• Journal of the Korean Electrochemical Society
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• v.13 no.4
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• pp.270-276
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• 2010

Nickel-copper foam electrodes with pore gradient micro framework and nano-ramified wall have been prepared by using an electrochemical deposition process. Growth habit of nickel-copper co-deposits was quite different from that of pure nickel deposit. In particular, the ramified structure of the individual particles was getting clear with chloride ion content in the electrolyte. The ratio of nickel to copper in the deposits decreased with the distance away from the substrate and the more chloride ions in the electrolyte led to the more nickel content throughout the deposits. Compositional analysis for the cross section of a ramified branch, together with tactical selective copper etching, proved that the copper content increased with approaching central region of the cross section. Such a composition gradient actually disappeared after heat treatment. It is anticipated that the pore gradient nickel-copper nanostructured foams presented in this work might be a promising option for the high-performance electrode in functional electrochemical devices.

• Transactions on Electrical and Electronic Materials
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• v.8 no.3
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• pp.110-114
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• 2007

Dependence of the thermal stability of nickel silicide on the film stress of inter layer dielectric (ILD) layer has been investigated in this study and silicon nitride $(Si_3N_4)$ layer is used as an ILD layer. Nickel silicide was formed with a one-step rapid thermal process at $500^{\circ}C$ for 30 sec. $2000{\AA}$ thick $Si_3N_4$ layer was deposited using plasma enhanced chemical vapor deposition after the formation of Ni silicide and its stress was split from compressive stress to tensile stress by controlling the power of power sources. Stress level of each stress type was also split for thorough analysis. It is found that the thermal stability of nickel silicide strongly depends on the stress type as well as the stress level induced by the $Si_3N_4$ layer. In the case of high compressive stress, silicide agglomeration and its phase transformation from the low-resistivity nickel mono-silicide to the high-resistivity nickel di-silicide are retarded, and hence the thermal stability is obviously improved a lot. However, in the case of high tensile stress, the thermal stability shows the worst case among the stressed cases.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.3
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• pp.21-27
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• 2007

Nickel bumps for ACF(anisotropic conductive film) flip chip application were fabricated by electroless and electro plating and their mechanical properties and impact reliability were examined through the compressive test, bump shear test and drop test. Stress-displacement curves were obtained from the load-displacement data in the compressive test using nano-indenter. Electroplated nickel bumps showed much lower elastic stress limits (70MPa) and elastic moduli ($7.8{\times}10^{-4}MPa/nm$) than electroless plated nickel bumps ($600-800MPa,\;9.7{\times}10^{-3}MPa/nm$). In the bump shear test, the electroless plated nickel bumps were deformed little by the test blade and bounded off from the pad at a low shear load, whereas the electroplated nickel bumps allowed large amount of plastic deformation and higher shear load. Both electroless and electro plated nickel bumps bonded by ACF flip chip method showed high impact reliability in the drop impact test.

• Analytical Science and Technology
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• v.37 no.1
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• pp.63-78
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• 2024

The continuous increasing of the global demand of copper and nickel metals raises the interest in developing alternative technologies to produce them from copper sulfide ore. Also, in line with Egypt's vision 2030 for achieving the sustainable socioeconomic development which aims at developing alternative and eco-friendly technologies for processing the Egyptian ores to produce these strategic products instead of its importing. These metals enhance the advanced electrical and electronic industries. The current work aims at investigating the recovery of copper and nickel from Abu Swayeil copper ore using pug leaching technique by sulfuric acid. The factors affecting the pug leaching process including the sulfuric acid concentration, leaching time and temperature have been investigated. The copper ore sample was characterized chemically using X-ray fluorescence (XRF) and scanning electron microscope (SEM-EDX). A response surface methodology develops a quadratic model that expects the nickel and copper leaching effectiveness as a function of three controlling factors involved in the procedure of leaching was also investigated. The obtained results showed that the maximum dissolution efficiency of Ni and Cu are 99.06 % and 95.30%, respectively which was obtained at the following conditions: 15 % H₂SO₄ acid concentration for 6 hr. at 250 ℃. The dissolution kinetics of nickel and copper that were examined according to heterogeneous model, indicated that the dissolution rates were controlled by surface chemical process during the pug leaching. The activation energy of copper and nickel dissolution were 26.79 kJ.mol^-1 and 38.078 kJ.mol^-1 respectively; and the surface chemical was proposed as the leaching rate-controlling step.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.10a
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• pp.25.2-25.2
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• 2011

Recently, thin film capacitors used for vehicle inverters are small size, high capacitance, fast response, and large capacitance. But its applications were made up of liquid as electrolyte, so its capacitors are limited to low operating temperature range and the polarity. This research proposes using Ni-P alloys by electroless plating as the electrode instead of liquid electrode. Our substrate has a high aspect ratio and complicated shape because of anodic aluminum oxide (AAO). We used AAO because film thickness and effective surface area are depended on for high capacitance. As the metal electrode instead of electrolyte is injected into AAO, the film capacitor has advantages high voltage, wide operating temperature, and excellent frequency property. However, thin film capacitor made by electroless-plated Ni on AAO for full-filling into etched tunnel was limited from optimizing the deposition process so as to prevent open-through pore structures at the electroless plating owing to complicated morphological structure. In this paper, the electroless plating parameters are controlled by temperature in electroless Ni plating for reducing reaction rate. The Electrical properties with I-V and capacitance density were measured. By using nickel electrode, the capacitance density for the etched and Ni electroless plated films was 100 nFcm-2 while that for a film without any etch tunnel was 12.5 nFcm-2. Breakdown voltage and leakage current are improved, as the properties of metal deposition by electroless plating. The synthesized final nanostructures were characterized by scanning electron microscopy (SEM).

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.4 no.4
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• pp.395-404
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• 1994

Ni-graphite composite powders were prepared by reduction of $Ni^{++}$ from ammoniacal nickel sulfate solution on graphite core by hydrogen gas. Effect of reaction factors on the reduction rate and the properties of nickel layer were investigated by SEM, Optical Microscopy, size and chemical analysis. Induction period, a time lag between the injection of hydrogen gas and the start of the reduction, was 20~110 mins and affected by the reaction temperature and stirring speed. The reduction rate of $Ni^{++}$ was $4.5g/{\ell}/min$ at optimum condition and increased with increasing reaction temperature and stirring speed.

• Korean Journal of Materials Research
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• v.17 no.2
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• pp.73-80
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• 2007

For the sub-65 nm CMOS process, it is necessary to develop a new silicide material and an accompanying process that allows the silicide to maintain a low sheet resistance and to have an enhanced thermal stability, thus providing for a wider process window. In this study, we have evaluated the property and unit process compatibility of newly proposed composite silicides. We fabricated composite silicide layers on single crystal silicon from $10nm-Ni_{1-x}Co_x/single-crystalline-Si(100),\;10nm-Ni_{1-x}Co_x/poly-crystalline-\;Si(100)$ wafers (x=0.2, 0.5, and 0.8) with the purpose of mimicking the silicides on source and drain actives and gates. Both the film structures were prepared by thermal evaporation and silicidized by rapid thermal annealing (RTA) from $700^{\circ}C\;to\;1100^{\circ}C$ for 40 seconds. The sheet resistance, cross-sectional microstructure, surface composition, were investigated using a four-point probe, a field emission scanning probe microscope, a field ion beam, an X-ray diffractometer, and an Auger electron depth profi1ing spectroscopy, respectively. Finally, our newly proposed composite silicides had a stable resistance up to $1100^{\circ}C$ and maintained it below $20{\Omega}/Sg$., while the conventional NiSi was limited to $700^{\circ}C$. All our results imply that the composite silicide made from NiCo alloy films may be a possible candidate for 65 nm-CMOS devices.

• Korean Journal of Materials Research
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• v.20 no.8
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• pp.439-443
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• 2010

Nano sized SiC particles (270 nm) are easily agglomerated in nickel sulfamate electrolytic bath during a composite electrodeposition process. The agglomeration of nano particles in composite coatings can significantly reduce the mechanical properties of the composite coatings. In this study, Ni-SiC nano composite coatings were fabricated using a conventional electrodeposition process with the aid of ultrasound. Nano particles were found to be distributed homogeneously with reduced agglomeration in the ultrasonicated samples. Substantial improvements in mechanical properties were observed in the composite coatings prepared in presence of ultrasound over those without ultrasound. Ni-SiC composite coatings were prepared with variable ultrasonic frequencies ranging from 24 kHz to 78 kHz and ultrasonic powers up to 300 watts. The ultrasonic frequency of 38 kHz with ultrasonic power of 200 watt was revealed to be the best ultrasonic conditions for homogeneous dispersion of nano SiC particles with improved mechanical properties in the composite coatings. The microstructures, phase compositions, and mechanical properties of the composite coatings were observed and evaluated using SEM, XRD, Vickers microhardness, and wear test. The Vickers microhardness of composite coatings under ultrasonic condition was significantly improved as compared to the coatings without ultrasound. The friction coefficient of the composite coating prepared with an ultrasonic condition was also smaller than the pure nickel coatings. A synergistic combination of superior wear resistance and improved microhardness was found in the Ni-SiC composite coatings prepared with ultrasonic conditions.

• Journal of the Korean Chemical Society
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• v.35 no.1
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• pp.46-50
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• 1991

Some nickel(II) complexes have been derived from the condensation of isonitrosobenzoylacetone and diamine(ethylenediamine and propylenediamine) in the presence of metal ion. It is suggested that an isonitroso group(=N-O) of the ligand coordinates to metal through nitrogen atom to form a five-membered ring while other =N-O coordinates to metal through oxygen atom to form a six-membered ring in Ni(IBN)$_2$-en ((IBA)$_2$-en = N,N'-propylenebis(isonitrosobenzoylacetone imino)). But both isonitroso groups of the ligand coordinate to metal through nitrogen atoms to form five-membered rings in Ni(IBA)$_2$-pn ((IBA)$_2$-pn = N,N'-propylenebis(isonitrosobenzoylacetone imino)).

• Restorative Dentistry and Endodontics
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• v.39 no.1
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• pp.7-11
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• 2014

Objectives: The aim of this study was to compare the dimensional standard of several nickel-titanium (Ni-Ti) rotary files and verify the size conformity. Materials and Methods: ProFile (Dentsply Maillefer), RaCe (FKG Dentaire), and TF file (SybronEndo) #25 with a 0.04 and 0.06 taper were investigated, with 10 in each group for a total of 60 files. Digital images of Ni-Ti files were captured under light microscope (SZX16, Olympus) at $32{\times}$. Taper and diameter at $D_1$ to $D_{16}$ of each files were calculated digitally with AnalySIS TS Materials (OLYMPUS Soft Imaging Solutions). Differences in taper, the diameter of each level ($D_1$ to $D_{16}$) at 1 mm interval from (ANSI/ADA) specification No. 101 were statistically analyzed using one-way ANOVA and Scheffe's post-hoc test at 95% confidence level. Results: TF was the only group not conform to the nominal taper in both tapers (p < 0.05). All groups except 0.06 taper ProFile showed significant difference from the nominal diameter (p < 0.05). Conclusions: Actual size of Ni-Ti file, especially TF, was different from the manufacturer's statements.