Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 1988.10a
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- Pages.64-66
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- 1988
A Study on the Manufacturing Process of Ni-P Doped W-Cu Electric Contacts
Ni-P 합금첨가한 W-Cu계 전기접점 제조에 관한 연구
- Lee, J. S. (Dept. of Met. and Mater. Sci. Hanyang University) ;
- Shin, H. (Dept. of Met. and Mater. Sci. Hanyang University) ;
- Bae, K. W. (Dept. of Met. and Mater. Sci. Hanyang University)
- Published : 1988.10.01
Abstract
The present investigation has been performed on the manufacturing process of Ni-P doped W-Cu electric contacts by infiltration techniques. The addition of small amount of Ni-P alloy aimed at forming a rigid and homogeneous skeleton structure of W-powders which favours subsequent infiltration process of Cu-melts. The experimental results revealed that the small addition of Ni-P alloy appreciably enhances the sintering process of W at low temperatures (even at 1000
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