Journal of the Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회논문지)

The Korean Institute of Electrical and Electronic Material Engineers (한국전기전자재료학회)
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Wafer Burn-in Method for SRAM in Multi Chip Package

Multi Chip Package의 SRAM을 위한 웨이퍼 Burn-in 방법

  • 윤지영 (고려대학교 전기공학과) ;
  • 유장우 (고려대학교 전기공학과) ;
  • 김후성 (삼성전자(주) 메모리사업부) ;
  • 성만영 (삼성전자(주) 메모리사업부)
  • Published : 2005.06.01
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Abstract

This paper presents the improved burn-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved by the burn-in process. Reliability Problem is very significant in the MCP which includes over two chips in a package because the failure of one SRAM chip has a large influence on the yield and quality of the other chips such as Flash Memory, DRAM, etc. Therefore the quality of SRAM must be guaranteed. To improve the qualify of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the previously used methods and it is found to be effective in detecting particular failures. Finally, with the composition of some kinds of methods, we achieved the high quality of SRAM in MCP.

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References

  1. 이동희, 최복길, 성만영, 문병무, 성영권, 'MOS 커패시터 절연막의 수명예측법에 관한 연구', 전기전자재료학회논문지, 12권7호, p. 611, 1999
  2. H. H. Huston, M. H. Wood, and V. M. De Palma, 'Burn-in effectiveness - theory and measurement', International Reliability Physics Symposium, p. 271, 1991
  3. J. H. Lee, M. J. Jang, K. S. Yoon, Y. J. Park, H. G. Yoon, and H. D. Lee, 'Characterization of stress-induced p+/n junction leakage failure for sub-0.15 um CMOS technology', J. Korean Phys. Soc., Vol. 40, No.4, p. 610, 2002
  4. D. Hodges, W. Adamjee, C. Corona, J. M. Czarnowski, R. Eklund, J. Guajardo, and A. Youngblood, 'Flip chip MCM-L using known good die', International Conference on Multichip Modules and High Density Packaging, p. 358, 1998
  5. K. Nierle and A. Norris, 'Methods for Increasing Burn in Efficiency for DRAMs', International Reliability Workshop Final Report, p. 183, 2000
  6. A. D. Singh, 'On wafer burn-in strategies for MCM die', International Conference and Exhibition Multichip Modules, p. 255, 1994
  7. 배지철, 이용재, '분석 조건에 따른 p-MOSFET의 게이트에 유기된 드레인 누설전류의 열화', 전기전자재료학회논문지,10권, 1호, p. 26, 1997