• Asian-Australasian Journal of Animal Sciences
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• 제21권4호
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• pp.489-493
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• 2008

In 2004, Jorgensen and coworkers proposed the MUC4 gene as a candidate gene of enterotoxigenic Escherichia coli (ETEC) F4ab/ac receptor in piglets and a mutation of $G{\rightarrow}C$ in intron 7 of MUC4 was identified to be associated with the ETEC F4ab/ac adhesion phenotypes. In this study, we used 310 piglets of three breeds (Landrace, Large White and Chinese Songliao Black) to analyze the relationship between this mutation and the F4ab/ac adhesion phenotype. The results show that the genotypes at this site and the ETEC F4ab/ac adhesion phenotypes were not completely consistent, although they are very strongly associated. Among the individuals with genotype CC, which was identified as a resistant genotype to F4ab/ac adhesion, only 72.1% (124/172) were non-adhesive to ETEC F4ab and 77.9% (134/172) were non-adhesive to ETEC F4ac infections. This suggests that this mutation may not be the causative mutation for ETEC F4ab/ac adhesion, rather, the actual causative mutation may be in another gene closely linked to MUC4, or at aother site within the MUC4 gene. Our results also suggest that the receptors of F4ab and F4ac may be determined by two different but closely linked loci. In order to screen other genes related to F4ab/ac adhesion in piglets, the mRNA profiles from six full sib piglets, of which three were adhesive to ETEC F4ab/ac and three non-adhesive, were analyzed by suppression subtractive hybridization (SSH). One up-regulated gene, Ep-CAM, was selected for further analysis based on its role in the intestinal epithelial cells adhesion. Using real-time RT-PCR, we found that the Ep-CAM gene was significantly up-regulated in the piglets adhesive to F4ab/ac. It was mapped to SSC3q11-q14 by radiation hybrid mapping.

• 접착 및 계면
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• 제6권1호
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• pp.1-6
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• 2005

The high accurate simulation of very thin glue layers based on the finite element method is still connected to many problems which result from the necessity to construct a complicated mesh of essentially different sizes of elements. This can lead to a loss of accuracy, unstable calculations and even loss of convergence. However, the implementation of special transmission elements along the glue ling and special edge-elements in the near-edge region would lead to a dramatic decrease of number of finite elements in the mesh and thus, prevent unsatisfactory phenomena in numerical analysis and extensive computation time. The theoretical basis for such special elements is the knowledge about appropriate transmission conditions and the edge effects near the free boundary of the adhesive layer. Therefore, recently proposed so-called non-classical transmission conditions and the behavior near the free edge are investigated in the context of the single-lap tensile-shear test of adhesive technology.

• The Journal of Advanced Prosthodontics
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• 제7권3호
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• pp.249-256
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• 2015

PURPOSE. The aim of this study was to evaluate the effects of atmospheric plasma (APL) versus conventional surface treatments on the adhesion of self-adhesive resin cement to Ti-6Al-4V alloy. MATERIALS AND METHODS. Sixty plates of machined titanium (Ti) discs were divided into five groups (n=12): 1) Untreated (CNT); 2) Sandblasted (SAB); 3) Tribochemically treated (ROC); 4) Tungsten CarbideBur (TCB); 5) APL treated (APL). SEM analysis and surface roughness (Ra) measurements were performed. Self-adhesive resin cement was bonded to the Ti surfaces and shear bond strength (SBS) tests, Ra and failure mode examinations were carried out. Data were analyzed by one-way analysis of variance and chi-squared test. RESULTS. The lowest SBS value was obtained with CNT and was significantly different from all other groups except for APL. The ROC showed the highest SBS and Ra values of all the groups. CONCLUSION. It was concluded that the effect of APL on SBS and Ra was not sufficient and it may not be a potential for promoting adhesion to titanium.

• 대한기계학회논문집A
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• 제24권8호
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• pp.2000-2006
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• 2000

The enhancement of service life of damaged or cracked structures is currently major issue to the researchers and engineers. In order to improve the life of cracked aging aircraft structures, the repair technique which uses adhesively bonded boron/epoxy composite patches is being widely considered as a cost-effective and reliable method. This paper is to study the performance of the bonded composite patch repair of a plate containing an inclined central through-crack. A 3-dimensional finite element method having three layers to the cracked plate, composite patch and adhesive layer, is used to compute the stress intensity factor. In this paper, the reduction of stress intensity factors near the crack-tip are determined to evaluate the effects of various non-dimensional design parameter including composite patch thickness, and material properties of the composite patch and thickness of the adhesive layer, materials of patch etc., and the crack length, Finally, The problem of how to optimize the patch geometric configurations has been discussed.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 추계학술대회 논문집
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• pp.98-107
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• 2004

The objectives of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of some adhesive joints. The criteria of feel occurrence at the bond terminus was suggested. Peel loads of some adhesive joint(butt joint, T -shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with intensity of stress singularity ' $K_{prin.}$' when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity ' $K_{prin.}$&apso; can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress doesn't show singularity at the bond terminus. Average principal stress can use as the criteria of peel occurrence at the bond terminus.'t show singularity at the bond terminus. Average principal stress can use as the criteria of peel occurrence at the bond terminus.

• 한국재료학회지
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• 제20권12호
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• pp.681-685
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• 2010

The application of flip chip technology has been growing with the trend of miniaturization of electronic packages, especially in mobile electronics. Currently, several types of adhesive are used for flip chip bonding and these adhesives require some special properties; they must be solvent-free and fast curing and must ensure joint reliability against thermal fatigue and humidity. In this study, imidazole and its derivatives were added as curing catalysts to epoxy resin and their effects on the adhesive properties were investigated. Non-isothermal DSC analyses showed that the curing temperatures and the heat of reaction were dependent primarily on the type of catalyst. Isothermal dielectric analyses showed that the curing time was dependent on the amount of catalysts added as well as their type. The die shear strength increased with the increase of catalyst content while the Tg decreased. From this study, imidazole catalysts with low molecular weight are expected to be beneficial for snap curing and high adhesion strength for flip chip bonding applications.

• 한국공작기계학회논문집
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• 제14권5호
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• pp.62-73
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• 2005

The objects of this research are to establish the criteria of peel occurrence considering the shape of bond terminus and to compare the strength properties of adhesive joint of different three type such as butt joint, T-shape, and single lap Joints. The criteria of peel occurrence at the bond terminus was suggested. Peel loads of three type adhesive joint (butt Joint, T-shape specimen, single lap joint) were determined from tensile tests. Principal stress distributions of these joints were determined from finite element method analysis. Then, peel occurrence was estimated with stress singularity factor$(K_{prin})$ when the terminus shape was square, with average principal stress when the terminus shape was rounded. The conclusions are summarized as follows; (1) In the non-filleted model(e.g., butt joint, T-shape specimen), principal stress shows singularity at the bond terminus, intensity of stress(principal stress) singularity $(K_{prin})$ can use as the criteria of peel occurrence at the bond terminus. (2) In the filleted model(e.g., single lap joint), principal stress has not affected singularity at the bond terminus. Average principal stress$(K_{av})$ can use as the criteria of peel occurrence at the bond terminus.

• 대한기계학회논문집A
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• 제31권7호
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• pp.808-815
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• 2007

The optical performance of the mirror fur satellite camera is highly dependent on the adhesive properties between the mirror and its support. Therefore, in order to design a mirror with high optical performance, the mechanical properties of adhesives should be well defined. In this research, the mechanical properties of three kinds of space adhesives are studied. In case of the materials which show nearly incompressible behavior such as space adhesives, it is important to measure shear modulus which governs deviatoric stress components. Also the experiment should be performed in circumstances similar to real manufacturing process of mirror, because extra factors such as size effects, the adhesion effects of primer and reactions between adhesive and primer affect the properties of adhesive regions. In this research shear moduli of the adhesives are determined by using a single lap adhesively bonded joint. For the shear tests, several temperatures have been selected from $-20^{\circ}C$ to $55^{\circ}C$ which is operating temperature range of the adhesive. In the case of linear behavior materials, shear moduli are calculated through a linear curve fitting. Shear stress-strain relation is obtained by using an exponential curve fitting for material which shows non-linear behavior. The shear modulus of each adhesive is expressed as a function of temperature. Characteristics and adaptability of the adhesives are discussed regarding their temperature sensitivity.

• Journal of the Korean Wood Science and Technology
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• 제48권3호
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• pp.303-314
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• 2020

Gambir is a non-wood forest product with a potential of being used as wood adhesive, due to about 33% catechin in it. Meanwhile, catechins and sucrose have not been studied as adhesives. Therefore, basic characteristics of gambir-sucrose adhesives were investigated. In this research, adhesives were prepared by dissolving gambir and sucrose in distilled water, at different blending ratios of the gambir/sucrose such as 100/0, 75/25, 50/50, and 25/75 wt%. Furthermore, gas chromatography-mass spectrometry (GC-MS) was employed to determine the gambir chemical compositions, and Fourier transform-infrared (FTIR) spectroscopy was carried out to identify chemical bonds. Particleboards with a target density of 0.8 g/㎤ were then manufactured by hot-pressing for 10 min at 200℃. The internal bond (IB) strength of particleboard was subsequently measured. Based on the GC-MS analysis, 31.11% of catechin was identified. In addition, the viscosity, density, solid content, and gelation time of the adhesives, and insoluble matter content (IMC) in boiling water were 7.30~33.24 mPa.s, 1.2~1.3 g/㎤, 25.56~28.44%, 73~420 min, and 29.75~62.10%, respectively. Adding sucrose to the adhesive was observed to raise the IMC from 49.05 to 62.10%, at 180℃ and 200℃. FT-IR analysis showed that the gambir absorption peaks occurred at approximately 1620 cm^-1, assigned to the C=O stretching of 5-hydroxymethylfurfural, which tended to increase with the addition of sucrose. The reaction between gambir and sucrose was observed in the form of the dimethylene ether bridge. The 25/75 wt% gambir-sucrose adhesives and 200℃ hot-pressed temperature resulted in the highest IB strength (0.89 MPa), and met the requirement of JIS A5908-2003 type 18. Consequently, the gambir-sucrose adhesive could be used as a particleboard adhesive.

• Journal of the Korean Wood Science and Technology
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• 제39권4호
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• pp.344-350
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• 2011

라디에타소나무 단판적층재(LVL)를 제조함에 있어서, CuAz 및 ACQ 방부처리와 비처리, 수성비닐우레탄 접착제와 페놀변성 리조시놀수지 접착제의 상온경화형 접착제를 적용함에 따른 밀도경사, 접착 강도성능 및 내부후성(방부효력)을 살펴보았다. 결과, LVL의 밀도경사에서 접착층 주변이 원추형으로 밀도가 커지는 경사패턴을 보였다. 접착성은 수성비닐우레탄 접착의 경우, 자비반복시험 후 전층이 박리되거나, 일부 층이 박리하고 할렬 틈새 현상이 일어났다. 페놀변성 리조시놀수지 접착제 접착의 경우, 자비반복시험 후 접착층의 응력이 큰데 연유한 굽음과 상하 접착층 사이의 단판의 수직할렬 현상이 있었으나, 접착층의 박리나 할렬이 거의 발견되지 않아 침지박리접착력은 높은 것으로 판단되었다. 한편, 방부효력시험에 있어서, 수성비닐우레탄 접착제로 적층한 LVL의 경우 갈색부후균에 의한 부후도가 백색부후균보다 크게 나타났다. 페놀변성 리조시놀수지 접착제로 LVL을 제조한 경우에는 갈색부후균에 의한 질량감소가 적었고, 약제를 처리하지 않더라도 그 피해가 낮았으며, 약제처리한 것은 질량감소율 0 수준을 보일 정도로 방부효력이 큰 것을 알 수 있었다.