• Title/Summary/Keyword: Multi-Signal

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Discriminant Analysis of Marketed Beverages Using Multi-channel Taste Evaluation System (다채널 맛 평가시스템에 의한 시판음료의 판별분석)

  • Park, Kyung-Rim;Bae, Young-Min;Park, In-Seon;Cho, Yong-Jin;Kim, Nam-Soo
    • Applied Biological Chemistry
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    • v.47 no.3
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    • pp.300-306
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    • 2004
  • Eight cation or anion-responsive polymer membranes were prepared by a casting procedure employing polyvinyl chloride, Bis (2-ethylhexyl)sebacate and each electroactive material in the ratio of 66 : 33 : 1. The resulting membranes were separately installed onto the sensitive area of the ionic electrodes to produce an 8-channel taste sensor array. The taste sensors of the array were connected to a high-input impedance amplifier and the amplified sensor signals were interfaced to a PC via an A/D converter. The taste evaluation system was applied to a discriminant analysis on six groups of marketed beverages like sikhye, sujunggwa, tangerine juice, ume juice, ionic drink and green tea. When the signal data from the sensor array were analyzed by principal component analysis after normalization, the 1st, 2nd and 3rd principal component explained most of the total data variance. The six groups of the analyzed beverages were discriminated well in the three dimensional principal component space. The half of the five groups of the analyzed beverages was also discriminated in the two dimensional principal component plane.

Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

  • Moon, Dae-Ho;Ha, Tae-Min;Kim, Boom-Soo;Han, Seung-Soo;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.431-432
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    • 2012
  • In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

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The Study on Characteristic Composition of As in a-Se with X-ray Detection Sensor using $CaWO_4/a-Se$ (다층구조($CaWO_4/a-Se$) 기반의 X선 검출센서에서 a-Se에 첨가된 As의 특성비 연구)

  • Choe, Jang-Yong;Lee, Dong-Gil;Sin, Jeong-Uk;Kim, Jae-Hyeong;Nam, Sang-Hee;Park, Ji-Koon;Kang, Sang-Sik;Jang, Gi-Won;Lee, Hung-Won
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2002.11a
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    • pp.432-435
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    • 2002
  • The ultimate study of this research is to improve the properties of digital X-ray receptor based on amorphous selenium. There are being two prominent studying for Digital Radiography. Direct and Indirect method of Digital Radiography are announced for producing high quality digital image. But each two systems have strength and weakness. This is a basic research for developing of Hybrid digital radiography which is a new type X-ray detector. ln this study, we investigated the electrical characteristic of multi-layer$(CaWO_4+a-Se)$ as a photoconductor according to the changing iodine composition ratio. The iodine composition ratio of a-Se compound is classified into 5 different kinds which have 30ppm, 100ppm, 300ppm, 500ppm, 700ppm and were made test sample throught thermo-evaporation. The phosphor layer of $CaWO_4$ was overlapped on a-Se using EFIRON optical adhesives. We measured the dark and photo current about the test sample and compared the electrical characteristic of the net charge and signal-to-noise ratio. Among other things, test sample of compound material of 700ppm iodine showed good characteristic of $2.53nA/cm^2$ dark current and $479nC/cm^2{\cdot}mR$ net charge at $3V/{\mu}m$.

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Utilization of Rotational Beam Direction Patterns for Performance Enhancement of Cell Boundary UEs (셀 경계 단말의 성능 향상을 위한 회전성 빔 방향 패턴의 활용)

  • Lee, Donghyun;Sung, Wonjin
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.11
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    • pp.12-20
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    • 2013
  • Even though extensive research results have been applied to wireless cellular systems to improve their capacity and coverage, severe performance degradation experienced in cell boundary areas still remains as a major limiting factor to prohibit further improvement of user equipment (UE) throughput. In the Long Term Evolution-Advanced (LTE-A) standard of the Third Generation Partnership Project (3GPP), Some advanced techniques have been introduced to overcome this "cell-edge problem", including coordinated multipoint transmission and reception (CoMP) and inter-cell interference coordination (ICIC). In this paper, we propose yet another strategy to improve the performance of low-tier UEs by using the concept of multiple beam direction patterns (BDPs). Such multiple BDPs can be implemented using multi-layer antenna arrays stacked vertically at base station (BS) sites to transmit signals in different main beam directions. In comparison to conventional three-sector antennas with a fixed beam pattern, the proposed methods makes signal transmission in a rotational fashion to significantly enhance the reception quality of UEs located near sector (or cell) edge areas, preventing the situation where certain UEs are marginally covered by the BS for the whole transmission time. Performance evaluation results show that the proposed scheme outperforms the conventional three-sector transmission by 171% in low 5% UEs in terms of the UE throughput.

Scattering Characteristic from Building Walls with Periodic and Random Surface (규칙적 또는 불규칙적 구조를 가지는 빌딩벽면에서의 전자파 산란 특성)

  • 윤광렬
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.15 no.4
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    • pp.428-435
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    • 2004
  • With the rapid and wide-spread use of cellular telephones much attention has been focussed on propagation in the urban area crowed with buildings and houses. It is often surrounded by hills, forests, and mountains. The importance of surface scattering intereference between transmitters and receivers on the rough surfaces has been interested and investigated. Therefore, a prediction method is necessary to estimate the influence of rough surfaces on microwave radio propagation. Moreover, most of the mobile communications are performed based on the digital communication system rather than the analog one. In this case, we must pay more careful attention to the signal delay caused by the phase delay due to the multi-path propagation. In this paper we have analyzed numerically scattering of electromagnetic waves from building walls by using FVTD(Finite Volume Time Domain) method. We consider three different types of rough surfaces such as periodic, random, and composite structures. We calculate the bistatic normalized radar cross section (NRCS) for horizontal and vertical polarization, and we take account of the conventional optical reflection which corresponds to the n-th Bragg reflection for periodic structures. In addition, we investigated what conditions are needed in order to be able to ignore the higher order Bragg reflection for the periodic structures.

Development of the EM wave Absorber for Improving the Performance of Hi-Pass System in ITS (ITS에 있어서 Hi-Pass 시스템의 성능 개선을 위한 전파흡수체의 개발)

  • Kim, Dong Il;Kim, Jeong Chang;Joo, Yang Ick
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.18 no.7
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    • pp.1505-1510
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    • 2014
  • High-Pass (ETC ; Electronic Toll Collection) system is one of the basic elements, which adopts a wireless communication method using 5.8 GHz and can realize a part of ITS (Intelligent Traffic System). On the other hand, communication errors occur frequently in Hi-Pass system due to signal erros, multi-path reflection, and/or system-to-system interferences. To solve these problems, an EM (Electro-Magnetic) wave absorber can be used. To solve these Problems, we fabricated some samples in the different composition ratios of Carbon, Sendust, and CPE, and it was confirmed that the optimum composition ratio of Carbon : Sendust : CPE is 10 : 40 : 50 wt.%. The complex relative permittivity and complex relative permeability were derived by using the measured data. In addition, the optimum design parameters for the absorber were determined by simulation. Then the absorption abilities were calculated by changing the thickness of the EM wave absorbers. As a result, the optimum thickness of the developed EM wave absorber was 2.85 mm with absorption ability over 22.4 dB at 5.8 GHz. Futhermore, the EM wave absorber was fabricated based on the simulated and designed values. The measured values agreed well with the simulated ones. Therefore, it was clearly shown that the developed EM wave absorber in this paper is to be applied in actual situations.

A study of ubiquitous-RTLS system for worker safety (작업자 안전관리를 위한 유비쿼터스-실시간 위치추적시스템 연구)

  • Kim, Young-Baig
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.37 no.1C
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    • pp.1-7
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    • 2012
  • At the industrial work site, the manufacturing process is being automated to improve work efficiency. However, it is often difficult to automate the entire manufacturing process, and there are spaces in which workers there are constantly exposed to danger. To protect such workers from the danger, this paper studied a worker safety management system for the industrial work site which uses a location recognition system and which is based on the Ubiquitous-Wireless Sensor Network (U-WSN). Using wireless signals, the distance between two devices can be measured and the location of a worker can be calculated using triangularization in 3-D. But at the industrial work sites where there are a lot of steel and structures, errors occur due to signal reflection and multi-path, etc., which makes it difficult to get the accurate location. To address this problem the following was done: first, a circular polarization patch antenna appropriate to the work site was used to reduce the degree of error that may occur from the antenna emission pattern and the particular Line of Sight (LOS); second, a 3-D localization technique and a filtering algorithm were used to improve the accuracy of location determination. The developed system was tested by using it on a wharf crane to validate its accuracy and effectiveness. The proposed location recognition system is expected to contribute greatly in ensuring the safety of workers at industrial work sites.

Enhanced Spatial Covariance Matrix Estimation for Asynchronous Inter-Cell Interference Mitigation in MIMO-OFDMA System (3GPP LTE MIMO-OFDMA 시스템의 인접 셀 간섭 완화를 위한 개선된 Spatial Covariance Matrix 추정 기법)

  • Moon, Jong-Gun;Jang, Jun-Hee;Han, Jung-Su;Kim, Sung-Soo;Kim, Yong-Serk;Choi, Hyung-Jin
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.34 no.5C
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    • pp.527-539
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    • 2009
  • In this paper, we propose an asynchonous ICI (Inter-Cell Interference) mitigation techniques for 3GPP LTE MIMO-OFDMA down-link receiver. An increasing in symbol timing misalignments may occur relative to sychronous network as the result of BS (Base Station) timing differences. Such symbol synchronization errors that exceed the guard interval or the cyclic prefix duration may result in MAI (Multiple Access Interference) for other carriers. In particular, at the cell boundary, this MAI becomes a critical factor, leading to degraded channel throughput and severe asynchronous ICI. Hence, many researchers have investigated the interference mitigation method in the presence of asynchronous ICI and it appears that the knowledge of the SCM (Spatial Covariance Matrix) of the asynchronous ICI plus background noise is an important issue. Generally, it is assumed that the SCM estimated by using training symbols. However, it is difficult to measure the interference statistics for a long time and training symbol is also not appropriate for MIMO-OFDMA system such as LTE. Therefore, a noise reduction method is required to improve the estimation accuracy. Although the conventional time-domain low-pass type weighting method can be effective for noise reduction, it causes significant estimation error due to the spectral leakage in practical OFDM system. Therefore, we propose a time-domain sinc type weighing method which can not only reduce the noise effectively minimizing estimation error caused by the spectral leakage but also implement frequency-domain moving average filter easily. By using computer simulation, we show that the proposed method can provide up to 3dB SIR gain compared with the conventional method.

Effects of Gradient Switching Noise on ECD Source Localization with the EEG Data Simultaneously Recorded with MRI (MRI와 동시에 측정한 뇌전도 신호로 전류원 국지화를 할 때 경사자계 유발 잡음의 영향 분석)

  • Lee H. R.;Han J. Y.;Cho M. H.;Im C. H.;Jung H. K.;Lee S. Y.
    • Investigative Magnetic Resonance Imaging
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    • v.7 no.2
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    • pp.108-115
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    • 2003
  • Purpose : To evaluate the effect of the gradient switching noise on the ECD source localization with the EEG data recorded during the MRI scan. Materials and Methods : We have fabricated a spherical EEG phantom that emulates a human head on which multiple electrodes are attached. Inside the phantom, electric current dipole(ECD) sources are located to evaluate the source localization error. The EEG phantom was placed in the center of the whole-body 3.0 Tesla MRI magnet, and a sinusoidal current was fed to the ECD sources. With an MRI-compatible EEG measurement system, we recorded the multi channel electric potential signals during gradient echo single-shot EPI scans. To evaluate the effect of the gradient switching noise on the ECD source localization, we controlled the gradient noise level by changing the FOV of the EPI scan. With the measured potential signals, we have performed the ECD source localization. Results : The source localization error depends on the gradient switching noise level and the ECD source position. The gradient switching noise has much bigger negative effects on the source localization than the Gaussian noise. We have found that the ECD source localization works reasonably when the gradient switching noise power is smaller than $10\%$ of the EEG signal power. Conclusion : We think that the results of the present study can be used as a guideline to determine the degree of gradient switching noise suppression in EEG when the EEG data are to be used to enhance the performance of fMRI.

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Analysis of Features and Discriminability of Transient Signals for a Shallow Water Ambient Noise Environment (천해 배경잡음 환경에 적합한 과도신호의 특징 및 변별력 분석)

  • Lee, Jaeil;Kang, Youn Joung;Lee, Chong Hyun;Lee, Seung Woo;Bae, Jinho
    • Journal of the Institute of Electronics and Information Engineers
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    • v.51 no.7
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    • pp.209-220
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    • 2014
  • In this paper, we analyze the discriminability of features for the classification of transient signals with an ambient noise in a shallow water. For the classification of the transient signals, robust features for the variance of a noise are required due to a low SNR under a marine environment. In the modelling the ambient noise in shallow water, theoretical noise model, Wenz's observation data from the shallow water, and Yule-walker filter are used. Discrimination of each feature of the transient signals with an additive ambient noise is analyzed by utilizing a Fisher score. As the analysis of a classification accuracy about the transient signals of 24 classes using the selected features with a high discriminability, the features selected in the environment without a noise relatively have a good classification accuracy. From the analyzed results, we finally select a total 16 features out of 28 features. The recognition using the selected features results in the classification accuracy of 92% in SNR 20dB using Multi-class SVM.