• Title/Summary/Keyword: Multi6

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Dynamic Redundancy-based Fault-Recovery Scheme for Reliable CGRA-based Multi-Core Architecture

  • Kim, Yoonjin;Sohn, Seungyeon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.15 no.6
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    • pp.615-628
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    • 2015
  • CGRA (Coarse-Grained Reconfigurable Architecture) based multi-core architecture can be considered as a suitable solution for the fault-tolerant computing. However, there have been a few research projects based on fault-tolerant CGRA without exploiting the strengths of CGRA as well as their works are limited to single CGRA. Therefore, in this paper, we propose two approaches to enable exploiting the inherent redundancy and reconfigurability of the multi-CGRA for fault-recovery. One is a resilient inter-CGRA fabric that is ring-based sharing fabric (RSF) with minimal interconnection overhead. Another is a novel intra/inter-CGRA reconfiguration technique on RSF for maximizing utilization of the resources when faults occur. Experimental results show that the proposed approaches achieve up to 94% faulty recoverability with reducing area/delay/power by up to 15%/28.6%/31% when compared with completely connected fabric (CCF).

Printed 3D Multi-View Images

  • Kim, Sung-Sik;Son, Kwang-Hun;Saveljev, V. V.;Son, Jung-Young
    • Journal of the Optical Society of Korea
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    • v.5 no.1
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    • pp.29-31
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    • 2001
  • The technique to produce full-parallax 3D multi-view still pictures is described. The matrix of source views (from 6x6 to 15x15 views) is built from computer-generated images or from the natural images taken by a photo-camera. The matrix is processed in specially designed software and the resulting multi-view picture is generated. To display the large size (up to 0.4 m x 0.6 m) multi-view picture, the crossed lenticular screens of two types were used.

Multiple Color and ToF Camera System for 3D Contents Generation

  • Ho, Yo-Sung
    • IEIE Transactions on Smart Processing and Computing
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    • v.6 no.3
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    • pp.175-182
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    • 2017
  • In this paper, we present a multi-depth generation method using a time-of-flight (ToF) fusion camera system. Multi-view color cameras in the parallel type and ToF depth sensors are used for 3D scene capturing. Although each ToF depth sensor can measure the depth information of the scene in real-time, it has several problems to overcome. Therefore, after we capture low-resolution depth images by ToF depth sensors, we perform a post-processing to solve the problems. Then, the depth information of the depth sensor is warped to color image positions and used as initial disparity values. In addition, the warped depth data is used to generate a depth-discontinuity map for efficient stereo matching. By applying the stereo matching using belief propagation with the depth-discontinuity map and the initial disparity information, we have obtained more accurate and stable multi-view disparity maps in reduced time.

Web-based POD system Using Multi-Layer Technique (멀티레이어 기법을 활용한 웹기반 POD 시스템)

  • Lee, Byung-Kwon;Kim, Hak-Jin;Jung, Hoe-Kyung
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.16 no.6
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    • pp.1193-1198
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    • 2012
  • In this paper, we design and implement A4 sized, web-based POP(Print On Demand) system using multi-layer technique. We Propose the framework of POP system, which uses multi-layer technique, uses highly accessible web-service, produces template, enables a user to easily edit, and allows the user to instantly print edited files. This system will be widely used in web-based electronic publication and e-book.

Multi-Level Operation with Two-Level Converters through a Double-Delta Source Connected Transformer

  • Park, Yongsoon;Ohn, Sungjae;Sul, Seung-Ki
    • Journal of Power Electronics
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    • v.14 no.6
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    • pp.1093-1099
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    • 2014
  • This paper proposes a power conversion topology involving a multi-winding transformer and converters. The fundamental idea is described with circuit diagrams, and the voltage output of the proposed topology is analyzed mathematically. The effectiveness of the topology is discussed with test results from a small-scale power conversion system. When conventional hardware consisting of two-level converters and a transformer is employed, multi-level voltage outputs can be applied to the transformer windings by the proposed method.

Modeling and Multivariable Control of a Novel Multi-Dimensional Levitated Stage with High Precision

  • Hu Tiejun;Kim Won-jong
    • International Journal of Control, Automation, and Systems
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    • v.4 no.1
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    • pp.1-9
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    • 2006
  • This paper presents the modeling and multivariable feedback control of a novel high-precision multi-dimensional positioning stage. This integrated 6-degree-of-freedom. (DOF) motion stage is levitated by three aerostatic bearings and actuated by 3 three-phase synchronous permanent-magnet planar motors (SPMPMs). It can generate all 6-DOF motions with only a single moving part. With the DQ decomposition theory, this positioning stage is modeled as a multi-input multi-output (MIMO) electromechanical system with six inputs (currents) and six outputs (displacements). To achieve high-precision positioning capability, discrete-time integrator-augmented linear-quadratic-regulator (LQR) and reduced-order linearquadratic-Gaussian (LQG) control methodologies are applied. Digital multivariable controllers are designed and implemented on the positioning system, and experimental results are also presented in this paper to demonstrate the stage's dynamic performance.

Development of Thermoplastic-Thermoset Multi Component Injection Mold for a Waterproof Connector (방수커넥터용 열가소성-열경화성 이종소재 사출금형 개발)

  • Jung, T. S.;Choi, K. S.
    • Transactions of Materials Processing
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    • v.24 no.6
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    • pp.418-425
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    • 2015
  • Based on eco-friendly advantages and the enhanced development in the chemical and physical characteristics, liquid silicone rubber (LSR) is widely used in producing precision parts in the automotive, medical, electronics, aeronautical and many other industries. In the current work, a thermoplastic-thermoset multi component injection molding (MCM) was developed for a waterproof automotive connector housing using PBT and LSR resins. Measurements of the rheological characteristics of PBT and LSR were made to improve the reliability of the numerical analysis for the multi component injection process. With the measured viscosity, pvT and curing data, numerical analysis of the multi cycle injection molding was conducted using simulation software (Sigma V5.0).

Performance Analysis of Shared Buffer Router Architecture for Low Power Applications

  • Deivakani, M.;Shanthi, D.
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.16 no.6
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    • pp.736-744
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    • 2016
  • Network on chip (NoC) is an emerging technology in the field of multi core interconnection architecture. The routers plays an essential components of Network on chip and responsible for packet delivery by selecting shortest path between source and destination. State-of-the-art NoC designs used routing table to find the shortest path and supports four ports for packet transfer, which consume high power consumption and degrades the system performance. In this paper, the multi port multi core router architecture is proposed to reduce the power consumption and increasing the throughput of the system. The shared buffer is employed between the multi ports of the router architecture. The performance of the proposed router is analyzed in terms of power and current consumption with conventional methods. The proposed system uses Modelsim software for simulation purposes and Xilinx Project Navigator for synthesis purposes. The proposed architecture consumes 31 mW on CPLD XC2C64A processor.

Wafer Burn-in Method for SRAM in Multi Chip Package (Multi Chip Package의 SRAM을 위한 웨이퍼 Burn-in 방법)

  • Yoon, Jee-Young;Ryu, Jang-Woo;Kim, Hoo-Sung;Sung, Man-Young
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.6
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    • pp.506-509
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    • 2005
  • This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

Development of Multi-drone System for Smart Agriculture: A Work-in-progress Report (스마트 농업용 멀티드론 시스템 개발: 진행 현황)

  • Park, Youngju;Lee, Hyunjin;Ju, Chanyoung;Son, Hyoung Il
    • Journal of Institute of Convergence Technology
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    • v.6 no.1
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    • pp.43-47
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    • 2016
  • In this paper, we report a work-in-progress about development of multi-drone system for smart agriculture. The multi-drone system is controlled via a haptic teleoperation by a human operator. The purpose of the multi-drone system is that let the human operator to easily handle the multiple drones which are maintaining a fixed formation using ZigBee communication network.