• Title/Summary/Keyword: Optical Element

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Fabrication and Characteristic Analysis of a Holographic Head-Mounted Display (홀로그래픽 Head-Mounted Display 소자의 제작 및 특성분석)

  • 김희동;정만호
    • Proceedings of the Optical Society of Korea Conference
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    • 2001.02a
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    • pp.200-201
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    • 2001
  • 헬멧 장착형 HMD(Head-Mounted Display) 시스템은 비행기 조종사나 저격수의 시선을 크게 움직이지 않고 군사 전술상의 현재 상태를 볼 수 있도록 하여 눈의 피로감을 줄이고 시선의 이동에 의한 돌발적인 사고의 위험을 감소시킬 수 있어 군사적으로 유용한 장치이다 HOE(Holographic Optical Element)의 중요한 응용 분야 중 하나로 HMD에서의 결상 렌즈 또는 광 결합기가 있다 HMD 시스템에서 HOE의 역할은 2차원의 단색 디스플레이 영상을 헬멧 착용자의 눈에 반사하여 결상시키는 것이다. (중략)

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Microlasers and Microfilters: Principles and Possible Applications

  • Chang, Richard K.
    • Proceedings of the Optical Society of Korea Conference
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    • 2001.02a
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    • pp.1-1
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    • 2001
  • Microlasers grown on a chip without any distributed Brags reflectors to provide the feedback are potentially useful for integrated optics, particularly if the laser emission in the plane is unidirectional and this direction can be switched. Microfilters performing as add/drop devices and bandpass units are now considered the most needed optical element for the DWDM field. The talk will concentrate on our research effort in GaN microlasers with non-circular shapes and in dielectric microfilters with oval and square shapes. (omitted)

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Embodiment of all-optical switching phenomena on a GaAs waveguide

  • Lee, Sang-Jae
    • Journal of Sensor Science and Technology
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    • v.5 no.5
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    • pp.85-95
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    • 1996
  • Based on the transmission of coupled gap solitons in nonlinear periodic media, we present an all-optical switching scheme which has a novel architecture and principle. The proposed switch with an extremely small switching element can be realized on a semiconductor waveguide. We here investigate the switching performance with a GaAs waveguide in order to give criteria for the experimental realization of the all-optical switching phenomena. We also suggest a variation of an index-matching scheme to solve the technical problem such as the input-energy coupling into a periodic waveguide.

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A Study on Design and Analysis for Magnetic Lenses of a Scanning Electron Microscope using Finite Element Method (유한요소법을 사용한 주사전자 현미경의 전자렌즈 설계 및 해석에 관한 연구)

  • Park, Keun;Jung, Hyun-Woo;Park, Man-Jin;Kim, Dong-Hwan;Jang, Dong-Young
    • Journal of the Korean Society for Precision Engineering
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    • v.24 no.9
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    • pp.95-102
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    • 2007
  • The scanning electron microscope (SEM) is one of the most popular instruments available for the measurement and analysis of the micro/nano structures. It is equipped with an electron optical system that consists of an electron beam source, magnetic lenses, apertures, deflection coils, and a detector. The magnetic lenses playa role in refracting electron beams to obtain a focused spot using the magnetic field driven by an electric current from a coil. A SEM column usually contains two condenser lenses and an objective lens. The condenser lenses generate a magnetic field that forces the electron beams to form crossovers at desired locations. The objective lens then focuses the electron beams on the specimen. The present work concerns finite element analysis for the electron magnetic lenses so as to analyze their magnetic characteristics. To improve the performance of the magnetic lenses, the effect of the excitation current and pole-piece design on the amount of resulting magnetic fields and their peak locations are analyzed through the finite element analysis.

Cure simulation in LED silicone lense using dynamic reaction kinetics method (승온 반응속도식을 이용한 LED용 실리콘 렌즈의 경화공정해석)

  • Song, Min-Jae;Hong, Seok-Kwan;Park, Jeong-Yeon;Lee, Jeong-Won;Kim, Heung-Kyu
    • Design & Manufacturing
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    • v.8 no.2
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    • pp.46-49
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    • 2014
  • Silicone is recently used for LED chip lense due to its good thermal stability and optical transmittance. In order to predict residual stress which causes optical briefringence and mechanical warpage of silicone, finite element analysis was conducted for curing process during silicone molding. For analysis of curing process, a dynamic cure kinetics model was derived based on the differential scanning calorimetry(DSC) test and applied to the material properties for finite element analysis. Finite element simulation result showed that the slow cure reduced abrupt reaction heat and it was predicted decrease of the residual stress.

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The Study on the Luminescent Element of Electro Chromisn in Polyelectrolyte (고분자전해질 Electro Chromism의 발광소자에 관한 연구)

  • 국상훈;고두석
    • The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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    • v.2 no.1
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    • pp.65-74
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    • 1988
  • For experiment, we made the electro chemical display element with the NESA glass of display electrode which had low resistance. Density of injection charge, optical density and response characteristics were observed through coloring and achromatizing phemomena in the display element As optical electric chemical reaction was occured in $WO_3$ and cell, it was possible to repeat colouring and achromatizing, and the colouring characteristics was good. And the higher colouring and achromatizing voltage, the lower resistance of electrode and the thinner $WO_3$film was, the better response characteristics. With analyzing phenomena of electro chromism, we could find the possibility of practical use of the coloring and achromatizing element for clock, instrument and guide plate.

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Dynamic Response Measurement of the Head Arm Assembly of a Hard Disk Drive by Numerical Analysis and Experiments

  • Parlapalli, Madhusudhana R;Bin, Gu;Dongwei, Shu;Fujii, Yusaku
    • International Journal of Precision Engineering and Manufacturing
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    • v.9 no.4
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    • pp.22-25
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    • 2008
  • The dynamic response of the head arm assembly (HAA) of a hard disk drive to an impact load was obtained from a 3D non-linear finite element model using ANSYS/LS-DYNA and from experiments using a modified levitation mass method (LMM). In the finite element model, the impact load was created by modeling the mass as a rigid body and making it collide with the HAA. The velocity, displacement, acceleration, and inertial force of the mass were then obtained from the time history data of the finite element analysis. In the LMM, a mass that was levitated with an aerostatic linear bearing, and hence encountered negligible friction, was made to collide with the actuator arm, resulting in a dynamic bending test for the arm. During the collision, the Doppler frequency shift of the laser beam reflected from the mass was accurately measured with an optical interferometer. The velocity, displacement, acceleration, and inertial force of the mass were accurately calculated from the measured time-varying Doppler frequency shift. A good correlation between the experimental data and FEA results was observed. The FEA was also used to investigate the dynamic response of the HAA to impact by different masses.

A Software Architecture for High-speed PCE (Path Computation Element) Protocol (고성능 PCE (Path Computation Element) 프로토콜 소프트웨어 구조)

  • Lee, Wonhyuk;Kim, Seunhae;Kim, Hyuncheol
    • Convergence Security Journal
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    • v.13 no.6
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    • pp.3-9
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    • 2013
  • With the rapidly changing information communication environment and development of technologies, the informati on networks are evolved from traditional fixed form to an active variable network that flexible large variety of data can be transferred. To reflect the needs of users, the next generation using DWDM (Dense Wavelength Division M ultiplexing) transmission system and OXC (Optical Cross Connect) form a dynamic network. After that GMPLS (Ge neralized Multi-Protocol Label Switching) can be introduced to dynamically manage and control the Reconfigurable Optical Add-drop Multiplexer (ROADM)/Photonic Cross Connect (PXC) based network. This paper propose a softw are architecture of Path Computation Element (PCE) protocol that has proposed by Internet Engineering Task Force (IETF) to path computation. The functional blocks and Application Programming Interface (API) of the PCE protoco l implementation are also presented.

Fatigue Life Analysis for Solder Joint of Optical Thin Film Filter Device (다층 박막 광학 필터 디바이스의 패키징시 솔더 조인트의 피로파괴 수명 해석)

  • 김명진;이형만
    • Journal of the Microelectronics and Packaging Society
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    • v.10 no.2
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    • pp.19-26
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    • 2003
  • Plastic and creep deformations of a solder joint on thermal cycle play an important role in the reliability of optical telecommunication components. Solder joint strain is increased with the thermal cycle time and it causes mis-alignments and power loss in the optical component. Furthermore, the component can be failed since the deformation exceed the limitation of the fatigue life. We applied the finite element analysis method to solve the problem of the solder joint reliability on thermal cycle. Plastic and creep deformations are calculated by the finite element method. And, the fatigue lire is predicted by using creep-fatigue prediction models with calculated strains. The temperature conditon of the analysis was referred from the Telcordia reliability schedule (-40 to 75). Also, the three ramp renditions, 1/min, 10/min and 50/min, and dwelling time were considered to analyze the differences of results.

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