• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.05a
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• pp.107-107
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• 2015

In order to investigate electrochemical behavior and biocompatibility of Co-Cr dental alloy by electrochemical corrosion test and MTT assay, the xCo-25Cr-yW-zNi alloys were used in this study. Samples of Co-Cr-W-Ni alloys were manufactured using arc melting furnace. The microstructure of the alloys was examined by optical microscopy (OM), Field emission scanning electron microscopy (FE-SEM), energy dispersive X-ray spectroscopy (EDS), X-ray diffraction (XRD), MTT assay, and corrosion test. Corrosion resistance increased slightly as cobalt (Co) content increased. And bioactivity was concerned with nickel (Ni) and tungsten (W). Biocompatibility of Co-Cr alloy depended on Ni and W contents.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.444-445
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• 2007

Aluminum-doped zinc oxide (AZO) films are attractive materials as transparent conductive electrode because they are inexpensive, nontoxic and abundant element compared with indium tin oxide (ITO). AZO films have been deposited on glass (coming 1737) substrates by RF magnetron sputtering system. An ultrathin layer of nickel oxide (NiO) was deposited on the AZO anode to enhance the hole injections in organic light-emitting diodes (OLED). The current density-voltage and luminescence-voltage properties of devices were studied and compared with ITO device.

• Journal of Power System Engineering
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• v.18 no.4
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• pp.85-90
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• 2014

In this paper, the transient thermal and residual stress analysis of the welding of 9% Ni steel plates using the FEA software ABAQUS are presented. The 9% Ni steel plates are welded manually with welding consumables of 70% Ni based Inconel type super-alloys (YAWATA WELD B (M)), producing a multi-pass/multi-layer butt weld. For these materials, temperature dependant mechanical and thermal material properties are used in the analysis. The back gouging is considered in welding process simulation. The FE thermal results are validated by comparing the real fusion profile and heat affected zone (HAZ). In addition, the continuous indentation test was conducted to measure the strength of base metal, HAZ and weld metal.

• Journal of Surface Science and Engineering
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• v.37 no.5
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• pp.263-272
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• 2004

High strength steels such as transformation induced plastic steel, dual phase and solid solution Hardening have been developed and continuously improved due to the intensified needs in the automotive industry. But silicon and manganese in transformation induced plastic steels were known to exhibit harmful effects on galvannealing reaction by oxide film formed during heat treatment. Therefore, in this work, the applicability of Zn-Ni electrodeposition instead of hot dip galvannealed coating to transformation induced plastic steels was evaluated and optimum electroplating condition was investigated. Based on these investigations optimized electroplating conditions were proposed and Zn-Ni electrogalvanized steel sheet was produced by EGL (electrogalvanized line). Its perfomance properties for automotive steel was evaluated.

• Journal of Surface Science and Engineering
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• v.27 no.5
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• pp.285-291
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• 1994

The effects of pulse current parameters on the composition and the microstructure of Pd-Ni alloy electrodeposits were studied. The cathode current efficiency of p.c. electrolysis conditions decreased with increasing both mean and peak current density and was lower than those under D.C. electrolysis condition. Palladium content of Pd-Ni alloy increased with increasing both peak current density and on-time, while it decreased with increasing mean current density and duty cycle. The preferred orientation of Pd-Ni alloys changed with increasing mean current density in the sequence of (111)+(110).(100) or (110)longrightarrow(111)longrightarrow(100) or random distribution of crystal structure. The surface morphology of Pd-Ni alloy changed mainly according to the mean current density and was related to the preferred orientation.

• Bulletin of the Korean Chemical Society
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• v.13 no.1
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• pp.80-83
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• 1992

The secondary nitrogen donors of the Ni(II) complexes of macrotricyclic ligands 8-methyl-1,3,6,8,10,13,15-heptaazatricyclo $[13.1.1.1^{13,15}]$octadecane (A) and 1,3,6,9,11,14-hexaazatricyclo $[12.2.1.1^{6,9}]$octadecane (B) are N-alkylated and the Ni(II) complexes of $N-Me_2A,\;N-Et_2A,\;and\;N-Me_2B$ are obtained. The Ni(II) complexes of $N-Me_2A\;and\;N-Et_2A$ are stable in acidic aqueous solutions while that of $N-Me_2B$ decomposes relatively rapidly. The N-alkylation leads to the decrease in the ligand field strength as well as an anodic shift in both of the oxidation and the reduction potentials of the Ni(II) complexes.

• Bulletin of the Korean Chemical Society
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• v.17 no.7
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• pp.612-616
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• 1996

The new 1,2-dithiolene, 1,4-butanediyldithioethylene-1,2-dithiolate (BDDT2-), has been isolated. In addition, new monoanionic bis-complexes with nickel and copper have been prepared and characterized. In order to investigate the detailed electronic structure of the metal complexes of the new ligand, BDDT2-, in terms of the oxidation state of the central metal ions, we have carried out molecular orbital (MO) calculations of Ni(BDDT)2-and Cu(BDDT)2- utilizing an Extended Huckel method. Cyclic voltammetry data for both complexes were obtained with a potentiostat. We have also compared these results to the previously synthesized Ni(PDDT)2-, Ni(DDDT)2-,Cu(PDDT)2-, and Cu(DDDT)2-.

• Metals and materials international
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• v.24 no.6
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• pp.1293-1302
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• 2018

Nanocrystalline (NC) Ni electrodeposits (EDs) with a mean grain size of $34{\pm}12nm$ has been investigated, from room temperature to $800^{\circ}C$ under a purge gas of argon, by both non-isothermal and isothermal differential scanning calorimetry measurements, in combination with characterization of temperature-dependent microstructural evolution. A significant exothermic peak resulting from superimposition of recrystallization and surface oxidation occurs between 340 and $745^{\circ}C$ at a heating rate of $10^{\circ}C/min$ for the NC Ni EDs. The temperatures for recrystallization and oxidation increase with increasing the heating rate. In addition, recrystallization leads to a profound brittle-ductile transition of the Ni EDs in a narrow range around the peak temperature for the recrystallization.

• Journal of Sensor Science and Technology
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• v.30 no.2
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• pp.71-75
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• 2021

Recently, transition-metal-based hydroxide materials have attracted significant attention in various electrochemical applications owing to their low cost, high stability, and versatility in composition and morphology. Among these applications, transition-metal-based hydroxides have exhibited significant potential in supercapacitors owing to their multiple redox states that can considerably enhance the supercapacitance performance. In this study, nanostructured Ni-Mn double hydroxide is directly grown on a conductive substrate using an electrodeposition method. Ni-Mn double hydroxide exhibits excellent electrochemical charge-storage properties in a 1 M KOH electrolyte, such as a specific capacitance of 1364 Fg-1 at a current density of 1 mAcm-2 and a capacitance retention of 94% over 3000 charge-discharge cycles at a current density of 10 mAcm-2. The present work demonstrates a scalable, time-saving, and cost-effective approach for the preparation of Ni-Mn double hydroxide with potential application in high-charge-storage kinetics, which can also be extended for other transition-metal-based double hydroxides.

• Journal of Surface Science and Engineering
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• v.55 no.5
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• pp.299-307
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• 2022

Gold plating is used as a coating of connector in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. In most cases, internal connection between device and package and external terminals for connecting packaging and printed circuit board are electroless Ni-P plating followed by immersion Au plating (ENIG) to ensure connection reliability. The deposition behavior and film properties of electroless Au plating are affected by P content, grain size and mixed impurity components in the electroless Ni-P alloy film used as the underlayer plating. In this study, the correlation between electroless nickel plating used as a underlayer layer and cyanide-free electroless Au plating using thiomalic acid as a complexing agent and aminoethanethiol as a reducing agent was investigated.