• Journal of Radiation Industry
• /
• v.8 no.3
• /
• pp.141-146
• /
• 2014

Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.

• Resources Recycling
• /
• v.28 no.1
• /
• pp.3-14
• /
• 2019

Copper is used in many electronic components and construction parts due to its excellent electrical conductivity and heat transfer characteristics, and also used for pre-plating for double layer coating such as nickel, so that copper is an essential material in modern industry. Despite the expected increase of usage and importance on wiring, sensors and data equipment in the next generation industries, it is hard for securing stable copper supply and resource management resulting from the copper prices are fluctuating owing to the economic crisis in Europe, the low economic growth trend in China, and President Trump's commitment to public industrial facilities investment in U.S.. Since most of the domestic copper consumption is used by electrolytic copper cathode, we studied not only copper recycling technology which is being commercialized but also current research trend under the research stage. This study aims to examine the characteristics of each process and the areas where future recycling technology development is required.

• Applied Chemistry for Engineering
• /
• v.22 no.1
• /
• pp.98-103
• /
• 2011

We prepared a counter electrode by electroplating Ni as underlayer and Pt as plating layer on the FTO glass to increase the efficiency of dye-sensitized solar cell (DSSC). We found an excellent adhesion between Ni underlayer and FTO glass when Ni underlayer was electroplated at $10mA/cm^2$ for 2 min on FTO glass. We observed Ni and Pt metal diffraction peaks by XRD analysis when Ni underlayer was electroplated at $10mA/cm^2$ for 2 min, and Pt layer was electroplated at $5mA/cm^2$ for 1 min on the Ni underlayer. Photovoltaic performance and impedance analysis of DSSCs fabricated with this counter electrode shows the highest efficiency of 5.6% and the lowest resistance of 75 ohm.

• Transactions of the Korean Society of Mechanical Engineers B
• /
• v.37 no.2
• /
• pp.155-161
• /
• 2013

In this study, a metal-plated polycarbonate was adopted as a material for bipolar plates in a polymer electrolyte membrane fuel cell (PEMFC). The coated layers included 40-${\mu}m$-thick copper, 10-${\mu}m$-thick nickel, and 0.3-${\mu}m$-thick gold that respectively played the roles of current conduction, adhesion between copper and gold, and minimization of surface corrosion. The maximum power of the air-breathing PEMFC with polycarbonate bipolar plates was $120mW/cm^2$, which was similar to that of graphite bipolar plates. Finally, the maximum power of a 12-cell stack of polycarbonate bipolar plates was $132.7mW/cm^2$, and it had an operating time of 12 h. Therefore, this was considered a suitable material for bipolar plates in PEMFCs.

• Journal of the Microelectronics and Packaging Society
• /
• v.19 no.1
• /
• pp.55-60
• /
• 2012

In order to develop electroless-plated Nickel Phosphate (Ni-P) as a contact material for high efficient low-cost silicon solar cells, we evaluated the effect of ambient thermal annealing on the degradation behavior of interfacial adhesion energy between electroless-plated Ni-P and silicon solar cell wafers by applying 4-point bending test method. Measured interfacial adhesion energies decreased from 14.83 to 10.83 J/$m^2$ after annealing at 300 and $600^{\circ}C$, respectively. The X-ray photoelectron spectroscopy analysis suggested that the bonding interface was degraded by environmental residual oxygen, in which the oxidation inhibit the stable formation of Ni silicide phase between electroless-plated Ni-P and silicon interface.

• The korean journal of orthodontics
• /
• v.25 no.1 s.48
• /
• pp.43-54
• /
• 1995

This study was conducted to examine the metal release of TiN-plated stainless steel orthodontic appliances by constructing the simulated orthodontic appliances equivalent to maxillary half arch, by dividing into TiN-plated and TiN-nonplated Bloops and by dividing again these groups into welded and nonwelded groups. And then, the total quantity of metal release was obtained by measuring the amounts of both soluble and precipitated nickel and chromium after immersing in artificial saliva for 15 days. And then, the corrosion appearance of surface structure was observed by using SEM. The results of this study were summarized as follows. 1. The total amounts of released nickel and chromium showed that the TiN-plated group after welding(Group 1) was 25.46 ${\mu}g$, respectively, and 17.4 ${\mu}g$, while the TiN-nonplated group after welding(Group III) was 54.69 ${\mu}g$, respectively, and 85.27 ${\mu}g$. Then, the TiN-Plated group indicated less amounts of metal release(p<0.05). 2. The total amounts of the TiN-plated group without welding(Group II) was 0.05${\mu}g$ and 0.34${\mu}g$, respectively. Then, it was shown that the TiN-plated group without welding(Group II) indicated less metal release than that of the TiN-Plated group after welding(Group I)(p<0.01, p<0.05). 3. When observing their surface structure, there were a lot of precipitate and pitting corrosion in the groups with welding(Group I & III), when the TiN-plated group(Group I) showed lower level than the TiN-nonplated group(Group IIII). On the other hand, the groups without welding(Group II & IV) indicated a little of pitting corrosion. 4. In case of observation with the naked eyes, it was shown that there were significant disco1oration and corrosion in the groups with welding(Group I & III), while there was no any remarkable change in the groups without welding(Group II & IV).