• Proceedings of the KWS Conference
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• 2003.11a
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• pp.80-82
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• 2003

• Corrosion Science and Technology
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• v.3 no.3
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• pp.112-117
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• 2004

This work investigated the material properties of Ni-P-B alloy electrodeposits obtained from a Ni sulfamate bath as a function of the contents of the P and B sources($H_3PO_3$ and dimethyl amine borane complex(DMAB), respectively) with/without additives. Chemical composition, residual stress, microstructure and micro hardness were investigated using ICP(inductively coupled plasma) mass spectrometer, flexible strip, XRD, TEM and micro Vickers hardness tester, respectively. From the results of the compositional analysis, it was observed that P and B are incorporated competitively during the electrodeposition and the sulfur from the additive is codeposited into the electrodeposit. The measured residual stress value increased in the order of Ni, Ni-P, Ni-B and Ni-P-B electrodeposits indicating that boron affects the residual tensile stress greater than phosphorus. As the contents of the alloying element sources of P and B increased, crystallinity and the grain size of the electrodeposit decreased. The effect of boron on crystallinity and grain size was also relatively larger than the phosphorus. It can be explained that the boron with a smaller atomic radius contributes to the increase of residual stress in the tensile direction and the larger restraining force against the grain growth more significantly than the phosphorus with a larger atomic radius. Introduction of an additive into the bath retarded crystallization and grain growth, which may be attributed to the change of the grain growth kinetics induced by the additive adsorbed on the substrate and electrodeposit surfaces during electrodeposition.

• The Korean Journal of Food And Nutrition
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• v.9 no.3
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• pp.299-306
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• 1996

The study was performed under the various conditions, such as the edible parts and particle sizes of Allium. The concentrations, the temperartures, and the pH of heavy metal solutions to investigated their adsorption capacity of heavy metals by genus Allium. The adsorption amount of Pb by Allium in the aqueous soluton was apparently higher than that of Ni and Cu by them. The larger the particle sloe of welsh onion and shallot was, the higher the adsorption of Cu was. The adsorptlons of Cu, Ni and sorption ratio was not different. As the temperature increased, the amount of heavy metal adsorption increased in general, but the adsorption of Ni by welsh onion and wild garlic and leek, Cu by shallot, wild garlic and leek decreased. Adsorption of Pb to Allium was not affected by the different values of pH, and adsorptions of Ni and Cu were greatly affected by those of pH. Especially, the higher the pH was, the greater the Ni adsorption to Allium was, and the lower the pH was, the higher the Cu adsorption was. The correlation between the amount of components in edible parts of Allium and that of adsorption of heavy metals was significantly high In amino acids containing sulfhydryl group(-SH) and vitamin B2.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.11a
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• pp.67-71
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• 2000

• Journal of Soil and Groundwater Environment
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• v.14 no.1
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• pp.36-43
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• 2009

The feasibility of electrokinetic remediation was investigated in the laboratory to treat contaminated soil with Zn, Ni and F. Electro-migration and electro-osmosis are the major removal mechanisms because fluorines desorbed from soil exist as an anionic form in soil pores, and Zn and Ni exist as a cationic form. Desorption of fluorine was enhanced under the alkaline condition, but that of Zn and Ni increased under the acidic condition. Sequential pH control was effective to control the mixed wastes from contaminated soil. 2 V/cm was applied to reactor to evaluate the effect of constant voltage gradient, after two weeks, the removal efficiency of Zn, Ni and F was 20.5%, 2.5% and 57.4%, respectively. Even though the removal of Zn and Ni was very low, the pH control enhanced transport of Zn and Ni significantly. As a result, sequential pH control is a effective method to remediate mixed waste-contaminated soil.

• Journal of the Korean Electrochemical Society
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• v.12 no.3
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• pp.258-262
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• 2009

The composition and semiconducting properties of the passive films formed on Ni- (15, 30)Cr-5Mo alloys in pH 8.5 buffer solution were examined. The depth concentration profile of passive films formed on Ni-(15, 30)Cr-5Mo in pH 8.5 buffer solution showed that Mo enhances the enrichment of Cr. The Mott-Schottky plot for the passive film on Ni-(15, 30)Cr- 5Mo closely resembled that for the film on Cr, whereas those for the less Cr-enriched film on Mo-free alloys showed similar behavior to that for the film on Ni. The acceptor density was reduced by increasing Cr content in Ni-(15, 30)Cr-(0, 5)Mo alloys, but addition of Mo considerably increased the acceptor density.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.128-132
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• 2003

무전해 Ni-P UBM과 3가지 경우의 무연 솔더간의 계면연구를 통해 Bi가 솔더의 합금원소로 들어감에 따라 계면반응에 어떠한 영향을 줄 수 있는 가를 연구했다. 3가지 다른 무연 솔더는 Bi가 각각 $0wt\%,\;4.8wt\%,\;58wt\%$들어간 Sn3.5Ag, Sn3.5Ag4.8Bi, Sn58Bi 이다. reflow를 수행한 후에 세 가지 솔더에서 나타나는 계면에서의 IMC는 $Ni_3Sn_4$로서 어떤 다른 솔더도 Bi를 함유한 IMC가 계면에선 관찰되지 않았다. 다만 SnAgBi 솔더의 경우 특이하게 솔더내에서 침상의 $Ni_3Sn_4$가 reflow후에 관찰되었다. 또한 반응속도의 척도가 되는 Ni-P UBM소모속도를 비교해 보면 reflow후의 SnAg와 SnAgBi의 경우에는 비슷하나 SnBi의 경우에는 알서 두 솔더에 비해 눈에 띠게 느림을 관찰하였다. 이러한 Ni-P UBM의 소모경향을 Bi의 함량, 그에 따른 Sn의 상대적인 함량의 관점에서 고찰하고자 한다.

• Korean Journal of Microbiology
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• v.30 no.2
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• pp.88-95
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• 1992

The genetically engineered microorganisms (GEMS) could be released accidentally or ii)rexperimental purposes, as the genetic engineering, technique ha:. become very popular inany laboratories of biological sciences. But there have been littlt: informations on transkrbehavior of the genetically ~nodified genes in the natural en\ironmentx. In this stutly.antibiotic resistant bacteria were isolated from nat.ural waters. and then GEM strains wereconstructed i'rom the natural isolate (NI) by ~noclification oi' the Km' plasmitl. Thetransferability of the plasmids in the GEM and NI strains were examinetl by con-jugationin Luria-Bertani broth :it 30$^{\circ}$C. Also the cff'ccts 01' mating strain and pH on their transferfrequency and rearrangement of the plasmids in tl-~ec o~ijugantsM ere comp:irati\ely stuclictl.I'hc transkr frequency of Km' plasmid in donor of GEM and N1 strains wah similar a.;about 10 ' when co~ljugation was conducted wit11 M'I'I strain is recipient at pH 7. butthat of 1)KCOOI was lowered to 1.2X 10 '. And when the lab. stlain was uhccl as recipient.the transfer tendency of the plasmid was about same in both (;EM and NI strains usedas donor. All thc tionor 5trains. except for I)KC601. showecl the Ilighcs~ frequency of about10 ' at pH 7 and the frequcncics were lowered at both pH 5 and 9. Hut the mocliliedKm' plasmid in the cloned strain of DKC601 was transferred hy very low frequency of10 "at pH 5 ant1 7 comparing to other GEM strains. especiall! any co~~.jugantws ere notobtained at pH 4 and 9 even after conjugation for 6 hours. Rearrangement of the plasmidstranskrred into the lab. strain was not found in the conjugants. I\ulcornerut a lot of rearrangclncntwas ohservecl nlhen they were transferred into the NI strain. Such a rearrangement wasmore severe when donor was GEM strain rather then NI strain Hut such ;r phenomenonwas less affected by p!-l values.r phenomenon was less affected by p!-l values.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1988.10a
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• pp.64-66
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• 1988

The present investigation has been performed on the manufacturing process of Ni-P doped W-Cu electric contacts by infiltration techniques. The addition of small amount of Ni-P alloy aimed at forming a rigid and homogeneous skeleton structure of W-powders which favours subsequent infiltration process of Cu-melts. The experimental results revealed that the small addition of Ni-P alloy appreciably enhances the sintering process of W at low temperatures (even at 1000$^{\circ}C$), simultaneously causing a considerable change of skeleton Morphology and its related best infiltration behaviour of Cu-melts.

• Journal of the Korean Electrochemical Society
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• v.14 no.3
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• pp.163-170
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• 2011

Nanocrystalline Ni thin films were electodeposited from chloride baths to investigate the influences of additive concentration, current density and solution pH on residual (or internal) stress, surface morphology, and microstructure of the films. It was observed that residual stress in Ni thin film was changed from tensile stress mode (about 150 MPa) to compressive stress mode (about -100 MPa) with increasing saccharin concentration as an additive. Microstructure of Ni thin films was changed with/without saccharin in baths. Ni thin films electrodeposited from saccharinfree bath mainly consisted of both FCC(111) and FCC(200) phases. However, Ni thin film electrodeposited from the baths containing saccharin exhibited FCC(111), FCC(200) and FCC (311) phases [sometimes, FCC (220)]. Current density influenced residual stress of Ni thin films. It was measured to be the lowest compressive stress value (about-100 MPa) in range of current density of $2.5\sim10mA{\cdot}cm^{-2}$. Solution pH also influenced residual stress of Ni thin film. Addition of saccharin in baths affected grain size of Ni thin films. Grain sizes of Ni thin films were measured to be about 60 nm without saccharin and 24~38 nm with more than 0.0005M saccharin concentration. Surface of Ni thin films was changed from nodular to smooth surface morphology with addition of saccharin.