• 한국전기전자재료학회논문지
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• 제16권5호
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• pp.390-396
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• 2003

As the design rule of device continued to shrink, the contact resistance in small contact size became important. Although the conventional TiN/Ti structure as a ohmic layer has been widely used, we propose a new TiN/Co film structure. We characterized a contact resistance by using a chain pattern and a KELVIN pattern, and a leakage current determined by current-voltage measurements. Moreover, the microstructure of TiN/ Ti/ silicide/n$\^$+/ contact was investigated by a cross-sectional transmission electron microscope (TEM). The contact resistance by the Co ohmic layer showed the decrease of 26 % compared to that of a Ti ohmic layer in the chain resistance, and 50 ％ in KELYIN resistance, respectively. A Co ohmic layer shows enough ohmic behaviors comparable to the Ti ohmic layer, while higher leakage currents in wide area pattern than Ti ohmic layer. We confirmed that an uniform silicide thickness and a good interface roughness were able to be achieved in a CoSi$_2$ Process formed on a n$\^$+/ silicon junction from TEM images.

• Journal of Electrochemical Science and Technology
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• 제12권3호
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• pp.358-364
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• 2021

In this study, an anion exchange membrane water electrolysis (AEMWE) cell was operated for ~1000 h at a voltage bias of 1.95 V. Impedance spectra were regularly measured every ~ 100 h, and changes in the ohmic and non-ohmic resistance were traced as a function of time. While there was relatively little change in the I-V curves and the total cell resistance during the long-term test, we observed various electrochemical phenomena in the cell: 1) initial activation with a decrease in both ohmic and non-ohmic resistance; 2) momentary and non-permanent bubble resistance (non-ohmic resistance) depending on the voltage bias, and 3) membrane degradation with a slight increase in the ohmic resistance. Thus, the regular test protocol used in this study provided clear insights into the performance degradation (or improvement) mechanism of AEMWE cells.

• 한국세라믹학회지
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• 제35권10호
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• pp.1070-1077
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• 1998

Effect of current collecting layer on the cathode was characterized by AC impedance spectroscopy at 800$^{\circ}C$ under flowing air. LSM-YSZ composite cathode showed lower polarization resistance due to the in-crease of triple phase (LSM/YSZ/Pore) boundary length by incorporation of YSZ. Ohmic resistance {{{{ {R }_{1 } }} of LSM-YSZ was higher than that of pure LSM however because in-plane resistance of the cathode was fair-ly high due to its high specific resistivity. To reduce the in-plane resistance of LSM-YSZ cathode cathode side current collecting layer was required. Ohmic resistance {{{{ {R }_{1 } }} was reduced after forming LSM current col-lecting layer on the LSM-YSZ cathode. In case of pure LSM cathode the formation of Pt, or LSCO current collecting layer reduced polarization resistance {{{{ {R }_{p } }} but ohmic resistance {{{{ {R }_{1 } }} was relatively constant. After annealing of LSM cathode with Pt current collector at higher temperature polarization resistance {{{{ {R }_{p } }} was in-creased but ohmic resistance {{{{ {R }_{1 } }} was constant. These phenomena indicate that Pt or LSCo current col-lecting layers act as a catalytic layer for oxygen reduction of pure LSM cathode. LSCO current collector was effective in reducing the ohmic and polarization resistance of LSM-YSZ cathode.

• 대한전자공학회논문지
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• 제26권10호
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• pp.1545-1553
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• 1989

The ohmic contact behavior in HEMT structure was compared with that in MESFET one throughout the specific contact resistance and microstructural change in both structures. A Au-Ge-Ni based metallization scheme was used and the alloying temperature of the ohmic materials was changed from 330\ulcorner to 550\ulcorner. The alloying temperature to obtain the minimum specific contact resistance in HEMT structure was 60k higher than that in MESFET. The volume fraction of NiAs (Ge) in MESFET structure increases with alloying temperature and/or the alloying time, which makes the decrease of specific contact resistance at the initial stage of ohmic metallization. In contrast, the volume fraction of NiAs(Ge) in HEMT structure was not dependent upon the specific contact resistance, which implies that the ohmic contacts are dominantly formed by the Ge diffusion to 2-DEG(two dimensional electron gas) layer.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.208-209
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• 2008

Ni/Ti/Al multilayer system was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Compared with conventional process using Ni, Ni/Ti/Al contact shows perfect ohmic behavior, and possesses much lower contact resistance of about $2.5\times10^{-4}\Omega{\cdot}cm^2$ after $930^{\circ}C$ RTA, which is about 2 orders of magnitude smaller than that of Ni contact. Contact resistance gradually increased as the RTA temperature was lowered in the range of 840 ~ $930^{\circ}C$, and about $3.4\times10^{-4}\Omega{\cdot}cm^2$ was obtained at the lowest RTA temperature of $840^{\circ}C$. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.224-224
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• 2010

Pt와 ITO 상부전극의 top-electode/NiO/Pt 구조에서 resistance switching현상을 연구하였다. 하부전극물질이 resistance switching현상에 미치는 영향은 이미 연구되었다. Ohmic 이나 low Schottky contact은 NiO 박막의 resistance switching 현상은 높은 전기장의 인가에 의해 것이 나타나는 것은 알 수 있었다. Ohmic contact에서는 유도전기장에 의한 resistance switching 현상들을 관찰할 수 있다. low Schottky barrier를 가지는 ITO/NiO/Pt 구조에서 resistances switching현상은 관찰되지 않고 Pt/ITO구조로 Ohmic 접촉은 유도전기장에 의한 resistance switching 현상이 나타나지 않음을 알 수 있었다.

• 한국전기전자재료학회논문지
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• 제21권11호
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• pp.968-972
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• 2008

Ni/Ti/Al multilayer system ('/'denotes the deposition sequence) was tested for low-resistance ohmic contact formation to Al-implanted p-type 4H-SiC. Ni 30 nm / Ti 50 nm / Al 300 nm layers were sequentially deposited by e-beam evaporation on the 4H-SiC samples which were implanted with Al (norminal doping concentration = $4\times10^{19}cm^{-3}$) and then annealed at $1700^{\circ}C$ for dopant activation. Rapid thermal anneal (RTA) temperature for ohmic contact formation was varied in the range of $840\sim930^{\circ}C$. Specific contact resistances were extracted from the measured current vs. voltage (I-V) data of linear- and circular transfer length method (TLM) patterns. In constrast to Ni contact, Ni/Ti/Al contact shows perfectly linear I-V characteristics, and possesses much lower contact resistance of about $2\sim3\times10^{-4}\Omega{\cdot}cm^2$ even after low-temperature RTA at $840^{\circ}C$, which is about 2 orders of magnitude smaller than that of Ni contact. Therefore, it was shown that RTA temperature for ohmic contact formation can be lowered to at least $840^{\circ}C$ without significant compromise of contact resistance. X-ray diffraction (XRD) analysis indicated the existence of intermetallic compounds of Ni and Al as well as $NiSi_{1-x}$, but characteristic peaks of $Ti_{3}SiC_2$, a probable narrow-gap interfacial alloy responsible for low-resistance Ti/Al ohmic contact formation, were not detected. Therefore, Al in-diffusion into SiC surface region is considered to be the dominant mechanism of improvement in conduction behavior of Ni/Ti/Al contact.

• 한국식품영양학회지
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• 제30권4호
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• pp.689-695
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• 2017

Ohmic heating is an internal heating method based on the principle that when an electrical current passes through food, electric resistance heat is uniformly generated internally by food resistance. Previous studies indicate that the thermal properties, external structure, internal structure, and swelling power of ohmic heat treated starch of various starches, such as potato, wheat, corn, and sweet potato, differed from those of conventional heating at the same temperature. In this study, the pasting property of starch, treated with ohmic and conventional heating, were measured by RVA (Rapid Visco-Analyzer). Our results show that as the ohmic heating temperature increased, the PV (Paste Viscosity) of the starch decreased significantly, and the PT (Pasting Temperature) increased. Changes in PV and PT indicate that the swelling of starch remains unchanged by ohm heating. The HPV (Hot Paste Viscosity), CPV (Cold Paste Viscosity) and SV (Setback Viscosity) of ohmic heated starch also differed from the conventional heated starch. The pasting property is similar to the viscosity curve of common cross-linked modified starch. In this experiment, we further confirm the similarity with modified starch and its usability.

• 한국가스학회지
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• 제28권1호
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• pp.65-72
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• 2024

재생에너지 자원이 풍부한 제주도에서 수전해 시스템을 활용하여 그린수소를 생산하는 실증단지를 준비 중이며, 수전해 시스템의 장기 운영시 상황을 검토하기 위하여, PEM 수전해 셀을 가속시험평가 하여 수전해 셀의 내구성을 검토하였고, 제주도 풍력기반의 전력패턴을 적용하였을 때 수전해 셀의 내구성을 검토하였다. 가속시험평가 (저전류-고전류 반복 인가)를 800시간 진행한 후, PEM 수전해 셀의 성능이 최대 10%, 운전조건에서 5.5% 감소되었으며, 임피던스 분석결과 PEM 수전해 셀의 Ohmic 저항보다 전극의 분극저항이 크게 증가한 것을 확인할 수 있다. 그리고 제주도의 풍력패턴을 적용하여 내구성평가를 진행한 경우, PEM 수전해 셀의 성능이 최대 1.6%, 운전 조건에서 1% 미만의 성능감소를 보여주었으며, 임피던스 결과 Ohmic 저항 및 전극의 분극저항의 변화가 작은 것을 알 수 있다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1995년도 추계학술대회 논문집
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• pp.63-66
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• 1995

The ohmic characterization of Au/Te/Au/n-GaAs structure is investigated by the application of x-ray diffraction, scanning electron microscopy, Auger electron spectroscopy, the specific contact resistance and I-V measurement. Increasing the annealing temperature, the results of XRD measurement show the sharpening of the Au-Ga peak and the increasing of the intensity of Au peak due to the crystallization. At 400$^{\circ}C$, which is the ohmic onset point, Ga$_2$Te$_3$peak gets evident and GaAs regrowth peak appears for the samples annealed at 500$^{\circ}C$. The variation of shottky contact to ohmic contact is confirmed by the I-V curve transition. The specific contact resistance of 3.8x10$\^$-5/$\Omega$-$\textrm{cm}^2$ is obtained for the sample annealed at 500$^{\circ}C$ and above 600$^{\circ}C$ the specific contact resistance increased due to the decomposition of GaAs substrate.