• Journal of the Microelectronics and Packaging Society
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• 제7권2호
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• pp.55-62
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• 2000

The wetting balance test was performed in an attempt to estimate the wetting properties of the UBM-coated Si-wafer on one side to the Sn-Pb solder. The wetting curves of the one and both side-coated UBM layers had the similar shape and the parameters characterizing the curve shape showed the similar transition tendency to the temperature. The wetting property estimation was possible with the new wettability indices from the wetting curves of one side-coated specimen; $F_{min}$, $F_{s}t_{s}$ and $t_s$. For UBM of Si-chip, Au/Cu/Cr UBM was better than Au/Ni/Ti in the point of wetting time. The contact angle of the one side coated Si-plate to the Sn-Pb solder could be calculated from the force balance equation by measuring the static state force and the tilt angle.

• Journal of Surface Science and Engineering
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• 제50권3호
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• pp.170-176
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• 2017

EPIG (Electroless Pd/immersion Au) process was studied to replace ENIG (electroless Ni/immersion Au) and ENEPIG (electroless Ni/electroless Pd/immersion Au) processes for bump surface treatment used in high reliable flip chip packages. The palladium and gold layers formed by EPIG process were uniform with thickness of 125 nm and 34.5 nm, respectively. EPAG (Electroless Pd/autocatalytic Au) also produced even layers of palladium and gold with the thickness of 115 nm and 100 nm. TEM results exhibited that the gold layer in EPIG surface had crystalline structure while the palladium layer was amorphous one. After annealing at 250 nm, XPS analysis indicated that the palladium layer with thickness more than 22~33 nm could act as a diffusion barrier of copper interconnects. As a result of comparing the chip shear strength obtained from ENIG and EPIG surfaces, it was confirmed that the bonding strength was similar each other as 12.337 kg and 12.330 kg, respectively.

• Journal of the Korean Institute of Telematics and Electronics D
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• 제36D권3호
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• pp.41-47
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• 1999

Ion implanted GaAs MESFET with low resistive layer was fabricated using Si diffusion into GaAs from SiN. During the thermal annealing at 95$0^{\circ}C$ for 30s, Si diffused into ion implanted region of GaAs from SiN and they formed low resistive layer of 350$\AA$ thickness. The diffusion of Si decreased the sheet resistance of source and drain region from 1000$\Omega$/sq. to 400$\Omega$/sq. and the AuGe/Ni/Au ohmic contact resitivity from 2.5$\times$10sub -6$\Omega$-cmsup 2 to $1.5\times$10sup -6$\Omega$-cmsup 2. The fabricated lum gate length MESFET with Si diffused surface layer shows the transconductance of 360ms/mm, 8.5dB of associated gain and 3.57dB of minimum noise figure at 12GHz. These performances are better than that of MESFET without Si diffused layer.

• Korean Journal of Environment and Ecology
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• 제12권3호
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• pp.271-278
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• 1998

Heavy metal concentrations in rocks and soils from serpentinite(SP) and in plants (Pinus densiflora: PD and Pinus rigida: PR) were examined at Baekdong mine in Hongsung, Chungnam. Parent rocks were compared with amphibole schist(AS) and gneiss(GN) and plants divided the above grounds and roots were examined, respectively. In rocks, Ni, Cr, Co, Fe concentrations in SP were higher than those in AS and GN. The concentrations of top soils had the similar differences to their rocks; especially Ni, Cr, Co, Fe concentrations were the highest in SP, Zn and Sc concentrations, however, were the highest in AS. Average Ni, Cr, Co, Au, As, Sb, W concentrations of PD were the highest in SP and especially Ni, Cr, Co concentrations were accorded with changes of rocks and top soils. Zn and Sc concentrations in AS were higher and Fe and Mo concentrations in GN were higher than those in SP. Compared with two plants in the same serpentinite sites, most elements of PR were higher than those of PD. Therefore, these suggested PR absorbed much heavy metal than PD. Most element concentrations of roots in two plants and three rocks were higher than those of the above ground. Relative ratios (average plant concentration/soil concentration) of Ni, Cr, Co, Zn, Sc, Fe in AS and GN were higher than those of SP. Especially, relative ratios of most elements except Zn in GN were the highest.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional Pt layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at $330^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• Journal of Magnetics
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• 제12권4호
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• pp.152-155
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• 2007

Spin dependent transport was investigated in lateral $Py(Ni_{81}Fe_{19})/Au/Py$ spin valve devices. Clear spin valve effect was observed in conventional four-terminal measurement geometry. Higher resistance was found in antiparallel magnetization field of two Py electrodes which is determined by anisotropy magnetoresistance (AMR) measurements. The rectangular shape of spin signal together with good agreement of switching field convinces observed spin valve signal is resulted from effective spin injection and detection. The magnetoresistance ratio decays exponentially with channel length by which spin diffusion length of Au channel was estimated to be 76 nm.

• Transactions on Electrical and Electronic Materials
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• 제2권3호
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• pp.28-32
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• 2001

It was studied in the present work how the thermal cycling performance of LOC (lead on chip) packages depends on the package construct or leadframe materials. First, package body thickness and Au wire diameter were manipulated for the selection of proper package design. Secondly, two different types of leadframe materials (i.e. copper and 52%Fe-48%Ni alloy) were tested to determine the better material for improved reliability margin of plastically encapsulated microelectronic packages. This work shows that manipulating package body thickness was more effective than an increase of Au wire from 23$\mu\textrm{m}$ to 33$\mu\textrm{m}$ for the prevention of wire debonding failure. Further, this work indicates that the LOC packages including the copper leadframes can be more susceptible to thermal cycling reliability degradation due to chip cracking than those including the alloy leadframes.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.332-336
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• 2001

In this study, the reaction at UBM(Under Bump Metallurgy) and solder interface was investigated. The UBM employed in conventional optical packages, Au/Pt/Ti layer, were found to dissolve into molten Au-Sn eutectic solder during reflow soldering. Therefore, the reaction with different diffusion barrier layer such as Fe, Co, Ni were investigated to replace the conventional R layer. The reaction behavior was investigated by reflowing the solder on the pad of the metals defined by Cr layer for 1, 2, 3, 4, and 5 minutes at 330$^{\circ}C$. Among the metals, Co was found to be most suitable for the diffusion barrier layer as the wettability with the solder was reasonable and the reaction rate of intermetallic formation at the interface is relatively slow.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 한국마이크로전자및패키징학회 2004년도 국제표면실장 및 인쇄회로기판 생산기자재전:전자패키지기술세미나
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• Korean Chemical Engineering Research
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• 제49권6호
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• pp.720-725
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• 2011

Gold catalysts supported on metal-oxides were prepared by co-precipitation using the various metal nitrates and chloroauric acid as precursors, and effect of water addition on the catalytic activity in CO oxidation was investigated. Among the various supported gold catalysts, Au/$Co_{3}O_{4}$ and Au/ZnO catalysts showed the excellent activity for CO oxidation. Water in the reactant gas had a negative effect on the oxidation activity over Au/$Co_{3}O_{4}$ catalysts and a positive effect on that over Au/ZnO, which means the activity depends strongly on the nature of support. It was also confirmed that no significant change in the particle size of gold was observed after reaction both in dry and wet conditions. This fact suggested that the deactivated catalyst due to a carbonate species could be regenerated by water addition in the reactant gas.