• 제목/요약/키워드: MuRF1

검색결과 613건 처리시간 0.027초

L1/L5 밴드 GPS/Galileo 수신기를 위한 $0.13{\mu}m$ 3.6/4.8 mW CMOS RF 수신 회로 (A 3.6/4.8 mW L1/L5 Dual-band RF Front-end for GPS/Galileo Receiver in $0.13{\mu}m$ CMOS Technology)

  • 이형수;조상현;고진호;남일구
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2008년도 하계종합학술대회
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    • pp.421-422
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    • 2008
  • In this paper, CMOS RF front-end circuits for an L1/L5 dual-band global positioning system (GPS)/Galileo receiver are designed in $0.13\;{\mu}m$ CMOS technology. The RF front-end circuits are composed of an RF single-to-differential low noise amplifier, an RF polyphase filter, two down-conversion mixers, two transimpedance amplifiers, a IF polyphase filter, four de-coupling capacitors. The CMOS RF front-end circuits provide gains of 43 dB and 44 dB, noise figures of 4 dB and 3 dB and consume 3.6 mW and 4.8 mW from 1.2 V supply voltage for L1 and L5, respectively.

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High Performance RF Passive Integration on a Si Smart Substrate for Wireless Applications

  • Kim, Dong-Wook;Jeong, In-Ho;Lee, Jung-Soo;Kwon, Young-Se
    • ETRI Journal
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    • 제25권2호
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    • pp.65-72
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    • 2003
  • To achieve cost and size reductions, we developed a low cost manufacturing technology for RF substrates and a high performance passive process technology for RF integrated passive devices (IPDs). The fabricated substrate is a conventional 6" Si wafer with a 25${\mu}m$ thick $SiO_2$ surface. This substrate showed a very good insertion loss of 0.03 dB/mm at 4 GHz, including the conductive metal loss, with a 50 ${\Omega}$ coplanar transmission line (W=50${\mu}m$, G=20${\mu}m$). Using benzo cyclo butene (BCB) interlayers and a 10 ${\mu}m$ Cu plating process, we made high Q rectangular and circular spiral inductors on Si that had record maximum quality factors of more than 100. The fabricated inductor library showed a maximum quality factor range of 30-120, depending on geometrical parameters and inductance values of 0.35-35 nH. We also fabricated small RF IPDs on a thick oxide Si substrate for use in handheld phone applications, such as antenna switch modules or front end modules, and high-speed wireless LAN applications. The chip sizes of the wafer-level-packaged RF IPDs and wire-bondable RF IPDs were 1.0-1.5$mm^2$ and 0.8-1.0$mm^2$, respectively. They showed very good insertion loss and RF performances. These substrate and passive process technologies will be widely utilized in hand-held RF modules and systems requiring low cost solutions and strict volumetric efficiencies.

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Sub-0.1㎛ MOSFET의 게이트전압 종속 캐리어 속도를 위한 정확한 RF 추출 방법 (Accurate RF Extraction Method for Gate Voltage-Dependent Carrier Velocity of Sub-0.1㎛ MOSFETs in the Saturation Region)

  • 이성현
    • 전자공학회논문지
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    • 제50권9호
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    • pp.55-59
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    • 2013
  • Sub-$0.1{\mu}m$로 스케일이 감소함에 따라 기생 저항 효과가 크게 발생되는 dc Ids 측정 데이터 없이 측정 S-파라미터로부터 얻어진 RF Ids를 사용하여 벌크 MOSFET의 포화영역에서 게이트 전압 종속 유효 캐리어 속도를 추출하는 새로운 방법이 개발되었다. 이 방법은 바이어스 종속 기생 게이트-소스 캐패시턴스와 유효 채널 길이의 복잡한 추출 없이 포화영역의 유효 캐리어 속도를 추출할 수 있게 한다. 이러한 RF 기술을 사용하여 벌크 포화 속도를 초과하는 전자 속도 overshoot 현상이 $0.065{\mu}m$ 게이트 길이의 벌크 N-MOSFET에서 관찰되었다.

RF 마그네트론 스퍼터링으로 증착한 두께에 따른 PZT 박막의 강유전 특성에 관한 연구 (Thickness dependence of the piezoelectric characteristic for PZT films using by rf magnetron sputtering)

  • 이태용;박영;송준태
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.313-316
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    • 2003
  • The lead zirconate titanate, $Pb(Zr_{0:52}Ti_{0:48})O_3$, films of $0.5\;{\mu}m,\;1\;{\mu}m$ and $2\;{\mu}m$ thickness were fabricated on $Pt/Ti/SiO_2/Si$ substrate by the rf magnetron sputtering method. The PZT films were annealed using by a rapid thermal annealing (RTA) method. The thickness dependence of the film structure, dielectric properties, Polarization-electric field hysteresis loops and capacitance-voltage characteristics were investigated over the thickness range of $0.5\;{\mu}m,\;1\;{\mu}m$ and $2\;{\mu}m$. According to the XRD patterns of the films, (110) peak intensity increases with film thickness increased. The increase of PZT films thickness leads to the decrease of the remanent polarization and the dielectric constant.

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p38 MAPK Participates in Muscle-Specific RING Finger 1-Mediated Atrophy in Cast-Immobilized Rat Gastrocnemius Muscle

  • Kim, Jung-Hwan;Won, Kyung-Jong;Lee, Hwan-Myung;Hwang, Byong-Yong;Bae, Young-Min;Choi, Whan-Soo;Song, Hyuk;Lim, Ki-Won;Lee, Chang-Kwon;Kim, Bo-Kyung
    • The Korean Journal of Physiology and Pharmacology
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    • 제13권6호
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    • pp.491-496
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    • 2009
  • Skeletal muscle atrophy is a common phenomenon during the prolonged muscle disuse caused by cast immobilization, extended aging states, bed rest, space flight, or other factors. However, the cellular mechanisms of the atrophic process are poorly understood. In this study, we investigated the involvement of mitogen-activated protein kinase (MAPK) in the expression of muscle-specific RING finger 1 (MuRF1) during atrophy of the rat gastrocnemius muscle. Histological analysis revealed that cast immobilization induced the atrophy of the gastrocnemius muscle, with diminution of muscle weight and cross-sectional area after 14 days. Cast immobilization significantly elevated the expression of MuRF1 and the phosphorylation of p38 MAPK. The starvation of L6 rat skeletal myoblasts under serum-free conditions induced the phosphorylation of p38 MAPK and the characteristics typical of cast-immobilized gastrocnemius muscle. The expression of MuRF1 was also elevated in serum-starved L6 myoblasts, but was significantly attenuated by SB203580, an inhibitor of p38 MAPK. Changes in the sizes of L6 myoblasts in response to starvation were also reversed by their transfection with MuRF1 small interfering RNA or treatment with SB203580. From these results, we suggest that the expression of MuRF1 in cast-immobilized atrophy is regulated by p38 MAPK in rat gastrocnemius muscles.

ETRI 0.25μm GaN MMIC 공정 및 X-대역 전력증폭기 MMIC (ETRI 0.25μm GaN MMIC Process and X-Band Power Amplifier MMIC)

  • 이상흥;김성일;안호균;이종민;강동민;김동영;김해천;민병규;윤형섭;조규준;장유진;이기준;임종원
    • 한국전자파학회논문지
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    • 제28권1호
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    • pp.1-9
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    • 2017
  • 본 논문에서는 한국전자통신연구원(ETRI)에서 구축한 $0.25{\mu}m$ GaN MMIC 공정 및 소자특성을 소개하고, 이를 이용한 X-대역 3 W GaN 전력증폭기 MMIC 설계 제작 결과를 논의한다. X-대역 동작에 적합한 GaN HEMT 소자를 선정하여 GaN 전력증폭기 MMIC를 1단으로 설계하고 제작하였으며, 이를 통하여 ETRI $0.25{\mu}m$ GaN MMIC 공정 및 특성을 평가하고 분석하였다. X-대역 GaN 전력증폭기 MMIC 제작 결과, 출력전력 3.5 W, 이득 10 dB 및 전력부가효율 35 % 특성을 얻었다.

Conessine Treatment Reduces Dexamethasone-Induced Muscle Atrophy by Regulating MuRF1 and Atrogin-1 Expression

  • Kim, Hyunju;Jang, Minsu;Park, Rackhyun;Jo, Daum;Choi, Inho;Choe, Joonho;Oh, Won Keun;Park, Junsoo
    • Journal of Microbiology and Biotechnology
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    • 제28권4호
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    • pp.520-526
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    • 2018
  • Conessine, a steroidal alkaloid, is a potent histamine H3 antagonist with antimalarial activity. We recently reported that conessine treatment interferes with $H_2O_2$-induced cell death by regulating autophagy. However, the cellular signaling pathways involved in conessine treatment are not fully understood. Here, we report that conessine reduces muscle atrophy by interfering with the expression of atrophy-related ubiquitin ligases MuRF-1 and atrogin-1. Promoter reporter assay revealed that conessine treatment inhibits FoxO3a-dependent transcription, $NF-{\kappa}B$-dependent transcription, and p53-dependent transcription. We also showed by quantitative RT-PCR and western blot assays that conessine treatment reduced dexamethasone-induced expression of MuRF1 and atrogin-1. Finally, we demonstrated that conessine treatment reduced dexamethasone-induced muscle atrophy using differentiated C2C12 cells. These results collectively suggest that conessine is potentially useful in the treatment of muscle atrophy.

100GHz 이상의 밀리미터파 HEMT 소 제작 및 개발을 위한 GaAs기반 0.1$\mu\textrm{m}$ $\Gamma$-게이트MHEMT의 DC/RF 특성에 대한 calibration 연구 (A Study on the Calibration of GaAs-based 0.1-$\mu\textrm{m}$ $\Gamma$-gate MHEMT DC/RF Characteristics for the Development and Fabrication of over-100-GHz Millimeter-wave HEMT devices)

  • 손명식;이복형;이진구
    • 대한전자공학회:학술대회논문집
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    • 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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    • pp.751-754
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    • 2003
  • Metamorphic HEMTs (MHEMTs) have emerged as excellent challenges for the design and fabrication of high-speed HEMTs for millimeter-wave applications. Some of improvements result from improved mobility and larger conduction band discontinuity in the channel, leading to more efficient modulation doping, better confinement, and better device performance compared with pseudomorphic HEMTs. We have studied the calibration on the DC and RF characteristics of the MHEMT device using I $n_{0.53}$G $a_{0.47}$As/I $n_{0.52}$A1$_{0.48}$As modulation-doped heterostructure on the GaAs wafer. For the optimized device performance simulation, we calibrated the device performance of 0.1-${\mu}{\textrm}{m}$ $\Gamma$-gate MHEMT fabricated in our research center using the 2D ISE-DESSIS device simulator. With this calibrated parameter set, we have obtained very good reproducibility. The device simulation on the DC and RF characteristics exhibits good reproducibility for our 0.1-${\mu}{\textrm}{m}$ -gate MHEMT device compared with the measurements. We expect that our calibration result can help design over-100-GHz MHEMT devices for better device performance.ormance.

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높은 비저항을 갖는 RF 소자용 CoPdAlO 박막의 자기적 특성 (Magnetic Properties of High Electrical Resistive CoPdAlO Film for RF Device)

  • 김택수;이영우;김종오
    • 한국자기학회지
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    • 제11권3호
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    • pp.109-113
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    • 2001
  • Presently, an inductor adapted at MMIC (Monolithic Microwave Integrated Circuit) which is used for cellular phone or PHS operates at quasi-microwave range over 800 MHz. However, a W-CDMA (Wideband Code Division Multiple Access) will use about 2 GHz range. Therefore magnetic film device should be compatible up to 2 GHz. We have deposited Co-Pd-Al-O system film using rf sputtering method which is expected up to 2 GHz, and investigated the effect of Pd content and magnetic field annealing. When Pd composition is 19%, Hk was 118 Oe, and ${\mu}$′showed flat frequency characteristics up to 1.5 GHz. The Q factor (=${\mu}$′/${\mu}$") was 23.3 at 1 GHz, 6.7 at 1.5 GHz and 1.5 at 2 GHz, respectively. Resonance frequency was 2 GHz. Therefore Co-Pd-Al-O thin film could be used at over 1 GHz, and also expected as an inductor material for wide band CDMA type cellular phone.

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Au-Sn 공정 접합을 이용한 RF MEMS 소자의 Hermetic 웨이퍼 레벨 패키징 (Application of Au-Sn Eutectic Bonding in Hermetic Rf MEMS Wafer Level Packaging)

  • ;김운배;좌성훈;정규동;황준식;이문철;문창렬;송인상
    • 마이크로전자및패키징학회지
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    • 제12권3호
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    • pp.197-205
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    • 2005
  • RF MEMS 기술에서 패키지의 개발은 매우 중요하다. RF MEMS 패키지는 소형화, hermetic 특성, 높은 RF 성능 및 신뢰성을 갖도록 설계되어야 한다. 또한 가능한 저온의 패키징 공정이 가능해야 한다. 본 연구에서는 저온 공정을 이용한 RF MEMS 소자의 hermetic 웨이퍼 레벨 패키징을 제안하였다. Hermetic sealing을 위하여 약 $300{\times}C$의 Au-Sn 공정 접합 (eutectic bonding) 기술을 사용하였으며, Au-Sn의 조합으로 형성된 sealing부의 폭은 $70{\mu}m$이었다. 소자의 전기적 연결을 위하여 기판에 수직 via hole을 형성하고 전기도금 (electroplating) 방법을 이용하여 Cu로 채웠다. 완성된 RF MEMS 패키지의 최종 크기는 $1mm\times1mm\times700{\mu}m$이었다. 패키징 공정의 최적화 및 $O_2$ 플라즈마 애싱 공정을 통하여 접합 계면 및 via hole의 void들을 제거할 수 있었다. 또한 패키지의 전단 강도 및 hermeticity는 MIL-STD-883F의 규격을 만족하였으며 패키지 내부에서 오염 및 기타 유기 물질은 발생하지 않았다. 패키지의 삽입 손실은 2 GHz에서 0.075 dB로 매우 작았으며, 여러 종류의 신뢰성 시험 결과 패키지의 파손 및 성능의 감소는 발견되지 않았다.

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