• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.913-917
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• 2003

In the electronic components and devices fabrication, thin film resistors with low TCR(temperature coefficient of resistance) and high precision have been used over 3 GHz microwave in recent years. Ni-Cr alloys thin films resistors is one of the most commonly used resistive materials because it has low TCR and highly stable resistance. In this work, we fabricated thin film resistors using Evanohm alloys target(72Ni-20Cr-3Al-4Mn-Si) of s-type with excellent resistors properties by RF-sputtering. Also we reported best deposited conditions of thin film resistors for microwave to observe microstructure and electronic properties of thin film according to deposited conditions(between target and substrate, power supply)

• 한국진공학회:학술대회논문집
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• 한국진공학회 2009년도 제38회 동계학술대회 초록집
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• pp.225-225
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• 2010

In this study, the optimum structure of a magnetic thin film inductor was designed for application of DC-DC converters. The $Ni_{81}Fe_{19}$ (at%) alloy was selected as a high-frequency($\geq$ MHz) magnetic thin film core material and deposited on various substrates (bare Si, $SiO_2$ coated Si) using a high vacuum RF magnetron sputtering system. As-deposited NiFe thin films show similar magnetic properties compared to bulk NiFe alloys, indicating that they have a good film quality. The optimum design of solenoid-type magnetic thin film inductors was performed utilizing a Maxwell computer simulator (Ansoft HFSS V7.0 for PC) and parameters obtained from the magnetic properties of magnetic core materials selected. The high-frequency characteristics of the inductance(L) and quality factor(Q) obtained for the designed inductors through simulation agreed well with those obtained by theoretical calculations, confirming that the simulated result is realistic. The optimum structure of high-performance ($Q{\geq}60$, $L\;=\;1{\mu}H$, efficiency${\geq}90%$), high-frequency (${\geq}5MHz$), and solenoid-type magnetic thin film inductors was designed successfully.

• 한국자기학회지
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• 제3권3호
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• pp.215-220
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• 1993

RF/DC 스퍼터된 $Co_{69.0}Ni_{18.5}Cr_{12.5}/Cr$ 이중박막의 미세구조와 자기적 성질과의 관계를 조사하였다. Cr 하지층과 CoNiCr 자성층의 두께는 각각 50-200 nm와 10-50 nm였으며, 기판 의 온도는 $100-200^{\circ}C$로 하였다. 기판의 온도, Cr 하지층 두께가 증가함에 따라 결정립은 미세해졌으며 보자력은 증가하였다. 기판의 온도가 $100^{\circ}C$에서 $200^{\circ}C$로 증가함에 따라 Cr(200), CoNiCr(1120) 결정방위가 강하게 나타났다. CoNiCr/Cr 이중박막의 보자력은 CoNiCr(1120) 결정방위 증가와 결정립의 미세 화에 따라 증가한다. 높은 보자력을 나타내는 박막에서 Cr 하지층위에 자성층의 epitaxial growth를 확인하였다.

• 한국전기전자재료학회논문지
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• 제32권2호
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• pp.134-140
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• 2019

Oxide ($SnO_2$)/metal alloy (Cu(Ni))/oxide ($SnO_2$) multilayer films were fabricated using the magnetron sputtering technique. The oxide and metal alloy were $SnO_2$ and Ni-doped Cu, respectively. The structural, optical, and electrical properties of the multilayer films were investigated using X-ray diffraction (XRD), ultraviolet-visible (UV-vis) spectrophotometry, and 4-point probe measurements, respectively. The properties of the $SnO_2/Cu(Ni)/SnO_2$ multilayer films were dependent on the thickness and Ni doping of the mid-layer film. Since Ni atoms inhibit the diffusion and aggregation of Cu atoms, the grain growth of Cu is delayed upon Ni addition. For $250^{\circ}C$, the Haccke's figure of merit (FOM) of the $SnO_2$ (30 nm)/Cu(Ni) (8 nm)/$SnO_2$ (30 nm) multilayer film was evaluated to be $0.17{\times}10^{-3}{\Omega}^{-1}$.

• 한국표면공학회지
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• 제35권2호
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• pp.107-112
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• 2002

We have studied diffusion behavior of NiFe/Ag bilayer deposited by on silicon Ion Beam Sputtering methods. The diffusion behavior of NiFe and Ag in NiFe/Ag thin film is analyzed by Medium Energy Ion Scattering Spectroscopy. For samples without Ta underlayer, silicides such as Ni-Si or Fe-Si were formed at Si substrate and NiFe interface. In contrast, Ag predominantly diffused into the NiFe layer probably through their grain boundaries for Ta underlayered samples.

• 한국자기학회지
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• 제19권4호
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• pp.142-146
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• 2009

이온빔 증착법으로 제작한 코닝유리(Corning glass)/Ta(5 nm)/(Permalloy, Conetic)/Ta(5 nm) 박막에 대한 연자성의 특성에 대해 연구하였다. 퍼멀로이(Permalloy; NiFe)층과 코네틱(Conetic; NiFeCuMo)층을 증착하여 인가 자기장 방향에 용이축과 곤란축의 자기저항곡선으로부터 얻은 보자력과 포화자기장에 대해 각각 비교하였다. 두께가 10${\sim}$15 nm인 코네틱 박막의 표면저항값은 퍼멀로이 박막보다 2배 정도 높았으나 보자력과 포화자기장은 1/3배 정도 낮았으며, 자화율은 2${\sim}$3배 정도 높은 초연자성의 특성을 가졌다. 퍼멀로이 박막보다 연자성의 특성이 높은 코네틱 박막을 이용한 스핀밸브나 터널접합의 소자를 개발할 수 있는 가능성을 확인하였다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2007년도 제32회 학술대회 초록집
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• pp.172-172
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• 2007

• Journal of Electrochemical Science and Technology
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• 제10권4호
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• pp.402-407
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• 2019

Water electrolysis is known as the most sustainable and clean technology to produce hydrogen gas, however, a serious drawback to commercialize this technology is due to the slow kinetics in oxygen evolution reaction (OER). Thus, we report on the nanoporous IrNi thin film that reveals a markedly enhanced OER activity, which is attained through a selective etching of Os from the IrNiOs alloy thin film. Interestingly, electrochemical selective etching of Os leads to the formation of 3-dimensionally interconnected nanoporous structure providing a high electrochemical surface area (ECSA, 80.8 ㎠), which is 90 fold higher than a bulk Ir surface (0.9 ㎠). The overpotential at the nanoporous IrNi electrode is markedly lowered to be 289 mV at 10 mA cm^-2, compared with bulk Ir (375 mV at 10 mA cm^-2). The nanoporous IrNi prepared through the selective de-alloying of Os is promising as the anode material for a water electrolyzer.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.323-323
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• 2013

High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2001년도 춘계연구발표회 논문개요집
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• pp.58-59
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• 2001