• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• 제37권2호
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• pp.133-140
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• 2024

This study offers a comprehensive evaluation of the role and impact of advanced power semiconductors in solar module systems. Focusing on silicon carbide (SiC) and gallium nitride (GaN) materials, it highlights their superiority over traditional silicon in enhancing system efficiency and reliability. The research underscores the growing industry demand for high-performance semiconductors, driven by global sustainable energy goals. This shift is crucial for overcoming the limitations of conventional solar technology, paving the way for more efficient, economically viable, and environmentally sustainable solar energy solutions. The findings suggest significant potential for these advanced materials in shaping the future of solar power technology.

• Proceedings of the Korean Vacuum Society Conference
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.438-439
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• 2013

Microelectronic devices의 접촉저항의 향상을 위해 Metal silicides의 형성 mechanism과 전기적 특성에 대한 연구가 많이 이루어지고 있다. 지난 수십년에 걸쳐, Ti silicide, Co silicide, Ni silicide 등에 대한 개발이 이루어져 왔으나, 계속적인 저저항 접촉 소재에 대한 요구에 의해 최근에는 Rare earth silicide에 관한 연구가 시작되고 있다. Rare-earth silicide는 저온에서 silicides를 형성하고, n-type Si과 낮은 schottky barrier contact (~0.3 eV)를 이룬다. 또한, 비교적 낮은 resistivity와 hexagonal AlB2 crystal structure에 의해 Si과 좋은 lattice match를 가져 Si wafer에서 high quality silicide thin film을 성장시킬 수 있다. Rare earth silicides 중에서 ytterbium silicide는 가장 낮은 electric work function을 갖고 있어 낮은 schottky barrier 응용에서 쓰이고 있다. 이로 인해, n-channel schottky barrier MOSFETs의 source/drain으로써 주목받고 있다. 특히 ytterbium과 molybdenum co-deposition을 하여 증착할 경우 thin film 형성에 있어 안정적인 morphology를 나타낸다. 또한, ytterbium silicide와 마찬가지로 낮은 면저항과 electric work function을 갖는다. 그러나 ytterbium silicide에 molybdenum을 화합물로써 높은 농도로 포함할 경우 높은 schottky barrier를 형성하고 epitaxial growth를 방해하여 silicide film의 quality 저하를 야기할 수 있다. 본 연구에서는 ytterbium과 molybdenum의 co-deposition에 따른 silicide 형성과 전기적 특성 변화에 대한 자세한 분석을 TEM, 4-probe point 등의 다양한 분석 도구를 이용하여 진행하였다. Ytterbium과 molybdenum을 co-deposition하기 위하여 기판으로 $1{\sim}0{\Omega}{\cdot}cm$의 비저항을 갖는 low doped n-type Si (100) bulk wafer를 사용하였다. Native oxide layer를 제거하기 위해 1%의 hydrofluoric (HF) acid solution에 wafer를 세정하였다. 그리고 고진공에서 RF sputtering 법을 이용하여 Ytterbium과 molybdenum을 동시에 증착하였다. RE metal의 경우 oxygen과 높은 반응성을 가지므로 oxidation을 막기 위해 그 위에 capping layer로 100 nm 두께의 TiN을 증착하였다. 증착 후, 진공 분위기에서 rapid thermal anneal(RTA)을 이용하여 $300{\sim}700^{\circ}C$에서 각각 1분간 열처리하여 ytterbium silicides를 형성하였다. 전기적 특성 평가를 위한 sheet resistance 측정은 4-point probe를 사용하였고, Mo doped ytterbium silicide와 Si interface의 atomic scale의 미세 구조를 통한 Mo doped ytterbium silicide의 형성 mechanism 분석을 위하여 trasmission electron microscopy (JEM-2100F)를 이용하였다.

• Journal of the Korea Institute of Information and Communication Engineering
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• 제17권10호
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• pp.2395-2402
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• 2013

An active-RC channel selection filter (CSF) with the bandwidth of 40MHz and the improved linearity is proposed in this paper. The proposed CSF is the fifth butterworth filter which consists of a first order low pass filter, two second order low pass filters of a biquad architecture, and DC feedback circuit for cancellation of DC offset. To improve the linearity of the CSF, a body node of a MOSFET for a switch is connected to its source node. The bandwidth of the designed CSF is selected to be 10MHz, 20MHz and 40MHz and its voltage gain is controlled by 6 dB from 0 dB to 24 dB. The proposed CSF is designed by using 40nm 1-poly 8-metal CMOS process with a 1.2V. When the designed CSF operates at the bandwidth of 40 MHz and voltage gain of 0 dB, the simulation results of OIP3, in-band ripple, and IRN are 31.33dBm, 1.046dB, and 39.81nV/sqrt(Hz), respectively. The power consumption and layout area are $450{\times}210{\mu}m^2$ and 6.71mW.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2009년도 춘계학술대회 논문집
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• pp.35-36
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• 2009

In this work, we demonstrate 800V 4H-SiC power DMOSFETs with several structural alterations to obtain a low threshold voltage ($V_{TH}$) and a high figure of merit ($V_B^2/R_{SP,ON}$). To optimize the device performance, we consider four design parameters; (a) the doping concentration ($N_{CSL}$) of current spreading layer (CSL) beneath the p-base region, (b) the thickness of p-base ($t_{BASE}$), (c) the doping concentration ($N_J$) and width ($W_J$) of a JFET region, (d) the doping concentration ($N_{EPI}$) and thickness ($t_{EPI}$) of epi-layer. These parameters are optimized using 2D numerical simulation and the 4H-SiC DMOSFET structure results in a threshold voltage ($V_{TH}$) below ~3.8V, and high figure of merit ($V_B^2/R_{SP,ON}$>${\sim}200MW/cm^2$) for a power MOSFET in $V_B$-800V range.

• Proceedings of the KIPE Conference
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• 전력전자학회 2018년도 전력전자학술대회
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• pp.213-215
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• 2018

본 논문에서는, 경부하 조건에서 저감된 스위칭 손실과 중부하 이상 조건에서 영전압 스위칭을 통해 높은 효율을 가지는 토템폴 브리지리스 역률보상회로를 제안한다. 토템폴 브리지리스 역률보상회로는 기존 브리지 다이오드를 포함한 역률보상회로의 단점인 도통패스 구간의 비교적 많은 소자 수를 통한 도통손실이 다소 큰 단점을 보완한 회로이다. 하지만, 토템폴 브리지리스 역률보상회로는 여전히 하드 스위칭을 통한 손실과 주 파워링 다이오드의 역회복 손실로 인한 단점을 지니고 있게 되며, 그로 인해 현재로써는 높은 효율과 안정적인 동작을 위해서는 부득이 GaN FET를 적용한 개발이 대부분이다. Full 부하 조건의 전류 용량을 고려하여 높은 전류 정격을 가지는 GaN FET를 주 스위치로 활용할 경우, 전류용량과 비례하여 기생 커패시턴스에 의한 손실이 커지기 때문에 경부하 조건에서 높은 효율을 확보하기가 다소 어렵다. 또한 구조상 물리적으로 여전히 하드 스위칭 동작을 할 수 밖에 없기 때문에 서버용 전원장치에서 요구하는 높은 효율을 달성하는데 한계를 지니며 높은 비용이 요구되는 단점을 지니게 된다. 이를 해결하기 위해, 제안하는 회로는 간단한 회로를 통해 경부하 조건에서 저감된 스위칭 손실과 중부하 이상 조건에서 소프트 스위칭을 만족하여 전체 부하 조건에서 기존의 GaN FET을 활용한 토템폴 구조 대비 높은 효율을 가지게 된다. 또한, 토템폴 구조임에도 불구하고 중부하 이상 영역에서 소프트 스위칭 동작을 통해 주 스위치를 비교적 저렴하고 신뢰성이 검증된 Si-MOSFET을 적용할 수 있다는 장점을 지닌다. 제안하는 회로의 효용성을 증명하기 위해, 하이라인 입력 전압과 750W 출력 조건에서 실험을 진행하였다.

• Proceedings of the KIEE Conference
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• 대한전기학회 1999년도 하계학술대회 논문집 D
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• pp.1931-1933
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• 1999

In this paper, the current and voltage properties on the gate oxide film due to the variation of thickness are studied. The specimen is used for n-ch power MOSFET. It is shows the leakage current and current density characteristics due to the applied electric field when the oxide thickness is each $600[\AA],\;800[\AA]$ and $1000[\AA]$, respectively. We known that the leakage current is a little higher when the voltage as reverse bias contrast with forward bias in poly gate is applied. In order to experiment for AC properties is measured for capacitance characteristics. It is confirmed that the value of input capacitance have been a lot of influenced on $SiO_2$ thickness contrast with the value of output capacitance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2009년도 추계학술대회 논문집
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• pp.35-35
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• 2009

Capacitorless one transistor dynamic random access memory (1T-DRAM) cells were fabricated on the fully depleted strained-silicon-on-insulator (FD sSOI) and the effects of silicon back interface state on buried oxide (BOX) layer on the memory properties were evaluated. As a result, the fabricated 1T-DRAM cells showed superior electrical characteristics and a large sensing current margin (${\Delta}I_s$) between "1" state and "0" state. The back interface of SOI based capacitorless 1T-DRAM memory cell plays an important role on the memory performance. As the back interface properties were degraded by increase rapid thermal annealing (RTA) process, the performance of 1T-DRAM was also degraded. On the other hand, the properties of back interface and the performance of 1T-DRAM were considerably improved by post RTA annealing process at $450^{\circ}C$ for 30 min in a 2% $H_2/N_2$ ambient.

• JSTS:Journal of Semiconductor Technology and Science
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• 제17권2호
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• pp.216-222
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• 2017

The most prominent challenge for MOSFET scaling is to reduce power consumption; however, the supply voltage ($V_{DD}$) cannot be scaled down because of the carrier injection mechanism. To overcome this limit, a new type of field-effect transistor using positive feedback as a carrier injection mechanism (FBFET) has been proposed. In this study we have investigated the electrical characteristics of a $Si_{1-x}Ge_x$ FBFET with one gate and one-sided $Si_3N_4$ spacer using TCAD simulations. To reduce the drain bias dependency, $Si_{1-x}Ge_x$ was introduced as a low-bandgap material, and the minimum subthreshold swing was obtained as 2.87 mV/dec. This result suggests that a $Si_{1-x}Ge_x$ FBFET is a promising candidate for future low-power devices.

• Proceedings of the KIEE Conference
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• 대한전기학회 1997년도 하계학술대회 논문집 F
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• pp.2033-2036
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• 1997

In this paper, we proposed a novel current-fed DC-DC converter with multi-output. It has two winding reactor in series with the input source of the converter. By using the 2nd winding recycling the energy stored in the reactor to the input, the double-outputs DC-DC converter can be created, which makes it a good choice for a multi-output power supply with more outputs and has savings in cost and space. The steady state and dynamic characteristics of the converter are analyzed in detail by using the state space averaging method. It is found that the maximum value of $V_{o2}$ exists in the 2nd output and also during the MOSFET off period, the energy stored in the magnetizing inductance is reset through auxiliary winding $N_3$, so the duty cycle is restricted to 50%. Theoretical and experimental results were taken from the converter rated at switching frequency 50kHz. input voltage 50V. output voltage 5V. 12V and output power 65W. As a result, both results were well consistent. Therefore, it is varified the validity of the proposed converter in this paper.

• Transactions on Electrical and Electronic Materials
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• 제14권5호
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• pp.235-241
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• 2013

A low power CMOS control circuit is applied in an integrated DC-DC buck converter. The integrated converter is composed of a feedback control circuit and power block with 0.35 ${\mu}m$ CMOS process. A current-sensing circuit is integrated with the sense-FET method in the control circuit. In the current-sensing circuit, a current-mirror is used for a voltage follower in order to reduce power consumption with a smaller chip-size. The N-channel MOS acts as a switching device in the current-sensing circuit where the sensing FET is in parallel with the power MOSFET. The amplifier and comparator are designed to obtain a high gain and a fast transient time. The converter offers well-controlled output and accurately sensed inductor current. Simulation work shows that the current-sensing circuit is operated with an accuracy of higher than 90% and the transient time of the error amplifier is controlled within $75{\mu}sec$. The sensing current is in the range of a few hundred ${\mu}A$ at a frequency of 0.6~2 MHz and an input voltage of 3~5 V. The output voltage is obtained as expected with the ripple ratio within 1%.