• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.180.1-180.1
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• 2007

• Proceedings of the Korean Magnestics Society Conference
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• 2009.12a
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• pp.67-67
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• 2009

• Transactions on Control, Automation and Systems Engineering
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• v.4 no.1
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• pp.32-37
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• 2002

Applications of scaled telemanipulation into micro or nano world that shows many different features from directly human interfaced tools have been increased continuously. Here, we have to consider many aspects of scaling such as force, position, and impedance. For instance, what will be the possible range of force and position scaling with a specific level of performance and stability\ulcorner This knowledge of feasible staling region can be critical to human operator safety. In this paper, we show the upper bound of the product of force and position scaling and simulation results of 1DOF scaled system by using the Llewellyn's unconditional stability in continuous and discrete domain showing the effect of sampling rate.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.10
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• pp.894-900
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• 2006

This paper reports the fabrication and characterization of $32{\times}32$ thermal cantilever array for nano-scaled memory device applications. The $32{\times}32$ thermal cantilever array with integrated tip heater has been fabricated with micro-electro-mechanical systems(MEMS) technology on silicon on insulator(SOI) wafer using 9 photo masking steps. All of single-level cantilevers(1,024 bits) have a p-n junction diode in order to eliminate any electrical cross-talk between adjacent cantilevers. Nonlinear electrical characteristic of fabricated thermal cantilever shows its own thermal heating mechanism. In addition, n-channel high-voltage MOSFET device is integrated on a wafer for embedding driver circuitry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2010.06a
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• pp.87-87
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• 2010

Epoxy/mica has been used as the material of high-voltage rotator stator winding due to its high insulation performance, mechanical strength, and thermal stability. In recent years, however, it shows frequent changes in the load of generators and frequent automatic stops due to the significant increase in peak loads from the increase in the applied load of power facilities according to the introduction of advanced and high-technology equipments. Thus, it is necessary to develop new materials that highly develop the conventional insulation materials. Nanotechnology introduced in the present time has become an alternative plan that overcomes such technical limitations. In addition, the nano-scaled intercalation composite has been known as the material that represent excellent electrical, mechanical, and thermal characteristics compared to the conventional materials. This study investigated the dielectric dispersion and relaxation characteristics of the nanocomposite, which was fabricated by mixing epoxy matrix with nano-scaled intercalation mica and clay, according to changes in frequencies and temperatures.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.18 no.11
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• pp.990-995
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• 2005

This paper reports the fabrication and characterization of $5\;\times\;5$ thermal cantilever array for nano-scaled memory device application. The $5\;\times\;5$ thermal cantilever array with integrated tip heater has been fabricated with MEMS technology on SOI wafer using 7 photo masking steps. All single-level cantilevers have a diode in order to eliminate any electrical cross-talk between adjacent tips. Electrical measurements of fabricated thermal cantilever away show its own thermal heating mechanism. Thermal heating is demonstrated by the reflow of coated photoresist on the cantilever array surface.

• Proceedings of the Materials Research Society of Korea Conference
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• 2002.05a
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• pp.105-105
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• 2002

• Ceramist
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• v.10 no.5
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• pp.74-85
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• 2007

• Proceedings of the Materials Research Society of Korea Conference
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• 2003.03a
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• pp.193-193
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• 2003

• Proceedings of the Korean Ceranic Society Conference
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• 2003.04a
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• pp.80.2-80
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• 2003