• Title/Summary/Keyword: Nickel plating

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Fabrication and Microstructure of Metal-Coated Carbon Nanofibers using Electroless Plating (무전해 도금을 이용한 금속 코팅된 탄소나노섬유의 제조 및 미세조직)

  • Park, Ki-Yeon;Yi, Sang-Bok;Kim, Jin-Bong;Lee, Jin-Woo;Lee, Sang-Kwan;Han, Jae-Hung
    • Composites Research
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    • v.20 no.5
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    • pp.43-48
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    • 2007
  • The absorption and the interference shielding of electromagnetic wave have been very important issues for commercial and military purposes. The stealth technique is one of the most typical applications of electromagnetic wave absorption technology. This study has started for the development of composite fillers containing dielectric and magnetic lossy materials. To improve the electromagnetic characteristics of conductive nano fillers, carbon nanofibers (CNFs) with nickel-phosphorous (Ni-P) or nickel-iron (Ni-Fe) have been fabricated by the electroless plating process. Observations by the electron microscopy (SEM/TEM) and element analyzer (EDS/ELLS) showed the uniform Ni-P and Ni-Fe coated CNFs. The compositions of the plating layers were about Ni-6wt%P and Ni-70wt%Fe, respectively. The average thicknesses of the plating layers were about $50\;{\sim}\;100\;nm$.

A Composite of Metal and Polymer Films: Thin Nickel Film Coated on a Polypropylene Film after Atmospheric Plasma Induced Surface Modification

  • Song, Ho-Shik;Choi, Jin-Moon;Kim, Tae-Wan
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.3
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    • pp.110-114
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    • 2011
  • Polymeric films of high chemical stability and mechanical strength covered with a thin metallic film have been extensively used in various fields as electric and electronic materials. In this study, we have chosen polypropylene (PP) as the polymer due to its outstanding chemical resistance and good creep resistance. We coated thin nickel film on PP films by the electroless plating process. The surfaces of PP films were pre-treated and modified to increase the adhesion strength of metal layer on PP films, prior to the plating process, by an environment-friendly process with atmospheric plasma generated using dielectric barrier discharges in air. The surface morphologies of the PP films were observed before and after the surface modification process using a scanning electron microscope (SEM). The static contact angles were measured with deionized water droplets. The cross-sectional images of the PP films coated with thin metal film were taken with SEM to see the combined state between metallic and PP films. The adhesion strength of the metallic thin films on the PP films was confirmed by the thermal shock test and the cross-cutting and peel test. In conclusion, we made a composite material of metallic and polymeric films of high adhesion strength.

전기접점 재료상에 입힌 경질금고금층의 특성연구 Properties of a Hard Gold plating Layer on Electrical Contace Materials

  • 최송천;장현구
    • Journal of Surface Science and Engineering
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    • v.23 no.3
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    • pp.173-182
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    • 1990
  • In order to prevent the thermal and enviromenatal degradation of contact materials a nickel layer was plated as an undercoat of gold plating on the surface phosphorous bronze. The thickness of nikel and gold coating and chemical resistance of the coatings were measured at various conditions. Variation of morphology and chemical composition was studied by SEM, EDS and ESCA, respectively. Nickel layer was found to act as a thermal diffusion barrier and to retard the diffusion of copper from substrate to gold coating in the temperature $200^{\circ}C$~$400^{\circ}C$. below $200^{\circ}C$gold coated contacts showed a stable and low contanct resistance, while above $200^{\circ}C$ rapid diffusion of copper formed copper oxide on the surface layer and raised the contact resistance. With the nickel thinkness of abount 5$\mu$m as an undercoat the gold thinkness of $0.5\mu$m, showed satistactory (less than 1 m$\Omega$) contact resistance below 20$0^{\circ}C$ and corresponding gold thinkness increased to 1.0 m at $300^{\circ}C$~$400^{\circ}C$.

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Novel Process of Precision Nickel Mesh Fabrication for EMI Shielding Using Continuous Electroforming Technique (연속전주공정을 이용한 전자파 차폐용 정밀니켈메쉬 제조 신공정)

  • Lee Joo-Yul;Kim Man;Kwon Sik-Chol;Hue Nguyen Viet;Kim In-gon
    • Journal of Surface Science and Engineering
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    • v.38 no.6
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    • pp.212-215
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    • 2005
  • Novel continuous electroforming process equipped with a rotating patterned mandrel, soluble/insoluble anode and multiple stage of rolling wheels was proposed to produce precision nickel mesh, which is known as a very efficient electromagnetic interference (EMI) shielding material. Continuously electroformed nickel deposits showed a tendency to form small-sized particles as the plating solution temperature increased and mandrel rotation speeded up and the applied current density decreased. Along the honeycomb patterns of mandrel, nickel was accurately electrodeposited on the surface of rotating mandrel, but quite different visual/structural characteristics were measured on both sides.

Study on the Mechanical Properties and Microstructure of Nickel Sulfamate Electroform (니켈쌀파메이트 전주층의 물성과 미세구조)

  • 김인곤
    • Journal of Surface Science and Engineering
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    • v.37 no.1
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    • pp.40-48
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    • 2004
  • Hardness and internal stress are very important in nickel electroforming. Nickel sulfamate bath has been widely used in electroforming because of its low internal stress and moderate hardness. Nickel sulfamate bath without chloride was chosen to investigated the effect of plating variable such as temperature, PH, current density and sodium naphthalene trisulfonate as addition agent on the hardness and internal stress. It was found that hardness increased with increasing temperature and decreasing current density and ranged from 150∼310 DPH. The hardness was highest at $55^{\circ}C$ and 10∼40 mA/$\textrm{cm}^2$. The internal stress increased with increasing current density and decreasing temperature. It was minimum at PH 3.0∼3.8. Low internal stress within $\pm$1,500 psi was obtained at both $50^{\circ}C$ and $55^{\circ}C$ in 10-20 mA/$\textrm{cm}^2$. The addition of sodium naphthalene trisulfonate was found to be effective in refine columnar grains thus resulted in decreasing internal stress, increasing hardness and improving brightness.

A Study on the Fabrication of Porous Nickel Substrates (다공성 니켈지지체의 제조에 관한 연구)

  • 신동엽;조원일;백지흠;조병원;강탁;윤경석
    • Journal of Surface Science and Engineering
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    • v.28 no.3
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    • pp.123-132
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    • 1995
  • While a nickel mesh and an expanded nickel sheet are used as current collectors for supporting active anode materials in rechargeable batteries, a porous nickel substrate is studied extensively for its 3-dimensional structure which has high capabilities for active materials and current collection. Optimum plating conditions were studied by polarization measurement. Scanning Electron Microscopy (SEM) showed that both electroless-and electro-plated nickel on an urethane substrate were highly porous and consisted of nearly spherical pores. The diameter and the channel size of the pores were found to be 300~500 $\mu\textrm{m}$ and 50~200$\mu\textrm{m}$, respectively. The shape of skeleton resembled a triangular prism with length extending about 50~100 $\mu\textrm{m}$.

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THE EFFECTS OF SURFACE TREATMENT OF DENIAL NICKEL-CHROMIUM ALLOY ON TENSILE BOND STRENGTH (치과용 니켈-크롬합금에 대한 표면 처리가 인장접착강도에 미치는 영향)

  • Lee, Eun-Suk;Kwon, Oh-Won
    • The korean journal of orthodontics
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    • v.27 no.3 s.62
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    • pp.493-502
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    • 1997
  • This study was conducted to evaluate the tensile bond strength by bonding the dental bracket with Super-bond after treating the surface of dental Nickel-Chromium alloy with sandblasting, sandblasting & tin-plating, respectively, and tin-plating. 10 pieces of Nickel-Chromium alloys with brackets bonded with Super-bond without their surface treatment were sampled as a control group, 20 pieces of Nickel-Chromium alloy brackets bonded with Super-bond after treating them with sandblasting as group I, 20 pieces of Nickel-Chromium alloys tin-plated and bonded with Super-bond after sandblasting as group II, and then 20 pieces of alloys with brackets bonded with Super-bond after tin-plating as group III. The result of those examination and comparison is summarized as follows: 1. Group I showed the mean tensile bond strength of $14.41{\pm}2.24MPa$ which was highest among 4 groups, followed by group III($13.59{\pm}.51MPa$), group II($12.27{\pm}.45MPa$), and control group($10.50{\pm}1.57MPa$), respectively. However, it was shown that there was no statistically significant difference between group I and III, group III and II, and group II and control group(p>0.05). 2. The main failure pattern of those brackets showed that $70\%$ of the control group had an adhesive failure at the bracket-Superbond interface, and $30\%$ at the Nickel-Chromium alloy-Superbond interface, while other groups did the adhesive failure at the bracket-Superbond interface. 3. When examined under SEM, it was shown that adhesives were mostly attached to the surface of the Nickel-Chromium alloy for all groups while a considerable quantity of adhesives were attached to the bracket base. Then, those samples treated only with sandblasting showed the most even and remarkable roughness of their surface.

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