• Journal of Advanced Navigation Technology
• /
• v.12 no.6
• /
• pp.604-610
• /
• 2008

A 2.4 GHz CMOS RF front-end using for ZigBee application is described The front-end consists of a low noise amplifier and a down-mixer and uses a 2 MHz IF frequency. A common source with resistive feedback and an inductive degeneration are adopted for a low noise amplifier, and a 20 dB gain control step is digitally controlled. A passive mixer for low current consumption is employed. The RF front-end is implemented in 0.18 ${\mu}m$IP6M CMOS process. The measured performance is 4.44 dB NF and -6.5 dBm IIP3 while consuming 3.28 mA current from a 1.8 V supply.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 2016.11a
• /
• pp.98.1-98.1
• /
• 2016

PTFE (Polytetrafluoroethylene) 는 벌크 형태는 물론 박막으로도 독특한 특성을 나타내는 물질이다. 매우 낮은 마찰계수, 발수표면특성, 화학적 비반응성은 다양한 방면의 적용이 가능하게 한다. 두께 $1-2{\mu}m$ 이나 50 nm 이하의 박막의 형태로서 발수 특성은 스퍼터링 조건에 따라서는 벌크 PTFE의 특성보다 뛰어나다. 순수한 PTFE 타겟을 사용하여 얇은 PTFE 막 증착을 위해 RF (radio-frequency) 스퍼터링을 하였다. 스퍼터 타겟 건 파워, 공정 압력, 그리고 기판 스테이지와 Si wafer 나 다양한 시편에 인가되는 RF 바이어스 (bias) 등과 같은 스퍼터링 변수의 변화가 가능하다. 공정 변수에 따라서 RF 스퍼터링에 의한 순수한 PTFE 박막과 바이어스가 인가된 유사 PTFE 박막을 비교하여 탐구하였다. 스퍼터링에 의한 PTFE 코팅은 접촉각이 100도 또는 그이상의 초발수성을 나타내는 장점을 갖고 있고, 90% 이상의 높은 투과도를 나타낸다. PTFE 타겟을 사용한 종래의 일반적인 스퍼터링에 의하여, 일예로 실리콘 웨이퍼상에 증착된 코팅막은 낮은 경도와 기판과의 밀착력이 좋지 않은 문제를 갖고 있다. 높은 에너지 환경에서 만들어진 PTFE 코팅은 기존의 스퍼터링 방식으로 만들어진 코팅에 비해 다른 특성을 나타낸다. PTFE 막의 경도와 밀착력을 높이고자 bias를 인가한 RF 스퍼터링을 시도하였다. 코팅 접촉각, 투과도, 나노인덴터에 의한 경도, 그리고 스크래치 테스트에 의한 코팅막의 밀착력을 살펴보았다. PTFE 폴리머 타겟을 사용한 RF 스퍼터링으로 만들어진 고경도 PTFE 유사 코팅의 경도 변화 기구를 고찰하였다.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.11 no.4
• /
• pp.238-246
• /
• 2011

A 3-5 GHz UWB radar chip in 0.13 ${\mu}m$ CMOS process is presented in this paper. The UWB radar transceiver for surveillance and biometric applications adopts the equivalent time sampling architecture and 4-channel time interleaved samplers to relax the impractical sampling frequency and enhance the overall scanning time. The RF front end (RFFE) includes the wideband LNA and 4-way RF power splitter, and the analog signal processing part consists of the high speed track & hold (T&H) / sample & hold (S&H) and integrator. The interleaved timing clocks are generated using a delay locked loop. The UWB transmitter employs the digitally synthesized topology. The measured NF of RFFE is 9.5 dB in 3-5 GHz. And DLL timing resolution is 50 ps. The measured spectrum of UWB transmitter shows the center frequency within 3-5 GHz satisfying the FCC spectrum mask. The power consumption of receiver and transmitter are 106.5 mW and 57 mW at 1.5 V supply, respectively.

• ETRI Journal
• /
• v.33 no.6
• /
• pp.969-972
• /
• 2011

This letter presents a CMOS RF front-end operating in a subthreshold region for low-power Band-III mobile TV applications. The performance and feasibility of the RF front-end are verified by integrating with a low-IF RF tuner fabricated in a 0.13-${\mu}m$ CMOS technology. The RF front-end achieves the measured noise figure of 4.4 dB and a wide gain control range of 68.7 dB with a maximum gain of 54.7 dB. The power consumption of the RF front-end is 13.8 mW from a 1.2 V supply.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.17 no.3
• /
• pp.340-347
• /
• 2004

Ultra-small size, high-performance, solenoid-type RF chip inductors utilizing low-loss A1$_2$O$_3$ core materials were investigated. The dimensions of the RF chip inductors fabricated were 1.0mm${\times}$0.5mm${\times}$0.5mm and copper coils were used. The materials (96％ A1$_2$O$_3$) and shape (I-type) of the core, the diameters (40${\mu}{\textrm}{m}$) and position (middle) of the coil, and the lengths (0.35mm) of solenoid were determined by a high-frequency structure simulator (HFSS) to maximize the performance of the inductors. The high-frequency characteristics of the inductance (L) and quality-factor (Q) of the developed inductors were measured using a RF impedance/material analyzer (E4991A with E16197A test fixture). The developed inductors exhibit an inductance of 11 to 11.3nH and a qualify factor of 22.3 to 65.7 over the frequency ranges of 250 MHz to 1.7 GHz, and show results comparable to those measured for the inductors prepared by Coilcraft$^{TM}$. The simulated data described the high-frequency data of the L and Q of the fabricated inductors well.

• Proceedings of the IEEK Conference
• /
• 1998.10a
• /
• pp.1121-1124
• /
• 1998

A CMOS RF bandpass amplifier which performs both functions of low-noise amplifier and bandpass filter is designed for the application of 1.9 ㎓ RF front-end in wireless receivers. The positive-feedback Q-enhancement technique is used to overcome the low gain and low Q factor of the bandpass amplifier. The designed bandpass amplifier is simulated with HSPICE and fabricated using HYUNDAI $0.8\mu\textrm{m}$ CMOS 2-poly 2-metal full custom process. Under 3 V supply voltage, results of simulation show that the CMOS bandpass amplifier provides the power gain 23dB, noise figure 3.8 dB, and power dissipation 55mW.

• Journal of the Korean Magnetics Society
• /
• v.12 no.2
• /
• pp.51-56
• /
• 2002

Permalloy thin films fabricated by rf magnetron sputtering showed the excellent magnetic properties, i.e., an effective permeability of over 2000 at 1$\mu\textrm{m}$ thick up to 10 MHz, a saturation magnetization of 10∼12 kG, a coercive force of 0.2∼1 Oe, resistivity (p) is 20 ${\mu}$$\Omega$cm. In order to control the magnetic anisotropy direction of the films in a wafer scale, two parallel Nd-Fe-B permenant mangnets were used to provide the magnetic field during the sputtering process. As a result, the anisotropy direction was successfully controlled when the two magnets were seperated with a distance of 70 mm. 3D simmulation of the magnteic fields around the wafer during sputtering were in accord with the above result.

• Transactions of the Society of Information Storage Systems
• /
• v.1 no.2
• /
• pp.150-154
• /
• 2005

The effects of track format on the inter-track crosstalk of holographic ROM system are investigated. To quantify the effect of inter-track crosstalk for various track width and pitch, we defined Signal to Crosstalk noise Ratio(SCR) as a criterion. A numerical simulation is used to obtain the SCR as a function of track widths and pitches. We compared different 4 track widths having 0.3, 0.4, 0.5, and 0.6 ${\mu}m$ considering resolving power of lens and recording density. The simulation results show that the SCRs for each track width are maximized at the track pitch which has the value of 0.72, 0.72, 0.74, and 0.5 ${\mu}m$ respectively. Next, for the three sets with track width-pitch(0.4-0.72, 0.5-0.74, 0.6-0.8 ${\mu}m$) which showed the maximum SCR, we set a minimum pit length so that all sets have a DVD equivalent data density and compared RF signals passed from the slit. The simulation results show that when the track width, pitch, and minimum pit length have 0.5, 0.74, and 0.4 ${\mu}m$ respectively, the difference between the maximum and minimum value of the RF signal showed the greatest value. Also, we investigated RF signal in case of using an amplitude inversion mask, which transmitted regions are inversed against the conventional mask. The simulation results show that the better RF signal may be obtained by using an amplitude inversion mask.

• Journal of IKEEE
• /
• v.4 no.2 s.7
• /
• pp.202-211
• /
• 2000

Utilizing the circuit simulator SPICE, we designed a 1.9GHz CMOS up-conversion mixer and explained in detail the simulation procedures including device modeling for the circuit design. Since the measured characteristics of the chip fabricated using the $0.5{\mu}m$ standard CMOS process had shown a big deviation from the characteristics expected by the original simulations, we tried to figure out the proper reasons for the discrepancies. Simulations considering the discovered problems in the original simulations have shown the validity of the simulation method tried for the design. We have shown that the utilized standard CMOS process can be used for the implementation of the chip characteristics similar to those of the equivalent chip fabricated using the GaAs MESFET process.

• Korean Journal of Materials Research
• /
• v.16 no.1
• /
• pp.19-24
• /
• 2006

ZnO:Al(AZO) films prepared by rf magnetron sputtering on glass substrate and textured by post-deposition chemical etching were applied as front contact and back reflectors for ${\mu}c$-Si:H thin film solar cells. For the front transparent electrode contact, AZO films were prepared at various working pressures and substrate temperature and then were chemically etched in diluted HCl(1%). The front AZO films deposited at low working pressure(1 mTorr) and low temperature ($240^{\circ}C$) exhibited uniform and high transmittance ($\geq$80%) and excellent electrical properties. The solar cells were optimized in terms of optical and electrical properties to demonstrate a high short-circuit current.