the most important factors in precision working. In this study, we optimized the vibration acceleration level(VAL) of Al 2024 alloy to select optimum working condition of side wall end-milling using RSM(Response Surface Methodology). RSM was well adapted to make analytic model for minimizing vibration acceleration, created the objective function and saved a great deal of computational time. Therefore, it is expected that the proposed optimization procedure using RSM can be easily utilized to solve the optimization problem of working condition. The experimental results of the surface roughness and VAL showed the validity of the proposed working condition of side wall end-milling as it can be observed.

• Korean Chemical Engineering Research
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• v.53 no.2
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• pp.181-192
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• 2015

The aim of this study is to obtain optimum process condition for using two tower distribution to recycle the waste Propylene Glycol Monomethyl Ether Acetate (PGMEA) that is formed after washing LCD. The optimum process condition for the content of PGMEA, which is dependent variable, at 1st distillation was calculated according to Bottom temperature (BTM temperature), Reflux amount, Feed amount, Feed temperatures, and the optimum process conditions and optimum factors for the content of PGMEA at 2nd distillation according to Bottom temperature (BTM temperature), Reflux amount, Feed amount, Feed temperatures. At 1st distillation, Reflux amount, Feed amount, and Feed temperature are significant variables. However, it is found that the BTM temperature range is not significant in the range of process condition used in this study. The optimum process conditions are based on $5700{\ell}$ of Feed amount, $2500{\ell}$ of Reflux amount, $165^{\circ}C$ of BTM temperature, and $130^{\circ}C$ of Feed temperature. For the this condition, the predicted content of PGMEA was calculated as 92.12~94.62%. Significant factors at 2nd distillation are Reflux amount, Feed amount, and BTM temperature. Multicollinearity is between Reflux amount and BTM temperature. BTM was omitted in the multiple regression equation because there is a strong positive correlation between Reflux amount and BTM temperature. Base on $199^{\circ}C$ of BTM temperature, The optimum process conditions are based on $4275{\ell}$ of Feed amount, $6200{\ell}$ of Reflux amount and $130^{\circ}C$ of Feed temperature. In this condition, the predicted content of PGMEA was calculated as 99.0~99.5%.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.1
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• pp.1-6
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• 2012

The polishing of silicon wafers has an important role in semiconductor manufacturing. Generally, getting a flat surface such as a mirror is the purpose of the process. The wafer surface roughness is affected by many variables such as the characteristics of the carrier head unit, operation, speed, the pad and slurry temperature. Optimum process conditions for experimental temperature, pH value, down-force, slurry ratio are investigated, time is used as a fixed factor. This study carried out a series of experiments at varying platen, chuck rpm and oscillation cpm taking particular note of the difference between the rpm and the affect it has on the surface roughness. In this experiment determine the optimum conditions for polishing silicone wafers.