• Design & Manufacturing
• /
• 제17권3호
• /
• pp.28-33
• /
• 2023

The conventional FRP (Fiber Reinforced Plastic) manufacturing process used thermoset resins for ease of molding but faced the issue of non-recyclability. To address these shortcomings, a new process utilizing thermal plastic resin was developed. However, due to the high viscosity of thermal plastic resin, problems such as fiber deformation and a reduced fiber volume fraction occurred during the high-temperature, high-pressure process. In this study, to overcome the limitations of the conventional process, fiber-reinforced composite materials were manufactured through in-situ polymerization using PLA (Poly L-Lactide) resin in the VA-RTM (Vacuum Assistance Resin Transfer Molding) process. The fiber volume of the produced specimens was calculated, and resin impregnation and porosity were confirmed through optical microscopy. Additionally, molecular weight analysis using GPC (Gel Permission Chromatography) demonstrated improvements over the conventional process and emphasized the essential requirement of temperature control.

• 한국진공학회지
• /
• 제18권1호
• /
• pp.49-53
• /
• 2009

층간 절연막으로써 연구되고 있는 SiOC 박막의 화학적 변화에 대하여 살펴보았다. SiOC 박막의 형성은 알킬기와 수산기에 의한 극성분자의 조합에 의해 무분극성의 박막을 형성할 수 있고 무분극성에 의한 비정질 구조를 형성함으로써 유전상수의 감소를 유도할수 있다. 박막의 화학적인 특성은 이온의 변화에 의한 결정구조의 변화로 결정할수 있고, 화학적인 변화의 분석은 FTIR에 의한 탄소함량변화로부터 무분극성의 영역을 유추해 내었다. 전기적인 특성은 박막 내에서의 전자의 특성을 알아보는 것으로써 화학적인 특성과 반드시 일치하는 것은 아니다 유량변화에 따른 SiOC 박막의 전기적인 특성을 분석함으로써 화학적 특성의 변화와 어느 정도 상관성이 있는지를 조사하였다. SiOC 박막은 열처리 후 대체로 누설전류가 증가하는 것으로 나타났고 특히 탄소의 함량이 급격히 증가하는 샘플이 존재하였다. 그러나 탄소의 함량이 증가하였으나 누설전류는 상대적으로 작게 나타나는 것으로 보아 화학적인 관점에서 탄소의 증가는 박막의 구조변화에 따른 효과로 직접 전류에 기여하지 않는다고 볼 수 있다.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2003년도 춘계학술대회 논문집
• /
• pp.86-89
• /
• 2003

Chemical Mechanical Planarization(CMP) has been accepted as the most effective processes for ultra large scale integrated (ULSI) chip manufacturing. However, as the polishing process continues, pad pores get to be glazed by polishing residues, which hinder the supply of new slurry. And pad surface is ununiformly deformed as real contact distance. These defects make material removal rate(MRR) decrease with a number of polishied wafer. Also the desired within-chip planarity, within wafer non-uniformity(WIWNU) and wafer to wafer non-uniformity(WTWNU) arc unable to be achieved. So, pad conditioning in CMP Process is essential to overcome these defects. The eletroplated or brazed diamond conditioner is used as the conventional conditioning. And. allumina long fiber, the jet power of high pressure deionized water, vacuum compression. ultrasonic conditioner aided by cavitation effect and ceramic plate conditioner are once used or under investigation. But. these methods arc not sufficient for ununiformly deformed pad surface and the limits of conditioning effect. So this paper focuses on the characteristics of diamond conditioner which reopens glazed pores and removes ununiformly deformed pad away.

• 한국분말재료학회지
• /
• 제10권6호
• /
• pp.390-394
• /
• 2003

Ultra fine titanium carbide particles were synthesized by novel metallic thermo-reduction process. The vaporized TiC1$_4$+$CCl_4$ gases were reacted with liquid magnesium and the fine titanium carbide particles were then produced by combining the released titanium and carbon atoms. The vacuum treatment was followed to remove the residual phases of MgC1$_2$ and excess Mg. The stoichiometry, microstructure, fixed and carbon contents and lattice parameter were investigated in titanium carbide powders produced in various reaction parameters.

• 한국기계가공학회지
• /
• 제12권1호
• /
• pp.28-34
• /
• 2013

For the senses of beauty and texture, internal components of small passenger cars are manufactured by texturing plastic with drawplate but those of deluxe passenger cars are manufactured by bonding pre-embossed skin to the surface of drawplate. As the pre-embossed skin is bonded at high temperature and pressure, the pattern of skin is distorted. The corner part is hardened and its dimension tolerance is changed by resulting in the increase with its defective rate. This study provides the method to design and manufacture the door trim track by vacuuming the non-patterned skin to upper-side drawplate which forms the pattern of descending skin. It is pressed to the plastic product with hot-press method and the damage of bossed-pattern is prevented. Valuation in this study has been done by analyzing, designing and experimenting method.

• 대한치과의사협회지
• /
• 제52권12호
• /
• pp.783-794
• /
• 2014

Since the introduction of non-thermal atmospheric pressure plasma in the field of the dentistry, numerous applications have been investigated. Especially with its advantages over existing vacuum plasma in terms of portability, low cost, and non-thermal damage, it can be directly applied in the oral cavity, giving number of potentials for dental application. First, possible application of non-thermal atmospheric pressure plasma in the field of dentistry is relation to dental caries and periodontal diseases. Teeth and alveolar bones are one of the strongest bony structures in our body, but it cannot be regenerated when they are damaged by dental caries or periodontal disease. Hence many studies to prevent such diseases have been carried out, though no perfect solution has been found yet. With recent studies of modifying surfaces through non-thermal atmospheric pressure application that can prevent attachment of bacteria, or studies on bactericidal effects of non-thermal atmospheric pressure plasma can be applied here to prevent oral pathogen and 'biofilm' attachment to the surface of teeth or directly eliminate the dental caries/periodontal disease causing germs. Secondly, non-thermal atmospheric pressure application will be useful on the surface of dental implant. It is well known that the success of dental implant surgery depends on the process known as 'osseointegration' that result from osteoblast attachment, proliferation and differentiation. As the application of non-thermal atmospheric pressure plasma on the surface of dental implant just before its introduction by the chair-side of dental surgery. Despite its long history, the generation of non-thermal atmospheric pressure plasma has been greatly increased with its application in dentistry.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
• /
• pp.150-150
• /
• 2016

Mankind is enjoying a great convenience of their life by the rapid growth of secondary industry since the Industrial Revolution and it is possible due to the invention of huge power such as engine. The automobile which plays the important role of industrial development and human movement is powered by the Engine Module, and especially Diesel engine is widely used because of mechanical durability and energy efficiency. The main work mechanism of the Diesel engine is composed of inhalation of the organic material (coal, oil, etc.), combustion, explosion and exhaust Cycle process then the carbon compound emissions during the last exhaust process are essential which is known as the major causes of air pollution issues in recent years. In particular, COx, called carbon oxide compound which is composed of a very small size of the particles from several ten to hundred nano meter and they exist as a suspension in the atmosphere. These Diesel particles can be accumulated at the respiratory organs and cause many serious diseases. In order to compensate for the weak point of such a Diesel Engine, the DPF(Diesel Particulate Filter) post-cleaning equipment has been used and it mainly consists of ceramic materials(SiC, Cordierite etc) because of the necessity for the engine system durability on the exposure of high temperature, high pressure and chemical harsh environmental. Ceramic Material filter, but it remains a lot of problems yet, such as limitations of collecting very small particles below micro size, high cost due to difficulties of manufacturing process and low fuel consumption efficiency due to back pressure increase by the small pore structure. This study is to test the possibility of new structure by direct infiltration of SiC Whisker on Carbon felt as the next generation filter and this new filter is expected to improve the above various problems of the Ceramic DPF currently in use and reduction of the cost simultaneously. In this experiment, non-catalytic VS CVD (Vapor-Solid Chemical Vaporized Deposition) system was adopted to keep high mechanical properties of SiC and MTS (Methyl-Trichloro-Silane) gas used as source and H2 gas used as dilute gas. From this, the suitable whisker growth for high performance filter was observed depending on each deposition conditions change (input gas ratio, temperature, mass flow rate etc.).

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
• /
• pp.659-659
• /
• 2013

Recently, graphene has been intensively studied due to the fascinating physical, chemical and electrical properties. It shows high carrier mobility, high current density, and high thermal conductivity compare with conventional semiconductor materials even it has single atomic thickness. Especially, since graphene has fantastic electrical properties many researchers are believed that graphene will be replacing Si based technology. In order to realize it, we need to prepare the large and uniform graphene. Chemical vapor deposition (CVD) method is the most promising technique for synthesizing large and uniform graphene. Unfortunately, CVD method requires transfer process from metal catalyst. In transfer process, supporting polymer film (Such as poly (methyl methacrylate)) is widely used for protecting graphene. After transfer process, polymer layer is removed by organic solvents. However, it is impossible to remove it completely. These organic residues on graphene surface induce quality degradation of graphene since it disturbs movement of electrons. Thus, in order to get an intrinsic property of graphene completely remove of the organic residues is the most important. Here, we introduce modified wet graphene transfer method without PMMA. First of all, we grow the graphene from Cu foil using CVD method. And then, we deposited several metal films on graphene for transfer layer instead of PMMA. Finally, we fabricate graphene FET devices. Our approaches show low defect density and non-organic residues in comparison with PMMA coated graphene through Raman spectroscopy, SEM and AFM. In addition, clean graphene FET shows intrinsic electrical characteristic and high carrier mobility.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
• /
• pp.155.2-155.2
• /
• 2013

Strain-relaxed SiGe layer on Si substrate has numerous potential applications for electronic and opto- electronic devices. SiGe layer must have a high degree of strain relaxation and a low dislocation density. Conventionally, strain-relaxed SiGe on Si has been manufactured using compositionally graded buffers, in which very thick SiGe buffers of several micrometers are grown on a Si substrate with Ge composition increasing from the Si substrate to the surface. In this study, a new plasma process, i.e., the combination of PIII&D and HiPIMS, was adopted to implant Ge ions into Si wafer for direct formation of SiGe layer on Si substrate. Due to the high peak power density applied the Ge sputtering target during HiPIMS operation, a large fraction of sputtered Ge atoms is ionized. If the negative high voltage pulse applied to the sample stage in PIII&D system is synchronized with the pulsed Ge plasma, the ion implantation of Ge ions can be successfully accomplished. The PIII&D system for Ge ion implantation on Si (100) substrate was equipped with 3'-magnetron sputtering guns with Ge and Si target, which were operated with a HiPIMS pulsed-DC power supply. The sample stage with Si substrate was pulse-biased using a separate hard-tube pulser. During the implantation operation, HiPIMS pulse and substrate's negative bias pulse were synchronized at the same frequency of 50 Hz. The pulse voltage applied to the Ge sputtering target was -1200 V and the pulse width was 80 usec. While operating the Ge sputtering gun in HiPIMS mode, a pulse bias of -50 kV was applied to the Si substrate. The pulse width was 50 usec with a 30 usec delay time with respect to the HiPIMS pulse. Ge ion implantation process was performed for 30 min. to achieve approximately 20 % of Ge concentration in Si substrate. Right after Ge ion implantation, ~50 nm thick Si capping layer was deposited to prevent oxidation during subsequent RTA process at $1000^{\circ}C$ in N2 environment. The Ge-implanted Si samples were analyzed using Auger electron spectroscopy, High-resolution X-ray diffractometer, Raman spectroscopy, and Transmission electron microscopy to investigate the depth distribution, the degree of strain relaxation, and the crystalline structure, respectively. The analysis results showed that a strain-relaxed SiGe layer of ~100 nm thickness could be effectively formed on Si substrate by direct Ge ion implantation using the newly-developed PIII&D process for non-gaseous elements.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2012년도 제43회 하계 정기 학술대회 초록집
• /
• pp.307-307
• /
• 2012

In this study, we investigated that the resistance switching characteristics of Al-doped MgOx films with increasing Al doping concentration and increasing film thickness. The Al-doped MgOx based ReRAM devices with a TiN/Al-doped MgOx/Pt/Ti/SiO2 were fabricated on Si substrates. The 5 nm, 10 nm, and 15 nm thick Al-doped MgOx films were deposited by reactive dc magnetron co-sputtering at $300^{\circ}C$ and oxygen partial ratio of 60% (Ar: 16 sccm, O2: 24 sccm). Micro-structure of Al-doped MgOx films and atomic concentration were investigated by XRD and XPS, respectively. The Al-doped MgOx films showed set/reset resistance switching behavior at various Al doping concentrations. The process voltage of forming/set is decreased and whereas the initial current level is increased with decreasing thickness of Al-doped MgOx films. Besides, the initial current of Al-doped MgOx films is increased with increasing Al doping concentration in MgOx films. The change of resistance switching behavior depending on doping concentration was discussed in terms of concentration of non-lattice oxygen of Al-doped MgOx.