• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.2-91.2
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• 2010

The use of plated front contact for metallization of silicon solar cell may alternative technologies as a screen printed and silver paste contact. This technologies should allow the formation of contact with low contact resistivity a high line conductivity and also reduction of shading losses. The better performance of Ni/Cu contacts is attributed to the reduced series resistance due to better contact conductivity of Ni with Si and subsequent electroplating of Cu on Ni. The ability to pattern narrower grid lines for reduced light shading combined with the lower resistance of a metal silicide contact and improved conductivity of plated deposit. This improves the FF as the series resistance is deduced. This is very much required in the case of low concentrator solar cells in which the series resistance is one of the important and dominant parameter that affect the cell performance. A selective emitter structure with highly dopes regions underneath the metal contacts, is widely known to be one of the most promising high-efficiency solution in solar cell processing. This paper using selective emitter structure technique, fabricated Ni/Cu plating metallization cell with a cell efficiency of 17.19%.

• Applied Chemistry for Engineering
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• v.10 no.1
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• pp.67-72
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• 1999

Optimal pretreatment processes for metal plating on engineering plastics, especially on Nylon-inorganic filler alloy was studied. For Nylon-inorganic filler alloy, adhesion strength between resin surface and metal could be improved by just etching process that eliminate amorphous layer. In the SEM picture and surface roughness measurement, etching treatment was found to make enabled the surface condition very rough and the adhesion strength good. It was also found that the surface condition of plated article and its adhesion strength partly depended upon molding condition of Nylon-inorganic filler alloy. EDS, peaks showed that what kinds of and how much of the metal elements remained on the resin surface after pretreatment processes. Cr did not affect on adsorption of Sn and Pd remarkably.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.71-76
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• 2008

The mechanical properties of Ni-Fe alloy were varied with the current type, current density and bath conditions such as concentrations and temperature. The effect of electroplating parameters on the surface hardness, mechanical strength, residual stress and wear properties were investigated. The mechanical properties of electrodeposits with PC plating is superior to those with DC plating. Ni-Fe electrodeposits with PC has approximately 50% lower residual stress than that of DC plating. The tensile strength of PC electroplated specimen was 15% higher than that of DC electroplated specimen. The wear resistance of PC specimen was 30% improved relative to that of DC specimen.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2017.05a
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• pp.123.1-123.1
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• 2017

Hybrid solar cells have intensively studied in recent years due to their advantages such as cost effectiveness and possibility of applications in flexible and transparent devices. It is critical to fabricate individual layer composed of organic and inorganic materials in the hybrid solar cell at low cost. Therefore, it is required to manufacture cheaply and enhance the photon-to-electricity conversion efficiency of each layer in the flexible solar cell industry. In this research, we fabricated pure Cu metal mesh electrode prepared by using electroplating and/or electroless plating on the Ni mold which was manufacture through photolithography, electroforming, and polishing process. Copper mesh was formed on the surface of nickel metal working master when pulsed electrolytic copper deposition were performed at various plating parameters such as plating time, current density, and so on. After electrodeposition at 2ASD for 5~30seconds, the line/pitch/thickness of copper mesh sheet was $1.8{\sim}2.0/298/0.5{\mu}m$.

• Transactions of the Korean hydrogen and new energy society
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• v.3 no.2
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• pp.9-15
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• 1992

Electroless copper plating method using an alkaline bath have been employed in copper coating of the (LM)Ni4.5Co0.1MnO.2A10.2 hydrogen storage alloy powders for electrode preparation. The plating were conducted without any pretreatment of alloy powders. For the preparation of the electrodes, about 0.12g of the copper coated alloy powder (copper to alloy ratio 1/3 by weight) was compacted with pressure of 6 tons/cm2 at room temperature. The disk-type compacts had a diameter of 10mm and thickness of about 0.24mm. The electrode characteristics were examined through SEM observations and electrochemical measurements in a half cell. The electrochemical measurement showed that the maximum discharge capacity of the electrodes prepared by using alkaline bath were 245mAh per gram of coated alloy (327mAh per gram of alloy) and appeared a considerable degradation with increasing number of cycles. The decrease of the discharge capacity after 100 cycles was about 30% It can be suggested that, with a slight of improvement, this electroless copper plating method could be applied to the preparation of the rare earth-nickel based alloy electrode.

• Korean Journal of Metals and Materials
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• v.46 no.11
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• pp.725-729
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• 2008

Deposition characteristics of electroless plated Ni-W-P films were investigated for various complexing agents. Used complexing agents are sodium citrate, sodium gluconate and sodium malonate. In this study, the existing mixed potential theory could explain the overall mechanism of Ni-W-P electroless plating for all complexing agents. The deposition rate could be also expected by the theory. The deposited Ni-W-P films were evaluated in term of surface hardness and corrosion resistance. Microhardness of the deposit increased about 1,000 Hv after heat treatment for one hour at $400^{\circ}C$, because it was above the crystallization temperature of $Ni_3P$. The deposited Ni-W-P films can exhibit excellent corrosion resistance in using sodium malonate as a complexing agent, the other hand the using sodium gluconate was the worst corrosion resistance. The worst corrosion resistance was due to a large number of nano-sized pin-holes or small pores. The plating current at the mixed potential increases when the using sodium malonate as a complexing agent, it was explained by the cross section.

• Journal of the Microelectronics and Packaging Society
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• v.30 no.1
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• pp.49-54
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• 2023

Recently, System in Packaging(SIP) technology needs to meet high frequency (5G and more) communication technology and fine pitch surface treatment. The conventional Electroless Ni/Immersion Au plating(ENIG) is not suitable for high frequency range because of magnetic properties are increasing the transmission loss. Without nickel plating layer, the pattern and pad reliability level must be meet the condition. In this review paper, we investigated research trends on Ni-less surface treatment technology for high-frequency communication and frequency characteristics according to materials.

• Journal of the Korean institute of surface engineering
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• v.41 no.5
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• pp.240-244
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• 2008

Composite plating is a method of co-deposition of plating layer with metallic and/or non-metallic particles to improve the plating layer properties such as high corrosion resistance and photolysis of organic compounds. The properties of nickel-ceramic composite plating are significantly depend on the surface characteristics of co-deposited particles as well as the quantity in electrolyte. In this study, Ni-$TiO_2$ composite coating layer was produced by electrodeposition technique from non-aqueous eletrolyte and its surface characteristics as well as photolytic properties were investigated. The amounts of immobilized $TiO_2$ particles increased with increasing the initial $TiO_2$ particles contents in the bath. Samples electroplated with the current density of $0.5\;A/dm^2$ showed the significantly improved homogeneous $TiO_2$ particles distribution. The corrosion resistance of Ni-$TiO_2$ composite coating layer also improved with increaing the amounts of $TiO_2$ particles. Etched sample showed about 10% increased photolytic rate of organic matter compare to that of the non-etched.

• Transactions on Electrical and Electronic Materials
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• v.14 no.3
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• pp.133-138
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• 2013

Acrylonitrile-butadiene-styrene (ABS) plastic is a polymer material extensively used in electrical and electronic applications. Nickel (Ni) thin film was deposited on ABS by electroless plating, after its surface was treated and modified with atmospheric plasma generated by means of dielectric barrier discharges (DBDs) in air. The method in this study was developed as a pre-treatment for electroless plating using DBDs, and is a dry process featuring fewer processing steps and more environmentally friendliness than the chemical method. After ABS surfaces were modified, surface morphologies were observed using a scanning electron microscope (SEM) to check for any physical changes of the surfaces. Cross-sectional SEM images were taken to observe the binding characteristics between metallic films and ABS after metal plating. According to the SEM images, the depths of ABS by plasma are shallow compared to those modified by chemically treatment. The static contact angles were measured with deionized (DI) water droplets on the modified surfaces in order to observe for any changes in chemical activities and wettability. The surfaces modified by plasma showed smaller contact angles, and their modified states lasted longer than those modified by chemical etching. Adhesion strengths were measured using 3M tape (3M 810D standard) and by 90° peel-off tests. The peel-off test revealed the stronger adhesion of the Ni films on the plasma-modified surfaces than on the chemically modified surfaces. Thermal shock test was performed by changing the temperature drastically to see if any detachment of Ni film from ABS would occur due to the differences in thermal expansion coefficients between them. Only for the plasma-treated samples showed no separation of the Ni films from the ABS surfaces in tests. The adhesion strengths of metallic films on the ABS processed by the method developed in this study are better than those of the chemically processed films.

• Applied Chemistry for Engineering
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• v.17 no.5
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• pp.458-464
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• 2006

The Pd-Ni-Ag alloy composite membrane using modified porous stainless steel (PSS) as a substrate was prepared by a electroless plating technique. In this work, we have introduced the intermediate layer between Pd-based alloy and a metal substrate. As an intermediate layer, the mixtures of nickel powder and inorganic sol such as $SiO_{2}$ sol, $Al_{2}O_{3}$ sol, and $TiO_{2}$ sol were used. The intermediate layers were coated onto a PSS substrate according to various membrane preparation conditions and then $N_{2}$ fluxes through the membranes with different intermediate layers were measured. The surface morphology of the intermediate layer in the mixture of nickel powder and inorganic sol was analyzed using scanning electron microscope (SEM). Finally, the Pd-Ni-Ag alloy composite membrane using the support coated with the mixture of nickel powder and silica as an intermediate layer was fabricated and then the gas permeances for $H_{2}$ and $N_{2}$ through the Pd-based membrane were investigated. The selectivity of $H_2/N_2$ was infinite and the $H_{2}$ flux was $1.39{\times}10^{-2}mol/m^2{\cdot}s$ at the temperature of $500^{\circ}C$ and trans-membrane pressure difference of 1 bar.