• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.342-342
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• 2011

산화막은 반도체 공정 중 가장 핵심적이며 기본적인 물질이다. 반도체 소자에서 내부의 캐리어들의 이동을 막고 전기를 절연시켜주는 절연체로서 역할을 하게 된다. 실제로 제작된 산화막에서는 dangling bond 혹은 내부에 축적되는 charge들의 의해 leakage가 생기게 되고 그에 따라 산화막의 특성은 저하되게 된다. 내부에서 특성을 저하시키는 defect을 감소시키기 위해 Plasma Treatment에 따른 특성변화를 관찰하였다. 본 연구에서는 최적화 시킨 Flexible TFT제작을 위해 저온에서 Silicon Oxide로 형성한 Gate Insulator에 각각 N2O, H2, NH3가스를 주입 후 Plasma처리를 하였다. 특성화 시킨 Gate Insulator를 이용하여 MIS(Metal-Insulator-Semiconductor)구조를 제작 후 C-V curve특성변화, Dit의 감소, Stress bias에 따른 stability를 확인 하였다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2009.10a
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• pp.183-184
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• 2009

자체 발광형 디스플레이는 잠재적인 장점에도 불구하고 수분에 대한 열화와 같은 기술적인 문제로 상업화하기 어려움이 있어 수분 투습 방지막이 필요하다. 이에 본 연구에서는 작은 결점 크기와 낮은 결점 밀도를 가지는 $TiO_2$ 보호막을 PEALD법으로 증착 하여 $N_2$와 $NH_3$ plasma 처리에 따른 표면 효과를 알아보았다.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.11a
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• pp.29-30
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• 2001

This paper presents some results of plasma nitriding on hard chromium deposit. The substrates were C45 steel and $30~50{\;}\mu\textrm{m}$ of chromium deposit by electroplating was formed. Plasma nitriding was carried out in a plasma nitriding system with $95NH_3{\;}+{\;}SCH_4$ atmosphere at the pressure about 600 Pa and different temperature from $450^{\circ}C{\;}to{\;}720^{\circ}C$ for various time. Optical microscopy and X-ray diffraction were used to evaluate the characteristics of surface nitride layer formed by nitrogen diffusion from plasma atmosphere inward iCr coating and interface carbide layer formed by carbon diffusion from substrate outward Cr coating. The microhardness was measured using microhareness tester at the load of 100 gf. Corrosion resistance was evaluated using the potentiodynamic measurement in 3.5% NaG solution. A saturated calomel electrode (SiCE) was used as the reference electrode. Fig.1 shows the typical microstructures of top surface and cross-section for nitrided and unnitrided samples. Aaer plasma nitriding a sandwich structure was formed consisting of surface nitride layer, center chromium layer and interface carbide layer. The thickness of nitride and carbide layers was increased with the increase of processing temperature and time. Hardness reached about 1000Hv after nitriding while 900Hv for unnitrided hard chromium deposit. X-ray diffraction indicated that surface nitrided layer was a mixture of $Cr_2N$ and CrN at low temperature and erN at high temperature (Fig.2). Anodic polarization curves showed that plasma nitriding can greatly improve the corrosion resistance of chromium e1ectrodeposit. After plasma nitriding, the corrosion potential moved to noble direction and passive current density was lower by 1 to 4 orders of magnitude compared with chromium deposit(Fig.3).

• Journal of the Korean Vacuum Society
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• v.21 no.1
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• pp.29-35
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• 2012

The Hydrogenated silicon nitride (SiNx:H) using plasma enhanced chemical vapor deposition is widely used in photovoltaic industry as an antireflection coating and passivation layer. In the high temperature firing process, the $SiN_x:H$ film should not change the properties for its use as high quality surface layer in crystalline silicon solar cells. Initially PECVD-$SiN_x:H$ film trends were investigated by varying the deposition parameters (temperature, electrode gap, RF power, gas flow rate etc.) to optimize the process parameter conditions. Then by varying gas ratios ($NH_3/SiH_4$), the hydrogenated silicon nitride films were analyzed for its optical, electrical, chemical and surface passivation properties. The $SiN_x:H$ films of refractive indices 1.90~2.20 were obtained. The film deposited with the gas ratio of 3.6 (Refractive index=1.98) showed the best properties in after firing process condition. The single crystalline silicon solar cells fabricated according to optimized gas ratio (R=3.6) condition on large area substrate of size $156{\times}156mm$ (Pseudo square) was found to have the conversion efficiency as high as 17.2%. Optimized hydrogenated silicon nitride surface layer and high efficiency crystalline silicon solar cells fabrication sequence has also been explained in this study.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.273.1-273.1
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• 2016

Graphene exhibits a number of unique properties that make it an intriguing candidate for use in sensor. Here, we report graphene-based gas sensor. Graphene was grown using CVD. Then, the sensor was made using standard lithography techniques. The sensor conductance increased upon exposure to NH3, whereas it decreased upon NO2, suggesting that NH3 and NO2 might be discriminated using the graphene-based sensor. To improve the sensitivity, graphene was treated with hydrogen plasma. After hydrogen treatment, the electrical properties of graphene changed from ambipolar to p-type semiconductors. In addition, the sensor performance was improved probably due to an opening of bandgap.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.206-207
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• 2009

PECVD를 이용하여 상온에서 Silicon nitride 박막을 제조하였다. 그리고 증착 중에 non-invasive ion energy analyzer를 이용하여 이온에너지와 이온에너지 flux룰 측정하였다. PECVD의 소스 파워는 500W, 바이어스 파워 100W으로 고정하고 주파수 250Hz으로 고정된 상태에서 펄스를 인가하여 duty ratio를 30-100%까지 변화시켰다. 작은 duty ratio 범위 (30-70%)에서 duty ratio가 감소할 때, 이온에너지와 이온에너지의 비가 감소하였다. 이 때 감소되는 굴절률은 저이온에너지 변수와 강한 연관성을 지니고 있었다. 굴절률은 1.65-2.46 사이에서 변화하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.9
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• pp.751-756
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• 2001

Carbon nanotubes(CNTs) was successfully grown on Ni coated silicon wafer substrate by PECVD technique(Plasma Enhanced Chemical Vapor Deposition). As a catalyst, Ni thin film of thickness ranging from 15∼30nm was prepared by electron beam evaporator system. In order to find the find the optimum growth condition, initially two different types of gas mixtures such as C$_2$H$_2$-NH$_3$ and C$_2$H$_2$-NH$_3$-Ar were systematically investigated by adjusting the gas mixing ratio in temperature of 600$^{\circ}C$ under 0.4 torr. The diameter of the grown CNTs was 40∼200nm. The diameter of the CNTs increases with increasing the Ni particles size. TEM images clearly demonstrated synthesized nanotubes to be multiwalled.

• Korean Journal of Materials Research
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• v.24 no.2
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• pp.111-115
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• 2014

Titanium and its alloys are useful for implant materials. In this study, porous Ti-Nb-Zr biomaterials were successfully synthesized by powder metallurgy using a $NH_4HCO_3$ as space holder and $TiH_2$ as foaming agent. Consolidation of powder was accomplished by spark plasma sintering process(SPS) at $850^{\circ}C$ under 30 MPa condition. The effect of high energy milling time on pore size and distribution in Ti-Nb-Zr alloys with space holder($NH_4HCO_3$) was investigated by optical microscope(OM), scanning electron microscope(SEM) & energy dispersive spectroscopy(EDS) and X-ray diffraction(XRD). Microstructure observation revealed that, a lot of pores were uniformly distributed in the Ti-Nb-Zr alloys as size of about $30-100{\mu}m$ using mixed powder and milled powders. In addition, the pore ratio was found to be about 5-20% by image analysis, using an image analyzer(Image Pro Plus). Furthermore, the physical properties of specimens were improved with increasing milling time as results of hardness, relative density, compressive strength and Young's modulus. Particularly Young's modulus of the sintered alloy using 4h milled powder reached 52 GPa which is similar to bone elastic modulus.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.3
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• pp.150-155
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• 2010

Generally, plasma nitriding process has composed with a nitriding layer within glow discharge region occurred by energy exchange. The dissociations of nitrogen molecules are very difficult to make neutral atoms or ionic nitrogen species via glow discharge area. However, the captured electrons in which a double-folded screen with same potential cathode can stimulate and come out some single atoms or activated ionic species. It was showed an important thing that is called "hat is a dominant component in this nitriding process?" in plasma nitriding process and it can take an effective species for without compound layer. During a plasma nitriding process, it was able to estimate with analyzing and identification by optical emission spectroscopy (OES) study. And then we can make comparative studies on the nitrogen transfer with plasma nitriding and ATONA process using plasma diagnosis and metallurgical observation. From these observations, we can understand role of active species of nitrogen, like N, $N^+$, ${N_2}^+$, ${N_2}^*$ and $NH_x$-radical, in bulk plasma of each process. And the same time, during DC plasma nitriding and other processes, the species of FeN atom or any ionic nitride species were not detected by OES analyzing.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.210-210
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• 2000

Vertically well aligned multi-wall carbon nanotubes (CNT) were grown on nickel coated glass substrates by plasma enhanced hot filament chemical vapor deposition at low temperatures below 600$^{\circ}C$. Acetylene and ammonia gas were used as the carbon source and a catalyst. Effects of growth parameters such as pre-treatment of substrate, plasma intensity, filament current, imput gas flow rate, gas composition, substrate temperature and different substrates on the growth characteristics of CNT were systematically investigated. Figure 1 shows SEM image of CNT grown on Ni coated glass substrate. Diameter of nanotube was 30 to 100nm depending on the growth condition. The diameter of CNT decreased and density of CNT increased as NH3 etching time etching time increased. Plasma intensity was found to be the most critical parameter to determine the growth of CNT. CNT was not grown at the plasma intensity lower than 500V. Growth of CNT without filament current was observed. Raman spectroscopy showed the C-C tangential stretching mode at 1592 cm1 as well as D line at 1366 cm-1. From the microanalysis using HRTEM, nickel cap was observed on the top of the grown CNT and very thin carbon amorphous layer of 5nm was found on the nickel cap. Current-voltage characteristics using STM showed about 34nA of current at the applied voltage of 1 volt. Electron emission from the vertically well aligned CNT was obtained using phosphor anode with onset electric field of 1.5C/um.