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Investigation of Eco-friendly Electroless Copper Coating by Sodium-phosphinate

  • Rha, Sa-Kyun (Department of Materials Science and Engineering, Hanbat National University) ;
  • Lee, Youn-Seoung (Department of Information and Communication Engineering, Hanbat National University)
  • Received : 2015.06.22
  • Accepted : 2015.07.15
  • Published : 2015.07.31

Abstract

Cu films were plated in an eco-friendly electroless bath (No-Formaldehyde) on Ni/screen printed Ag pattern/PET substrate. For electroless Cu plating, we used sodium-phosphinate ($NaH_2PO_2{\cdot}H_2O$) as reducing agent instead of Formaldehyde. All processes were carried out in electroless solution of pH 7 to minimize damage to the PET substrate. According to the increase of sodium-phosphinate, the deposition rate, the granule size, and rms roughness of the electroless Cu film increased and the Ni content also increased. The electroless Cu films plated using 0.280 M and 0.575 M solutions of sodium-phosphinate were made with Cu of 94 at.% and 82 at.%, respectively, with Ni and a small amount P. All electroless Cu plated films had typical FCC crystal structures, although the amount of co-deposited Ni changed according to the variation of the sodium-phosphinate contents. From these results, we concluded that a formation of higher purity Cu film without surface damage to the PET is possible by use of sodium-phosphinate at pH 7.

Keywords

References

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