• 한국정보통신학회논문지
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• 제18권1호
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• pp.103-108
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• 2014

스마트폰과 같은 휴대용 기기에서 많이 사용되는 플래쉬 메모리는 비휘발성 저장장치로 작은 크기에 대용량 데이터를 안정적으로 저장할 수 있는 장점을 가지고 있다. 플래쉬 메모리에 저장된 대용량 데이터에 대한 질의 연산을 효율적으로 처리하기 위하여 색인을 사용해야 한다. 그러나 플래쉬 메모리는 쓰기 연산의 속도가 느리고 덮어쓰기 연산을 지원하지 않기 때문에 기존의 색인을 평가하고 개선점을 파악할 필요가 있다. 이 논문에서는 플래쉬 메모리에 적용한 공간분할 기법의 공간 색인에 대한 성능을 평가한다. 이를 위하여 고정그리드파일을 구현하여 다양한 환경에서 질의 연산과 변경 연산의 평균 연산 수행 속도를 측정한다. 그리고 자기디스크 저장장치에서의 수행속도와 비교한다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권4호
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• pp.505-513
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• 2017

As mobile systems are performing various functionality in the IoT (Internet of Things) era, network-on-chip (NoC) plays a pivotal role to support communication between the tens and in the future potentially hundreds of interacting modules in system-on-chips (SoCs). Owing to intensive research efforts more than a decade, NoCs are now widely adopted in various SoC designs. Especially, studies on application-specific NoCs (ASNoCs) that consider the heterogeneous nature of modern SoCs contribute a significant share to use of NoCs in actual SoCs, i.e., ASNoC connects non-uniform processing units, memory, and other intellectual properties (IPs) using flexible router positions and communication paths. Although it is not difficult to find the prior works on ASNoC synthesis and optimization, little research has addressed the issues how to convert different protocols and data widths to make a NoC compatible with various IPs. Thus, in this paper, we address important issues on ASNoC implementation to support and convert multiple interfaces. Based on the in-depth discussions, we finally introduce our FPGA-proven full-custom ASNoC.

• 마이크로전자및패키징학회지
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• 제19권4호
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• pp.45-50
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• 2012

A family of multi-die DRAM packages was developed that incorporate the full functionality of an SODIMM into a single package. Using a common ball assignment analogous to the edge connector of an SODIMM, a broad range of memory types and assembly structures are supported in this new package. In particular DDR3U, LPDDR3 and DDR4RS are all supported. The center-bonded DRAM use face-down wirebond assembly, while the peripherybonded LPDDR3 use the face-up configuration. Flip chip assembly as well as TSV stacked memory is also supported in this new technology. For the center-bonded devices (DDR3, DDR4 and LPDDR3 ${\times}16$ die) and for the face up wirebonded ${\times}32$ LPDDR3 devices, a simple manufacturing flow is used: all die are placed on the strip in a single machine insertion and are sourced from a single wafer. Wirebonding is also a single insertion operation: all die on a strip are wirebonded at the same time. Because the locations of the power signals is unchanged for these different types of memories, a single consolidated set of test hardware can be used for testing and burn-in for all three memory types.

• 한국자기학회지
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• 제18권3호
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• pp.103-108
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• 2008

비휘발성 메모리 분야에서 MRAM이 큰 주목을 받지 못하는 이유는 일반적인 비휘발성 메모리에 비해 기록용량이 작다는 문제를 안고 있기 때문이다. 이러한 문제는 MRAM의 일반적인 구조가 자기 효율이 떨어지는 구조를 가지고 있기 때문이다. MRAM이 고용량화 되기 위해선 한 셀의 구조가 작아져야 하는데 두 전류라인만을 이용하는 일반적인 구조에선 큰 기록 필드를 발생시킬 수 없기에 셀의 구조를 작게하는 것은 불가능하다. 본 논문에서는 MRAM의 기록층 양단에 큰 투자율을 가진 Pole을 추가한 형태의 새로운 MRAM을 제안하고 있다. 새로이 고안된 MRAM은 일반적인 MRAM에 비해 자기효율이 크게 향상 되기 때문에 큰 기록 필드를 발생시킬 수 있기 때문에 보자력이 큰 기록 층을 사용할 수 있고 이로 인해 한 셀의 사이즈를 줄일 수 있게 된다. 본 연구는 3차원 유한요소법을 사용하여 진행 되었다.

• Nuclear Engineering and Technology
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• 제53권10호
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• pp.3327-3334
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• 2021

Present electric grids are advanced to integrate smart grids, distributed resources, high-speed sensing and control, and other advanced metering technologies. Cybersecurity is one of the challenges of the smart grid and nuclear plant digital system. It affects the advanced metering infrastructure (AMI), for grid data communication and controls the information in real-time. The research article is emphasized solving the nuclear and smart grid hardware security issues with the integration of field programmable gate array (FPGA), and implementing the latest Time Authenticated Cryptographic Identity Transmission (TACIT) cryptographic algorithm in the chip. The cryptographic-based encryption and decryption approach can be used for a smart grid distribution system embedding with FPGA hardware. The chip design is carried in Xilinx ISE 14.7 and synthesized on Virtex-5 FPGA hardware. The state of the art of work is that the algorithm is implemented on FPGA hardware that provides the scalable design with different key sizes, and its integration enhances the grid hardware security and switching. It has been reported by similar state-of-the-art approaches, that the algorithm was limited in software, not implemented in a hardware chip. The main finding of the research work is that the design predicts the utilization of hardware parameters such as slices, LUTs, flip-flops, memory, input/output blocks, and timing information for Virtex-5 FPGA synthesis before the chip fabrication. The information is extracted for 8-bit to 128-bit key and grid data with initial parameters. TACIT security chip supports 400 MHz frequency for 128-bit key. The research work is an effort to provide the solution for the industries working towards embedded hardware security for the smart grid, power plants, and nuclear applications.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.1141-1144
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• 2003

For proper communication with various types of IC-Card, multiple IC-Card interface complying with the IC-Card standard (ISO7816) is embedded and realized as a peripheral on the 32-bit RISC based system-on-a-chip. It provides the generation of either 3.3V or 5V power supply for the operation of the inserted IC-Card as well. IC-Card interface is divided into an analog front-end (AFE) and a digital back-end (DBE). The embedded DC-DC converters suitable for driving IC-Cards are incorporated in the AFE. The chip design for multiple IC-Card interface is implemented on a standard 0.35${\mu}{\textrm}{m}$ triple-metal double-poly CMOS process and is packaged in a 352-pin plastic ball grid array (PBGA). The total gate count is about 400,000, excluding the internal memory. Die area is 7890${\mu}{\textrm}{m}$ $\times$ 7890${\mu}{\textrm}{m}$.

• JSTS:Journal of Semiconductor Technology and Science
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• 제13권2호
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• pp.114-126
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• 2013

In this paper, we present a set of methodologies to model the electromagnetic susceptibility (EMS) testing of I/O buffers for mobile system memory based on the bulk current injection (BCI) method. An efficient equivalent circuit model is developed for the current injection probe, line impedance stabilization network (LISN), printed circuit board (PCB), and package. The simulation results show good correlation with the measurements and thus, the work presented here will enable electromagnetic susceptibility analysis at the integrated circuit (IC) design stage.

• Journal of information and communication convergence engineering
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• 제17권4호
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• pp.279-284
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• 2019

This paper presents processing-node status-based message scattering and gathering algorithms for multi-processor systems on chip to reduce the communication time between processors. In the message-scattering part of the message-passing interface (MPI) scatter function, data transmissions are ordered according to the proposed linear algorithm, based on the processor status. The MPI hardware unit in the root processing node checks whether each processing node's status is 'free' or 'busy' when an MPI scatter message is received. Then, it first transfers the data to a 'free' processing node, thereby reducing the scattering completion time. In the message-gathering part of the MPI gather function, the data transmissions are ordered according to the proposed linear algorithm, and the gathering is performed. The root node receives data from the processing node that wants to transfer first, and reduces the completion time during the gathering. The experimental results show that the performance of the proposed algorithm increases at a greater rate as the number of processing nodes increases.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2005년도 추계종합학술대회
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• pp.651-654
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• 2005

In this paper, we designed ECC(Elliptic Curve Cryptographic) Processor with Bus-splitting mothod for embedded SoC. ECC SIP is designed by VHDL RTL modeling, and implemented reusably through the procedure of logic synthesis, simulation and FPGA verification. To communicate with ARM9 core and SIP, we designed SIP bus functional model according to AMBA AHB specification. The design of ECC Processor for platform-based SoC is implemented using the design kit which is composed of many devices such as ARM9 RISC core, memory, UART, interrupt controller, FPGA and so on. We performed software design on the ARM9 core for SIP and peripherals control, memory address mapping and so on.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.333-334
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• 2008

With the role of cell phones in today's society as a digital personal assistant as well as the primary tool for personal communication, it is possible to imagine the involvement of cell phones in almost any type of crime. The progression of a criminal investigation can hinge on vital clues obtained from a cell phone. This paper will be concentrated on CDMA system phones and focus on the data extraction for cell phone forensics. Especially, the data acquisition method of JTAG interface access to memory chip will be covered.