• Transactions of the Korean Society of Automotive Engineers
• /
• v.15 no.3
• /
• pp.41-46
• /
• 2007

Lightweight multi-layered boards with high stiffness for the automotive interior trims were developed, which were composed of a single material. The boards were constructed in the form of substrate/core/substrate with newly developed materials. The materials which have high tensile strength and elongation were selected for the substrate materials, and those which have high compressive strength and low density were selected for the core materials. 25 types of multi-layered boards were fabricated using the selected substrate and core materials. The compatibility with the skin materials, the formability and the tensile strength and flexural strength of the specimens were evaluated. The results show that three types of multi-layered boards(Kenboard/EPP foam/Kenboard, Twintex/PP honeycomb/Twintex, Curv sheet/EPP foam/Curv sheet) are appropriate for the automotive interior trims. Considering the ease of materials supply and the economical aspect, Kenboard/EPP foam/Kenboard is thought to be the most realistic alternative.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.47 no.12
• /
• pp.55-67
• /
• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.49 no.8
• /
• pp.661-669
• /
• 2021

A mechanical stiffener has been mainly applied on a PCB to secure fatigue life of a solder joint of an electronic components in spaceborne electronics by minimizing bending displacement of the PCB. However, it causes an increase of mass and volume of the electronics. The high damping PCB implemented by multi-layered viscoelastic tapes of a previous research was effective for assuring the fatigue life of the solder joint, but it also has a limitation to decrease accommodation efficiency for the components on the PCB. In this study, we proposed high damping PCB with a multi-layered superelastic shape memory alloy stiffener for spatialminimized, light-weighted, high-integrated structure design of the electronics. To investigate the basic characteristics of the proposed PCB, a static load test, a free vibration test were performed. Then, the high damping characteristic and the design effectiveness of the PCB were validated through a random vibration test.

• Journal of Industrial Technology
• /
• v.26 no.A
• /
• pp.101-108
• /
• 2006

This study is the results of experimental and numerical study on the consolidational behavior of multi-layered soft soil ground installed with plastic board drains (PBD). Centrifuge model tests with a marine clay sampled from field were performed to investigate the consolidational behavior of multi-layered ground where a dredged soil was placed on the soft clay ground and PBDs were installed. Test results were compared with those of numerical analyses, using the 2-D equivalent model previously proposed. From test results, it was found that the amount of consolidation settlement occurred in the original ground due to embankment surcharge loads was in the range of 38% of total settlement in the whole ground. From the results of cone penetration tests executed after finishing the centrifuge model tests, the cone resistance was found to increase with depth. The measured water contents inbetween PBDs were in the ranges of 38~50% and their values tended to increase with increasing the distance between PBDs.

• Journal of the Korean Society for Aeronautical & Space Sciences
• /
• v.48 no.5
• /
• pp.383-390
• /
• 2020

Wedge locks have been widely used for spaceborne electronics for mounting or removal of a printed circuit board (PCB) during integration, test and maintenance process. However, it can basically provide a mechanical constraint on the edge of the board. Thus, securing a fatigue life of solder joint for electronic package by limiting board deflection becomes difficult as the board size increases. Previously, additional stiffeners have been applied to reduce the board deflection, but the mass and volume increases of electronics are unavoidable. To overcome the aforementioned limitation, we proposed an application of multi-layered PCB sheet with viscoelastic adhesive tapes to implement high-damping capability on the board. Thus, it is more advantageous in securing the fatigue life of package under launch environment compared with the previous approach. The basic characteristics of the PCB with the multi-layered sheet was investigated through free-vibration tests at various temperatures. The effectiveness of the proposed design was validated through launch vibration test at qualification level and fatigue life prediction of electronic package based on the test results.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
• /
• 2002.05a
• /
• pp.78-81
• /
• 2002

Printed Circuit Boards for satellite are composed of multi-layered copper plate and glass epoxy. Each copper layer have the complicated and different pattern to operate correctly for its mission. Especially. copper layer give effect on the PCB stiffness seriously. But It can make more complicate to predict the exact stiffness of PCB. In KOMPSAT-2 program, too many type of PCB are used for each electronic unit, and they have different type of pattern of copper layer. Solar array regulator has two type of PCB and it will be considered for this study. In this study. we calculate the PCB board stiffness of KOMPSAT-2 SAR unit considering the concept of simplified representative volume element. It will be correlated with the test results under KOMPSAT-2 vibration environmental condition to increase the reliability of this study.

• Laser Solutions
• /
• v.11 no.4
• /
• pp.29-34
• /
• 2008

Ultraviolet laser micromachining has increasingly been applied to the electronics industry where precision machining of high-density, multi-layer, and multi material components is in a strong demand. Due to the ever-decreasing size of electronic products such as cellular phones, MP3 players, digital cameras, etc., flexible printed circuit board (FPCB), multi-layered with polymers and metals, tends to be thicker. In present, multi-layered FPCBs are being mechanically cut with a punching die. The mechanical cutting of FPCBs causes such defects as burr on layer edges, cracks in terminals, delamination and chipping of layers. In this study, the laser cutting mechanism of FPCB was examined to solve problems related to surface debris and short-circuiting that can be caused by the photo-thermal effect. The laser cutting of PI and FCCL, which are base materials of FPCB, was carried out using a pico-second laser(355nm, 532nm) and nano-second UV laser with adjusting variables such as the average/peak power, scanning speed, cycles, gas and materials. Points which special attention should be paid are that a fast scanning speed, low repetition rate and high peak power are required for precision machining.

• Proceedings of the KSME Conference
• /
• 2007.05a
• /
• pp.321-325
• /
• 2007

Recently, demands on thin multi-layer printed circuit boards(PCB) have been rapidly increased with broad spread of personal portable digital appliances such as multi-media. In case of mobile phone, however, the fact that PCBs have low flexural strength might cause defects. The purpose of this study is to improve the flexural strength by substituting the well-known GFRP(glass fiber reinforced plastic) for CFRP(carbon fiber reinforced plastic). Firstly, finite element simulation was carried out using ABAQUS to find out a unique CFRP layer that has a role to sustain the applied forces mainly in PCB. Secondly, three point bending tests were conducted with the newly designed CFRP PCB model to verify the improvement of the flexural strength. Consequently, it is shown that PCB layered with the CFRP on both outer sides of the board can be used to improve the flexural strength effectively.

• Journal of the Korean Wood Science and Technology
• /
• v.28 no.3
• /
• pp.1-8
• /
• 2000

To develop the technology of producing structural board from low grade materials, an attempt was made to produce strand/particle composites from split wood strand(S) and particle(P) of (Cryptomeria japonica D. Don), which changed the layer construction and the ratio of S/P. The influence of layer construction on board properties was determined, focusing on the number and alignment of the S layers. The effect of weight ratio of S/P (3:7, 1:1, 7:3) on mechanical properties was also discussed on seven layered panel. Mechanical properties were determined from static bending tests to give parallel and perpendicular modulus of rupture (MOR) and modulus of elasticity (MOE), and the internal bond (IB) strength. In general, the surface strand layers contributed to the MOR and MOE. The parallel MOR and MOE values were the largest for the single layered S panel (only Slayers: S1), but the perpendicular MOR and MOE was the smallest. Perpendicular MOR and MOE were the largest for seven layered composite that had two cross oriented strand layers (SPSPSPS: SP7). Specimens retained more than half of their MOE and MOR after two hours in boiling water and one hour soaking. IB was the largest for the panel having only P layers, however, differences in IB strength were not identified among the other multi-layered composite panels thus the effect of layer construction on IB strength was small. Thickness swelling (TS) and surface roughness were smaller for the composite having P layers on the surface than for those having S layers. The addition of strands did not enhance the mechanical properties (MOR, MOE, IB). TS values for the panels, with which the S/P ratio was over than 1:1, was the similar to the value for the single layered S panels.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.24 no.4
• /
• pp.357-365
• /
• 2013

The 4 by 4 series slot sub-array antenna is proposed using substrate integrated waveguide(SIW) technology for 35 GHz of Ka band application. The proposed antenna is realized with multi-layered structure for compact size and easy integration features. 4 by 4 radiating slots are arrayed on top PCB with equal spacing and the feeding SIWs are arranged on middle and bottom PCBs for uniform power distribution. The multi-layered antenna is realized using RT/Duroid 5880 that has dielectric constant of 2.2 and the total antenna size is $750.76mm^2$. The individual parts such as radiators and feeding networks are simulated using full-wave simulator CST MWS. Furthermore, the total sub-array antenna also fabricated and measured the electrical performances such as impedance bandwidth under the criteria of -10 dB(490 MHz), maximum gain(18.02 dBi), sidelobe level(SLL)(-11.0 dB), and cross polarization discrimination (XPD)(-20.16 dB).