• Title/Summary/Keyword: Ni-P Contact

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Enhanced alizarin removal from aqueous solutions using zinc Oxide/Nickel Oxide nano-composite

  • Basma E. Jasim;Ali J. A. Al-Sarray;Rasha M. Dadoosh
    • Analytical Science and Technology
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    • v.37 no.1
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    • pp.39-46
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    • 2024
  • Alizarin dye, a persistent and hazardous contaminant in aquatic environments, presents a pressing environmental concern. In the quest for efficient removal methods, adsorption has emerged as a versatile and sustainable approach. This study focuses on the development and application of Zinc Oxide/Nickel Oxide (ZnO/NiO) nano-composites as adsorbents for alizarin dye removal. These semiconducting metal oxide nano-composites exhibit synergistic properties, offering enhanced adsorption capabilities. Key parameters affecting alizarin removal, such as contact time, adsorbent dosage, pH, and temperature, were systematically investigated. Notably, the ZnO/NiO nano-composite demonstrated superior performance, with a maximum alizarin removal percentage of 76.9 % at pH 6. The adsorption process followed a monolayer pattern, as suggested by the Langmuir model. The pseudo-second-order kinetics model provided a good fit to the experimental data. Thermodynamic analysis indicated that the process is endothermic and thermodynamically favorable. These findings underscore the potential of ZnO/NiO nano-composites as effective and sustainable adsorbents for alizarin dye removal, with promising applications in wastewater treatment and environmental remediation.

Nickel Ion Adsorption Behavior of Ceriporia lacerata Isolated from Mine Tailings in Korea

  • Kim, HaeWon;Lim, Jeong-Muk;Oh, Sae-Gang;Kamala-Kannan, Seralathan;Cho, Min;Oh, Byung-Taek
    • Journal of Soil and Groundwater Environment
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    • v.20 no.2
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    • pp.22-31
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    • 2015
  • In the present study, surface of laccase producing Ceriporia lacerata was modified using 4-bromobutyryl chloride and polyethylenimine. The modified biomass was freeze dried and utilized as a biosorbent for the removal of Ni(II) from aqueous solution. The physicochemical properties of the biosorbent were analyzed using scanning electron microscopy and Fourier transform infrared spectroscopy. Batch experiments were carried out as a function of contact time (0-60 min), pH (2 to 8), adsorbent dosage (25-150 mg), and initial Ni(II) concentration (25-125 mg/L). The results indicate that surface modified biosorbent effectively adsorbed (9.5 mg/0.1 g biomass) Ni(II) present in the solution. The equilibrium adsorption data were modeled with different kinetic and isotherm models. The Ni(II) adsorption followed pseudo-first-order kinetics (R2 = 0.998) and Langmuir isotherm (R2 = 0.994) model. Hydroxyl and carbonyl functional groups present in biomass play a major role in the adsorption of Ni(II). The adsorbed Ni(II) from the biosorbent was successfully desorbed (85%) by 1M HCl. The results of the study indicate that the surface modified C. lacerate biomass could be used for the treatment of Ni(II) contaminated ground waters.

Measurement of Local Elastic Properties of Flip-chip Bump Materials using Contact Resonance Force Microscopy (접촉 공진 힘 현미경 기술을 이용한 플립 칩 범프 재료의 국부 탄성계수 측정)

  • Kim, Dae-Hyun;Ahn, Hyo-Sok;Hahn, Junhee
    • Tribology and Lubricants
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    • v.28 no.4
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    • pp.173-177
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    • 2012
  • We used contact resonance force microscopy (CRFM) technique to determine the quantitative elastic properties of multiple materials integrated on the sub micrometer scale. The CRFM approach measures the frequencies of an AFM cantilever's first two flexural resonances while in contact with a material. The plain strain modulus of an unknown or test material can be obtained by comparing the resonant spectrum of the test material to that of a reference material. In this study we examined the following bumping materials for flip chip by using copper electrode as a reference material: NiP, Solder (Sn-Au-Cu alloy) and under filled epoxy. Data were analyzed by conventional beam dynamics and contact dynamics. The results showed a good agreement (~15% difference) with corresponding values determined by nanoindentaion. These results provide insight into the use of CRFM methods to attain reliable and accurate measurements of elastic properties of materials on the nanoscale.

Nano-Wear and Friction of Magnetic Recording Hard Disk by Contact Start/Stop Test

  • Kim, Woo Seok;Hwang, Pyung;Kim, Jang-Kyo
    • KSTLE International Journal
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    • v.1 no.1
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    • pp.12-20
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    • 2000
  • Nano-wear and friction of carbon overcoated laser-textured and mechanically-textured computer hard disk were characterised after contact start/stop (CSS) wear test. Various analytical and mechanical testing techniques were employed to study the changes in topography, roughness, chemical elements, mechanical properties and friction characteristics of the coating arising from the contact start/stop wear test These techniques include: the atomic force microscopy (AFM), the continuous nano-indentation test, the nano-scratch test, the time-of-flight secondary ion mass spectroscopy (TOF-SIMS) and the auger electron spectroscopy (AES). It was shown that the surface roughness of the laser-textured (LT) bump and mechanically textured (MT) Bone was reduced approximately am and 7nm, respectively, after the CSS wear test. The elastic modulus and hardness values increased after the CSS test, indicating straining hardening of the top coating layer, A critical load was also identified fer adhesion failure between the magnetic layer and the Ni-P layer, The TOF-SIMS analysis also revealed some reduction in the intensity of C and $C_2$$F_59$, confirming the wear of lubricant elements on the coating surface.

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The Influence of Rapid Thermal Annealing Processed Metal-Semiconductor Contact on Plasmonic Waveguide Under Electrical Pumping

  • Lu, Yang;Zhang, Hui;Mei, Ting
    • Journal of the Optical Society of Korea
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    • v.20 no.1
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    • pp.130-134
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    • 2016
  • The influence of Au/Ni-based contact formed on a lightly-doped (7.3×1017cm−3, Zn-doped) InGaAsP layer for electrical compensation of surface plasmon polariton (SPP) propagation under various rapid thermal annealing (RTA) conditions has been studied. The active control of SPP propagation is realized by electrically pumping the InGaAsP multiple quantum wells (MQWs) beneath the metal planar waveguide. The metal planar film acts as the electric contact layer and SPP waveguide, simultaneously. The RTA process can lower the metal-semiconductor electric contact resistance. Nevertheless, it inevitably increases the contact interface morphological roughness, which is detrimental to SPP propagation. Based on this dilemma, in this work we focus on studying the influence of RTA conditions on electrical control of SPPs. The experimental results indicate that there is obvious degradation of electrical pumping compensation for SPP propagation loss in the devices annealed at 400℃ compared to those with no annealing treatment. With increasing annealing duration time, more significant degradation of the active performance is observed even under sufficient current injection. When the annealing temperature is set at 400℃ and the duration time approaches 60s, the SPP propagation is nearly no longer supported as the waveguide surface morphology is severely changed. It seems that eutectic mixture stemming from the RTA process significantly increases the metal film roughness and interferes with the SPP signal propagation.

Electrical Characterization of Lateral NiO/Ga2O3 FETs with Heterojunction Gate Structure (이종접합 Gate 구조를 갖는 수평형 NiO/Ga2O3 FET의 전기적 특성 연구)

  • Geon-Hee Lee;Soo-Young Moon;Hyung-Jin Lee;Myeong-Cheol Shin;Ye-Jin Kim;Ga-Yeon Jeon;Jong-Min Oh;Weon-Ho Shin;Min-Kyung Kim;Cheol-Hwan Park;Sang-Mo Koo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.36 no.4
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    • pp.413-417
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    • 2023
  • Gallium Oxide (Ga2O3) is preferred as a material for next generation power semiconductors. The Ga2O3 should solve the disadvantages of low thermal resistance characteristics and difficulty in forming an inversion layer through p-type ion implantation. However, Ga2O3 is difficult to inject p-type ions, so it is being studied in a heterojunction structure using p-type oxides, such as NiO, SnO, and Cu2O. Research the lateral-type FET structure of NiO/Ga2O3 heterojunction under the Gate contact using the Sentaurus TCAD simulation. At this time, the VG-ID and VD-ID curves were identified by the thickness of the Epi-region (channel) and the doping concentration of NiO of 1×1017 to 1×1019 cm-3. The increase in Epi region thickness has a lower threshold voltage from -4.4 V to -9.3 V at ID = 1×10-8 mA/mm, as current does not flow only when the depletion of the PN junction extends to the Epi/Sub interface. As an increase of NiO doping concentration, increases the depletion area in Ga2O3 region and a high electric field distribution on PN junction, and thus the breakdown voltage increases from 512 V to 636 V at ID =1×10-3 A/mm.

Effects of Axial Ligand Basicity on the Isotropic NMR Shifts in Pyridine-Type Ligands Coordinated to the Paramagnetic Polyoxometalate, $[SiW_{11}Co^{11}O_{39}]^{6-}$

  • 김지영;박석민;소현수
    • Bulletin of the Korean Chemical Society
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    • v.18 no.4
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    • pp.369-373
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    • 1997
  • When 1H NMR spectra of pyridine, 4-amino-, 4-methyl-, and 4-cyanopyridine coordinated to the paramagnetic polyoxometalate, [SiW11CoⅡO39]6- in D2O are compared, both α- and β-proton peaks are shifted upfield as the basicity of the ligand decreases. The isotropic shifts are separated into contact and pseudocontact contributions by assuming that the contact shifts are proportional to the isotropic shifts of the same ligands coordinated to [SiW11NiⅡO39]6-. This separation reveals that the shift variations with the axial ligand basicity are dominated by changes in the magnetic anisotropy (pseudocontact shift) of [SiW11CoⅡ(ptl)O39]6- (ptl=pyridine-type ligand). The magnitude of the magnetic anisotropy in a series of pyridine-type ligands increases linearly as the pKa of their conjugate acids decreases.

Development of Thiourea-Formaldehyde Crosslinked Chitosan Membrane Networks for Separation of Cu (II) and Ni (II) Ions

  • Sudhavani, T.J.;Reddy, N. Sivagangi;Rao, K. Madhusudana;Rao, K.S.V. Krishna;Ramkumar, Jayshree;Reddy, A.V.R.
    • Bulletin of the Korean Chemical Society
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    • v.34 no.5
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    • pp.1513-1520
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    • 2013
  • Novel chitosan (CS) based membrane networks were developed by solution casting and followed by crosslinking with different crosslinkers such as glutaraldehyde, urea-formaldehyde, and thiourea-formaldehyde. The developed membrane networks were designated as CS-GA, CS-UF and CS-TF. Crosslinking reaction of CS membranes was confirmed by Fourier transform infrared spectroscopy. Membrane rigidity and compactness were studied by the differential scanning calorimetry. The surface morphology of CS membranes was characterized by scanning electron microscopy. The sorption behaviour with respect to contact time, initial pH and initial metal ion concentration were investigated. The maximum adsorption capacity of CS-GA, CS-UF and CS-TF sorbents was found to be 1.03, 1.2 and 1.18 mM/g for $Cu^{2+}$ and 1.48, 1.55 and 2.18 mM/g for $Ni^{2+}$ respectively. Swelling experiments have been performed on the membrane networks at $30^{\circ}C$. Desorption studies were performed in acid media and EDTA and it was found that the membranes are reusable for the metal ion removal for three cycles. The developed membranes could be successfully used for the separation of $Cu^{2+}$ and $Ni^{2+}$ metal ions from aqueous solutions.

Analysis of Ni/Cu Metallization to Investigate an Adhesive Front Contact for Crystalline-Silicon Solar Cells

  • Lee, Sang Hee;Rehman, Atteq ur;Shin, Eun Gu;Lee, Doo Won;Lee, Soo Hong
    • Journal of the Optical Society of Korea
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    • v.19 no.3
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    • pp.217-221
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    • 2015
  • Developing a metallization that has low cost and high efficiency is essential in solar-cell industries, to replace expensive silver-based metallization. Ni/Cu two-step metallization is one way to reduce the cost of solar cells, because the price of copper is about 100 times less than that of silver. Alkaline electroless plating was used for depositing nickel seed layers on the front electrode area. Prior to the nickel deposition process, 2% HF solution was used to remove native oxide, which disturbs uniform nickel plating. In the subsequent step, a nickel sintering process was carried out in $N_2$ gas atmosphere; however, copper was plated by light-induced plating (LIP). Plated nickel has different properties under different bath conditions because nickel electroless plating is a completely chemical process. In this paper, plating bath conditions such as pH and temperature were varied, and the metal layer's structure was analyzed to investigate the adhesion of Ni/Cu metallization. Average adhesion values in the range of 0.2-0.49 N/mm were achieved for samples with no nickel sintering process.

Experimental Study on Wear Behavior of Material Pairs under Normal and Sliding Mixed Loading Conditions (무윤활 수직-수평 복합하중 조건에서 재료조합에 따른 마모특성 변화에 관한 실험적 연구)

  • Choi, Sung-Woo;Min, June-Kee;Jeong, Il-Wook;Park, Sang-Hu
    • Journal of the Korean Society for Precision Engineering
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    • v.26 no.11
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    • pp.131-137
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    • 2009
  • A pair of connectors for transferring torque is widely used in various types of a mechanical system. By the repetition of mechanical contact between a pair of connector, wear occurs easily. This kind of defect sometimes can cause a serious problem of health in case of the connector is used in a refrigerator. In this work, the material combination of connectors was experimentally studied to reduce the amount of wear; for the combination of connectors, various types of engineering materials including polyacetal, polycabonate, stainless steel (STS-304), NiP coated STS-304, and STS-310 were evaluated to check each wear behavior. Also an effective method of wear test was suggested for precise controlling of wear conditions such as contact area, contact force, and relative motion speed. From the test results, it was found out that a pair of polyacetal to STS-304 and STS-310 showed the lowest specific wear rates among other pairs.