• 한국결정성장학회지
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• 제12권6호
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• pp.311-316
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• 2002

2-step 증착법과 Bias-Enhanced Nucleation(BEN)법을 이용해 다결정 Ni 기판에 고품질의 다이아몬드 박막 합성을 연구하였다. $810^{\circ}C$에서 1시간 증착하여 soot충을 형성시킨 후 기판온도를 soot층의 형성이 억제되는 온도인 $925^{\circ}C$로 올려 5시간 증착하는 2-step법을 통해 고품질의 다이아몬드를 합성할 수 있었다. 또한, $925^{\circ}C$에서 -220V의 bias를 10분 동안 기판에 인가한 후 2시간 동안 증착하는 BEN법을 이용해 양질의 다이아몬드를 합성할 수 있었다. $925^{\circ}C$에서 bias 처리를 하지 않은 경우에는 10시간 동안 증착을 시도한 후에도 다이아몬드가 생성되지 않았다.

• Progress in Superconductivity
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• 제7권1호
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• pp.58-63
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• 2005

We investigated the surface oxidation behavior of cube-textured polycrystalline nickel at various oxidation conditions. Cube-textured NiO film was formed on a cube-textured polycrystalline nickel regardless of oxidation conditions but different growth behavior of NiO crystals was observed depending on the oxidation conditions. The introduction of water vapor into $O_2$ did not affect the texture evolution, but rough and porous microstructure was developed. Microstructure of NiO film tends to be denser as the oxygen partial pressure increases. It is interesting that (111) peak of theta - two theta diffraction pattern started to get stronger in air atmosphere and (111) plane became the major texture in the substrate oxidized in high purity argon gas. Small amount of high index crystallographic plane NiO peak crystal was observed when $N_{2}O$ was used as an oxidant while only (200) plane crystal was formed in dry $O_2$ atmosphere. Flat and smooth surface was changed into rough faceted one when ramping rate to oxidation temperature was faster. The grain size of NiO was decreased when the oxygen partial pressure was low. It was also observed that the modification of nickel surface suppressed the development of (200) texture.

• 한국세라믹학회지
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• 제41권3호
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• pp.229-234
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• 2004

수계슬러리의 동결건조 공정을 이용하여 배향성 기공을 갖는 NiO-YSZ 지지체를 제조하였다. 슬러리의 동결과정에서 형성된 얼음 결정은 진공건조 과정을 거치면서 승화되어 그 자리에 기공을 형성하였으며. 열전달 방향과 속도를 조절함으로써 얼음결정의 성장을 제어할 수 있음을 알 수 있었다. 제조된 NiO-YSZ 지지체는 배향성을 가진 거대(macro) 기공과 함께 표면에는 미세기공이 존재하는 독특한 기공구조를 형성하였다. 이것은 동결과정에 있어서 성형체의 위치에 따라 얼음의 성장속도가 다르기 때문에 발생하는 현상으로 생각된다. 얻어진 다공체 표면에 YSZ 슬러리를 dip 코팅하여 막을 형성한 후 140$0^{\circ}C$에서 동시소성(co-firing)하여 다공성 NiO-YSZ 지지체의 표면에 치밀한 YSZ 막이 코팅된 bilayer 제조에 성공하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.268-268
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• 2006

YBCO 초전도 박막을 제조하기 위해 일반적으로 사용되는 RABiTS공정을 통해 제조된 양축 정렬된 Ni 선재 위에 직접 YBCO를 증착시키려는 시도가 많이 이루어졌다. Ni 위에 직접 증착시킨 YBCO 박막은 c-축으로 정렬되는 온도에서 Ni이 확산되어 YBCO와 반응하여 초전도 물성을 약화시킨다. 이것을 방지하기 위하여 완층층을 먼저 증착을 하는 연구를 시행하였다. 본 연구는 Ni-5at.%W(100) 기판위에 hot-wall type MOCVD (metal organic chemical vapor deposition)를 이용하여 증착을 실시하였다. 완층층으로는 Ni, YBCO와 각각 4.70%, 3.32%의 lattice mismatch를 갖는 $Yb_2O_3$를 선택하였으며, 증착 조건으로는 온도 $800\;{\sim}\;1000^{\circ}C$, 시간 3 ~ 10min, 증착압력 10 Torr의 조건에서 증착을 행하였다. $Yb_2O_3$를 형성하기 위해 산소를 이용하였으나 $Yb_2O_3$(200) 형성을 방해하는 NiO(111)이 형성되었다. 산소를 대신해 수증기를 이용하여 NiO 상이 없는 $Yb_2O_3$(200)을 형성하였다. 증착 시간과 수증기 압력에 따른 $Yb_2O_3$의 $I_{(200)}/(I_{(111)}+I_{(200)})$의 상대 회절강도비를 XRD (X-ray diffraction)를 이용하였고, 증착된 표면 형상은 SEM(scanning electron microscopy)을 통해 관찰하였다.

• Corrosion Science and Technology
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• 제7권3호
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• pp.145-151
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• 2008

Material degradation such as high temperature oxidation of metallic material is a severe problem in energy generation systems or manufacturing industries. The metallic materials are oxidized to form oxide films in high temperature environments. The oxide films act as diffusion barriers of oxygen and metal ions and thereafter decrease oxidation rates of metals. The metal oxidation is, however, accelerated by mechanical fracture and spalling of the oxide films caused by thermal stresses by repetition of temperature change, vibration and by the impact of solid particles. It is therefore very important to investigate mechanical properties and adhesion of oxide films in high temperature environments, as well as the properties in a room temperature environment. The oxidation tests were conducted for Ni and Ni-Co alloy under high temperature corrosive environments. The hardness distributions against the indentation depth from the top surface were examined at room temperature. Dynamic indentation tests were performed on Ni oxide films formed on Ni surfaces at room and high temperature to observe fractures or cracks generated around impact craters. As a result, it was found that the mechanical property as hardness of the oxide films were different between Ni and Ni-Co alloy, and between room and high temperatures, and that the adhesion of Ni oxide films was relatively stronger than that of Co oxide films.

• 한국자기학회지
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• 제5권5호
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• pp.570-574
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• 1995

Magnetoresistance of NiFeCo/Cu/NiFeCo/FeMn uncoupled exchange biased sandwiches has been studied. The magnetoresistance change ratio, ${\Delta}R/R_{s}$ showed 4.1 % at a saturation field as low as 11 Oe in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(23\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. In this system, the magnetoresistance was affected by interlayer material and thickness. When Ti and Cu were used as the interlayer material in this structure, maximum magnetoresistance change ratio were 0.32 % and 4.1 %, respectively. 6.1 % MR ratio was obtained in $Si/Ti(50\;{\AA})/NiFeCo(70\;{\AA})/Cu(15\;{\AA})/NiFeCo(70\;{\AA})/FeMn(150\;{\AA})/Cu(50\;{\AA})$ spin valve structure. The magnetoresistance change ratio decreased monotonically as the interlayer thickness increased. It was found that the exchange bias field exerted by FeMn layer to the adjacent NiFeCo layer was ~25 Oe, far smaller than that reported in NiFe/Cu/NiFe/FeMn spin valve structure(Dieny et. al., ~400 Oe). The relationship between the film texture and exchange anisotropy ha been examined for spin valve structures with Ti, Cu, or non-buffer layer.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2003년도 추계학술발표강연 및 논문개요집
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• pp.190-190
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• 2003

현재 a-Si TFT는 평판 디스플레이 소자로서 주로 사용되고 있으나 점차 고속응답속도 특성, 고화질이 요구됨에 따라 높은 전계효과 이동도를 가진 poly-Si TFT로 대체하기 위한 연구가 진행되고 있으며 특히 poly-Si TFT를 상용 유리 기판에 적용하기 위해 비정질 실리콘의 저온 결정화에 대한 연구가 활발히 진행 되고 있다. 본 연구에서는 극박막의 Ni을 선택적으로 증착하여 전계 유도방향성 결정화 (Field Aided Lateral Crystallization : FALC) 공정을 이용하여 결정화를 진행하였으며 전계를 인가하지 않은 경우와 전계를 인가한 경우, 전계 세기에 따른 결정화에 대하여 비교하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2011년도 춘계학술대회 및 Fine pattern PCB 표면 처리 기술 워크샵
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• pp.113-113
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• 2011

알루미늄 박막 커패시터 제작을 위해 선택적인 알루미늄 etching과 anodizing을 이용한 유전체($Al_2O_3$) 형성, 전극층 형성을 위한 무전해 Ni-P 도금을 진행하였다. $5{\mu}m$ patterns/$10{\mu}m$ space를 가지는 dot patterns을 알루미늄 기판에 patterning하고, 이를 각각의 전류밀도 조건에서 etching한 후, barrier type anodizing을 진행하였다. 유전체에 전극층은 무전해 Ni-P 도금을 통해 형성하였으며, 이렇게 제작된 알루미늄 박막 커패시터 특성을 평가하였다.

• Corrosion Science and Technology
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• 제4권4호
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• pp.121-129
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• 2005

Basic design concept of the future steel structure requires environmental compatibility and maintenance free capability to minimize economic burdens. Recent trends in alloy design for advanced weathering steel include addition of various alloying elements which can enhance formation of stable and protective rust layer even in polluted urban and/or high $Cl^{-}$ environment. The effects of Ca, Ni, W, and Mo addition on the corrosion property of Ca-modified weathering steel were evaluated through a series of electrochemical tests (pH measurement and electrochemical impedance spectroscopy: EIS) and structural analysis on rust layer formed on the steel surface. Ca-containing inclusions of Ca-Al-Mn-O-S compound are formed if the amount of Ca addition is over 25 ppm. Steels with higher Ca content results in higher pH value for condensed water film formed on the steel surface, however, addition of Ni, W, and Mo does not affect pH value of the thin water film. The steels containing a high amount of Ca, Ni, W and Mo showed a dense and compact rust layer with enhanced amount of ${\alpha}-FeOOH$. Addition of Ni, W and Mo in Ca-modified weathering steel shows anion-selectivity and contributes to lower the permeability of $Cl^{-}$ ions. Effect of each alloying element on the formation of protective rust layer will be discussed in detail with respect to corrosion resistance.

• 한국세라믹학회지
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• 제52권4호
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• pp.264-268
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• 2015

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.