• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
• /
• pp.78-78
• /
• 2013

Recently, many platinoid metals like platinum and ruthenium have been used as an electrode of microelectronic devices because of their low resistivity and high work-function. However the material cost of Ru is very expensive and it usually takes long initial nucleation time on SiO2 during chemical deposition. Therefore many researchers have focused on how to enhance the initial growth rate on SiO2 surface. There are two methods to deposit Ru film with atomic layer deposition (ALD); the one is thermal ALD using dilute oxygen gas as a reactant, and the other is plasma enhanced ALD (PEALD) using NH3 plasma as a reactant. Generally, the film roughness of Ru film deposited by PEALD is smoother than that deposited by thermal ALD. However, the plasma is not favorable in the application of high aspect ratio structure. In this study, we used a bis(ethylcyclopentadienyl)ruthenium [Ru(EtCp)2] as a metal organic precursor for both thermal and plasma enhanced ALDs. In order to reduce initial nucleation time, we use several methods such as Ar plasma pre-treatment for PEALD and usage of sacrificial RuO2 under layer for thermal ALD. In case of PEALD, some of surface hydroxyls were removed from SiO2 substrate during the Ar plasma treatment. And relatively high surface nitrogen concentration after first NH3 plasma exposure step in ALD process was observed with in-situ Auger electron spectroscopy (AES). This means that surface amine filled the hydroxyl removed sites by the NH3 plasma. Surface amine played a role as a reduction site but not a nucleation site. Therefore, the precursor reduction was enhanced but the adhesion property was degraded. In case of thermal ALD, a Ru film was deposited from Ru precursors on the surface of RuO2 and the RuO2 film was reduced from RuO2/SiO2 interface to Ru during the deposition. The reduction process was controlled by oxygen partial pressure in ambient. Under high oxygen partial pressure, RuO2 was deposited on RuO2/SiO2, and under medium oxygen partial pressure, RuO2 was partially reduced and oxygen concentration in RuO2 film was decreased. Under low oxygen partial pressure, finally RuO2 was disappeared and about 3% of oxygen was remained. Usually rough surface was observed with longer initial nucleation time. However, the Ru deposited with reduction of RuO2 exhibits smooth surface and was deposited quickly because the sacrificial RuO2 has no initial nucleation time on SiO2 and played a role as a buffer layer between Ru and SiO2.

• 한국재료학회:학술대회논문집
• /
• 한국재료학회 2003년도 춘계학술발표강연 및 논문개요집
• /
• pp.120-120
• /
• 2003

MOCVD법으로 TiN 표면에 Ru을 증착함에 있어서 Ru의 핵생성을 고양시키기 위한 ECR plasma 전처리 세정이 필요하다. 본 연구에서는 Ru 증착시 ECR $H_2O$$_2$, AE Plasma 전처리 세정 효과를 SEM, AES, XRD로 분석하였다. Ru의 핵생성은 ECR H$_2$, Ar Plasma의 노출시간이 증가할수록 향상된 반면, ECR $O_2$ plasma의 경우 노출시간이 증가할수록 핵생성 효과는 감소하였다. H$_2$ plasma 내의 H$_2$ion은 Ti와 NH$_3$를 형성하기 위해서 TiN과 반응하여 TiN을 Ti로 개질 시켰으며, Ar plasma 전처리 세정하는 동안 Ar plasma 내의 Ar ion은 TiN 또는 TiON 표면의 질소와 산소원자를 제거하는 효과를 나타내었다. 그 결과 TiN 표면상에서도 Ru의 핵생성이 쉽게 이루어졌으며 H$_2$, Ar ECR Plasma 전처리 세정에서 RU 핵생성이 향상되는 결과를 얻었다. 세 종류의 plasma중에서 Ar ECR plasma로 전처리 세정한 경우에 가장 높은 Ru 핵생성 밀도를 얻을 수 있었다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
• /
• pp.658-661
• /
• 2002

Chemical species during growth of carbon nanotubes (CNTs) in direct current-plasma enhanced chemical vapor deposition were studied in details using $C_3H_4-NH_3$ and $CO-NH_3$ mixtures through optical emission spectroscopy (OES). In the $C_3H_4-NH_3$ system, the relative intensities of CN (388.3 nm) and CH (431.4 nm) decreased and that of $C_2$ (436 nm) increased, leading to $sp^2$-graphization into the CNT structure, leading to improvement of field emission property of CNTs. In the $CO-NH_3$ system, the trend is completely reversed. Attributing to the atomic oxygen for helping the graphitization of carbon, CNTs could be grown under the flow rate of CO (180 sccm)-$NH_3$ (10 sccm). Through these results, we suggest the growth mechanism in our system.

• 공업화학
• /
• 제17권4호
• /
• pp.409-413
• /
• 2006

$150{\sim}200^{\circ}C$의 저온조건에 적용하기 위한 탈질공정으로서 저온 플라즈마 및 암모니아 SCR 공정을 복합시킨 탈질공정에 대한 실험적인 연구가 수행되었다. 실험결과 저온조건에서 일반적인 SCR 반응에 비해 매우 빠른 반응속도를 갖는 fast SCR 반응의 가능성을 확인할 수 있었으며, 효과적인 fast SCR 반응을 위해서는 SCR 반응기에 투입되는 $NO_{2}/NO_{x}$의 비가 0.3~0.5 범위에 있음을 알 수 있었다. 본 연구에서는 저온운전에 따른 암모늄염의 발생문제, 배기가스에 포함되어 있는 탄화수소가 공정에 미치는 영향, 유사한 공정과의 운전전력 비교 등 해당기술을 활용하기 위해 기본적으로 필요한 자료를 제공하고 있다.

• 한국산업융합학회 논문집
• /
• 제6권1호
• /
• pp.81-86
• /
• 2003

For the simultaneous removal of $SO_2$/NOx from an iron-ore sintering plant, industrial plasma experiments have been conducted with a flue gas flow rate of $5,000Nm^3/hr$. The maximum 40kW power using the magnetic pulse compression (MPC) system generates a peak value of 100-150kV pulse voltage with its risetime of 200nsec and full width at half maximum (FWHM) of 500nsec, and with a frequency <300Hz. The plasma reactor module adopts a wire-plate structure with a gap of 200-400mm ID between plates. Initial concentrations of $SO_2$ and NOx were around 100-150ppm, respectively in the presence of 15% $O_2$ and <10% $H_2O$. Various reaction parameters such as specific energy ($Whr/Nm^3$), $NH_3$ injection with corona discharge, flow rate and injection of hydrocarbons were investigated for $SO_2$/NOx removal characteristics. About 90/65% of $SO_2$/NOx were simultaneously removed with a specific energy of $3.0Whr/Nm^3$ when both $NH_3$ and hydrocarbons were injected. Practical implications that the pilot-scale plasma results provide are further discussed.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2001년도 하계학술대회 논문집
• /
• pp.935-938
• /
• 2001

Carbon nanotubes(CNTs) was successfully grown on Ni coated silicon wafer substrate by applying PECVD technique(Plasma Enhanced Chemical Vapor Deposition). As a catalyst, Ni thin film of thickness ranging from 15∼30nm was prepared by electron beam evaporator method. In order to find the optimum growth condition, the type of the gas mixture such as C$_2$H$_2$-NH$_3$was systematically investigated by adjusting the gas mixing ratio in temperature of 600$^{\circ}C$ under the pressure of 0.4 torr. The diameter of the grown CNTs was 40∼150nm. As NH$_3$etching time increased the diameters of the nanotubes decreased whereas the density of nanotubes increased. TEM images clearly demonstrated synthesized nanotubes was multiwalled. We investigated electrical properties for the application of FED.

• 한국반도체및디스플레이장비학회:학술대회논문집
• /
• 한국반도체및디스플레이장비학회 2006년도 추계학술대회 발표 논문집
• /
• pp.26-30
• /
• 2006

펄스 플라즈마 원자층 증착 방법 (PPALD : Pulse Plasma Atomic Layer Deposition)을 이용하여 이원계 박막인 W-N 박막을 ILD layer인 TEOS 위에 제조하였다. 실험은 $WF_6$와 $NH_3$ 가스의 순차적 주입과 $N_2$ 가스를 이용한 purging으로 이루어지며 $NH_3$ 가스 주입 시에 pulse plasma가 적용되었다. 일반적인 ALD 증착 기구를 그대로 따르는 PPALD 방법에 의해 제조된 W-N 박막은 N-H 플라즈마 초기 표면 처리에 의해 형성된 박막 위에 증착 하였다. 증착된 박막의 텅스텐과 질소의 비율이 2:1로 균일하였고 $700^{\circ}C$의 열처리에도 안정한 특성을 보였다.

• 전자공학회논문지A
• /
• 제30A권1호
• /
• pp.23-30
• /
• 1993

Hydrogenation on the top gate and bottom gate Poly-Si TET's was performed by using Nh$_{3}$ plasma and annealing SiN film deposited by PECVD and then the electric characteristics on Poly-Si TET were investigated. As the time of NA$_{3}$ plasma treatment increaes, on/off current ratio gradually increases and the swing value decreases. The trap densities of graim boundaries in Poly-Si decrease very much during the inital 20min of hydrogenation time, and the decreasing scale becomes smaller after 20 min. The electric characteristics of the top gate TFT are better than those of the bottom gate TFT, it is considered due to the defects at the interface between the Poly-Si and the underlayer, SiO$_{2}$. After NH$_{3}$ plasma was treated for 2 hours for the top gate TFT, as the aging time atroon temperature increases on current was not scacely changed and off current decreases more than 1 order. Gate current density recovers to original value after the aging treatment for 8 days and then the electric characteristics are finally improved. It is suggested that the degraded characteristics of gate oxide are improved, from the variations of C-V characteristics with aging time. For the hydrogenation of isothermal and isochronal annealing SiN film deposited by PECVD, the characteristics of Poly-Si TFT are improved with increasing annealing temperature and are not largely changed with increasing annealing time. This results is good in agreement with the hydrogen reduction in Sin film as variations of annealing temperature and time.

• Journal of Korean Vacuum Science & Technology
• /
• 제4권2호
• /
• pp.55-60
• /
• 2000

Vertically aligned carbon nanotubes on nickel coated glass substrates were obtained at low temperatures below 600$\^{C}$ by plasma enhanced hot filament chemical vapor deposition where acetylene gas was used as the carbon source and ammonia gas was used as the dilution gas and catalyst. The diameters of the nanotubes decreased from 96 m to 41 m as NH$_3$/C$_2$H$_2$ ratio increased from 2:1 to 5:1. Total flow rate of input gases with constant NH$_3$/C$_2$H$_2$ ratio did not change the diameter of carbon nanotubes. No growth of the carbon nanotubes was observed with only C$_2$H$_2$ nor N$_2$ instead of NH$_2$. G line and D line in Raman spectra were observed, which implies that there were many structural defects in carbon nanotubes.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2009년도 제36회 동계학술대회 초록집
• /
• pp.275.2-275.2
• /
• 2009